LD173C102MAB4V_技术文档

Version 17.11

Ceramic Chip Capacitors

Table of Contents

MLCC Low Profile

General Specifications / Capacitance Range............................54

How to Order - AVX Part Number Explanation...........2-3

C0G (NP0) Dielectric

Automotive MLCC

General Specifications.........................................................55-56

Capacitance Range..............................................................57-59

General Specifications .................................................................4

Specifications and Test Methods.................................................5

Capacitance Range..................................................................6-7

U Dielectric

APS for COTS+ Applications

RF/Microwave C0G (NP0) Capaciators (RoHS)

General Information and Capacitance Range ....................8-10

RF/Microwave C0G (NP0) Capaciators (Sn/Pb)

General Information and Capacitance Range ..................11-12

RF/Microwave C0G (NP0) Capaciators (RoHS)

AEC-Q200 Qualified..........................................................13-14

Designer Kits ..............................................................................15

General Specifications ...............................................................60

Capacitance Range..............................................................61-63

MLCC with FLEXITERM^®

General Description....................................................................64

Specifications and Test Methods.........................................65-66

Capacitance Range..............................................................67-68

FLEXISAFE MLC Chips

General Specifications and Capacitance Range.......................69

X8R/X8L Dielectric

General Specifications.........................................................16-17

Specifications and Test Methods...............................................18

Capacitor Array

Capacitor Array (IPC) ...........................................................70-73

Automotive Capacitor Array (IPC)..............................................74

Part and Pad Layout Dimensions ..............................................75

X7R Dielectric

General Specifications ...............................................................19

Specifications and Test Methods...............................................20

Capacitance Range..............................................................21-22

Low Inductance Capacitors

Introduction ...................................................................76-77

LICC (Low Inductance Chip Capacitors) ..........................78-81

IDC (InterDigitated Capacitors)............................................82-85

LGA (Low Inductance Capacitors) ...................................86-88

X7S Dielectric

General Specifications ...............................................................23

Specifications and Test Methods...............................................24

Capacitance Range....................................................................25

High Temperature MLCCs

AT Series 200ºC & 250ºC Rated MLCCs ..........................89-94

X5R Dielectric

General Specifications ...............................................................26

Specifications and Test Methods...............................................27

Capacitance Range..............................................................28-29

High Voltage MLC Chips

600V to 5000V Applications ............................................95-99

Tin/Lead Termination “B” - 600V to 5000V Applications...100-101

FLEXITERM^®- 600V to 5000V Applications..................102-106

600V to 3000V Automotive Applications – AEC-Q200...107-108

Y5V Dielectric

General Specifications ...............................................................30

Specifications and Test Methods...............................................31

Capacitance Range....................................................................32

MIL-PRF-55681/Chips

CDR01 thru CDR06 .........................................................109-110

CDR31 thru CDR35 .........................................................111-114

MLCC Gold Termination (AU Series)

General Specifications ...............................................................33

Capacitance Range..............................................................34-39

MLCC Medical

MQ Series ........................................................................115-123

MM Series........................................................................124-128

MLCC Tin/Lead Termination (LD Series)

C0G (NP0) General Specifications.............................................40

Specifications and Test Methods ............................41

Capacitance Range ...........................................42-43

Packaging of Chip Components.....................................129

Embossed Carrier Configuration - 8 & 12mm Tape...130

Paper Carrier Configuration - 8 & 12mm Tape............131

X8R

X7R

X5R

General Specifications.............................................44

Specifications and Test Methods ............................45

Capacitance Range .................................................46

General Specifications.............................................47

Specifications and Test Methods ............................48

Capacitance Range ...........................................49-50

General Specifications.............................................51

Specifications and Test Methods ............................52

Capacitance Range .................................................53

Basic Capacitor Formulas................................................132

General Description...................................................133-137

Surface Mounting Guide...........................................138-142

How to Order

Part Number Explanation

Commercial Surface Mount Chips

EXAMPLE: 08055A101JAT2A

0805

5

A

101

J*

A

T

2

A**

Size

Voltage

Dielectric Capacitance Tolerance

Failure

Rate

A = N/A

Terminations

T = Plated Ni

and Sn

7 = Gold Plated

U = Conductive

Expoxy for

Packaging

Available

2 = 7" Reel

4 = 13" Reel

U = 4mm TR

(01005)

Special

Code

(L" x W") 4 = 4V

A = NP0(C0G)

C = X7R

2 Sig. Fig +

No. of Zeros

Examples:

B = .10 pF

C = .25 pF

D = .50 pF

F = 1ꢀ

0101*

0201

0402

0603

0805

1206

1210

1812

1825

2220

2225

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

D = 35V

5 = 50V

1 = 100V

2 = 200V

7 = 500V

A = Std

D = X5R

F = X8R

G = Y5V

4 = Automotive

K = 30K (0603 2mm pitch)

22K (0805/1206

<0.030"/ 0.76mm)

H = 18K (0603/0805/1206

<0.037” / 0.94mm)

J = 15K (0805/1206

<0.050” / 1.27mm)

1 = 12K (0805/1206

<0.055 / 1.4mm)

**Non std options upon

approval from the factory

100 = 10 pF

101 = 100 pF

(≥ 10 pF)

U = U Series 102 = 1000 pF

G = 2ꢀ

Hybrid

W = X6S

Z = X7S

223 = 22000 pF

224 = 220000 pF J = 5ꢀ

(≥ 10 pF)

Applications

Z = FLEXITERM^®

*X = FLEXITERM^®

with 5ꢀ min

lead (X7R &

Contact

Factory For

Multiples

105 = 1μF

106 = 10μF

107 = 100μF

For values below

10 pF, use “R”

in place of

K = 10ꢀ

M = 20ꢀ

Z = +80ꢀ,

-20ꢀ

P = +100ꢀ,

-0ꢀ

Contact Factory for

Special Voltages

F = 63V

* = 75V

E = 150V 8 = 400V

V = 250V

X8R only)

*EIA 01005

Contact

Factory For

1 = Pd/Ag Term

9 = 300V

X = 350V

Decimal point, e.g.,

9.1 pF = 9R1.

* B, C & D tolerance for ≤10 pF values.

Standard Tape and Reel material (Paper/Embossed) depends upon chip size and thickness.

See individual part tables for tape material type for each capacitance value.

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

For Tin/Lead Terminations, please refer to LD Series

High Voltage MLC Chips

EXAMPLE: 1808AA271KA11A

1808

A

271

K

A

T

2

A

AVX

Style

0805

1206

1210

1808

1812

1825

2220

2225

3640

Voltage

Temperature Capacitance Capacitance

Failure

Rate

Packaging/

Marking

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Standard

Termination

1= Pd/Ag

T = Plated Ni

and Sn

B = 5ꢀ Min Pb

Z = FLEXITERM^®

*X = FLEXITERM^®

with 5ꢀ min

C = 600V/630V Coefficient

Code

(2 significant digits

+ no. of zeros)

Examples:

10 pF = 100

100 pF = 101

Tolerance

C0G: J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

X7R: K = 10ꢀ

M = 20ꢀ

A = 1000V

S = 1500V

G = 2000V

W = 2500V

H = 3000V

J = 4000V

K = 5000V

A = C0G

C = X7R

A=Not

Applicable

1,000 pF = 102

22,000 pF = 223

220,000 pF = 224

1 μF = 105

Z = +80ꢀ,

-20ꢀ

lead (X7R only)

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

For Tin/Lead Terminations, please refer to LD Series

*

Not RoHS Compliant

For RoHS compliant products,

please select correct termination style.

REV 1

2

How to Order

Part Number Explanation

Capacitor Array

EXAMPLE: W2A43C103MAT2A

W

2

A

4

3

C

103

M

A

T

2A

Style

W = RoHS

L = SnPb

Case Array Number Voltage Dielectric Capacitance Capacitance

Failure

Termination

Packaging &

Quantity

Code

J = 5ꢀ A = Commercial T = Plated Ni and Sn

Size

of Caps

Code (In pF)

2 Sig Digits +

Number of

Zeros

Tolerance

Rate

Code

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

A = NP0

C = X7R

D = X5R

1 = 0405

2 = 0508

3 = 0612

Z = FLEXITERM^®

*B = 5ꢀ min lead

*X = FLEXITERM^®

with 5ꢀ min lead

2A = 7" Reel

(4000)

K = 10ꢀ 4 = Automotive

M = 20ꢀ

4A = 13" Reel

(10000)

2F = 7" Reel

(1000)

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

Low Inductance Capacitors (LICC)

EXAMPLE: 0612ZD105MAT2A

0612

Z

D

105

M

A

T

2

A

Size

0306

0508

0612

Voltage

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

Dielectric

C = X7R

D = X5R

Capacitance

Code (In pF)

2 Sig. Digits +

Number of Zeros

Capacitance

Tolerance

K = 10ꢀ

Failure Rate Terminations

Packaging

Available

2 = 7" Reel

4 = 13" Reel

Thickness

See Page 81

for Codes

A = N/A

T = Plated Ni

and Sn

M = 20ꢀ

*

B = 5ꢀ min

*LD16

*LD17

*LD18

lead

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

Interdigitated Capacitors (IDC)

EXAMPLE: W3L16D225MAT3A

225

M

W

3

L

1

6

D

A

T

3

A

Capacitance Capacitance

Style

W = RoHS

L = SnPb

Case

Size

Low

Number

of

Terminals

1 = 8 Terminals

Voltage Dielectric

Failure

Rate

A = N/A

Termination Packaging

Thickness

Max. Thickness

mm (in.)

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

Inductance

4 = 4V

C = X7R

D = X5R

T = Plated Ni

and Sn

Available

M = 20

2 = 0508 ESL = 50pH

3 = 0612 ESL = 60pH

6 = 6.3V

Z = 10V

Y = 16V

1=7" Reel

3=13" Reel A=0.95 (0.037)

S=0.55 (0.022)

*

B = 5ꢀ min

Lead

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

Low Inductance Decoupling Capacitor Arrays (LICA)

EXAMPLE: LICA3T183M3FC4AA

4

A

LICA

3

T

102

M

3

F

C

# of

Inspection

Code

Face

Style Voltage Dielectric Cap/Section Capacitance Height

Termination

Reel Packaging

Caps/Part

&

5V = 9 D = X5R

(EIA Code)

Tolerance

Code

*F = C4 Solder

M = 7" Reel

1 = one A = Standard

2 = two B = Established B = No Bar

4 = four

A = Bar

Size

10V = Z T = T55T 102 = 1000 pF M = 20ꢀ 6 = 0.500mm

25V = 3 S = High K 103 = 10 nF

T55T 104 = 100 nF

Balls- 97Pb/3Sn R = 13" Reel

P = GMV 3 = 0.650mm H = C4 Solder

1 = 0.875mm

6 = 2"x2" Waffle Pack

Reliability

Testing

C = Dot, S55S

Dielectrics

D = Triangle

Balls–Low ESR 8 = 2"x2" Black Waffle

5 = 1.100mm P = Cr-Cu-Au

7 = 1.600mm N = Cr-Ni-Au

X = None

Pack

*

Not RoHS Compliant

7 = 2"x2" Waffle Pack

w/ termination

facing up

A = 2"x2" Black Waffle

Pack

w/ termination

facing up

C = 4"x4" Waffle Pack

w/ clear lid

NOTE: Contact factory for

availability of Termination and

Tolerance Options for Specific

Part Numbers.

REV 1

3

C0G (NP0) Dielectric

General Specifications

C0G (NP0) is the most popular formulation of the

“temperature-compensating,” EIA Class I ceramic

materials. Modern C0G (NP0) formulations contain

neodymium, samarium and other rare earth oxides.

C0G (NP0) ceramics offer one of the most stable

capacitor dielectrics available. Capacitance change with

temperature is 0 ±±0ppmꢀ/C which is less than ±0.±ꢁ ⌬C

from -55/C to +125/C. Capacitance drift or hysteresis for

C0G (NP0) ceramics is negligible at less than ±0.05ꢁ

versus up to ±2ꢁ for films. Typical capacitance change

with life is less than ±0.1ꢁ for C0G (NP0), one-fifth that

shown by most other dielectrics. C0G (NP0) formulations

show no aging characteristics.

PART NUMBER (see page 2 for complete part number explanation)

0805

A

101

J

A

T

2

A

5

Size

Dielectric

Capacitance

Code (In pF)

2 Sig. Digits +

Capacitance

Tolerance

Failure

Rate

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

Special

Code

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

50V = 5

100V = 1

200V = 2

500V = 7

(L" x W")

C0G (NP0) = A

B

=

.10 ꢀp (ꢁ10ꢀp)

A = Not

4 = 13" Reel

U = 4mm TR

(01005)

A = Std.

Product

C = .25 ꢀp (ꢁ10ꢀp)

D = .50 ꢀp (ꢁ10ꢀp)

Aꢀꢀlicable

Number of Zeros

Contact

Factory For

p

=

1ꢂ (ꢃ 10 ꢀp)

G = 2ꢂ (ꢃ 10 ꢀp)

1 = Pd/Ag Term

7 = Gold Plated

NOT RoHS

J

=

5ꢂ

K

10ꢂ

Contact Factory

For Multiples

COMPLIANT

NOTE: Contact factory for availability of Termination and Tolerance Oꢀtions for Sꢀecific Part Numbers.

Contact factory for non-sꢀecified caꢀacitance values.

Insulation Resistance vs Temperature

10,000

1,000

100

0

40

60

80

100

0

20

Temperature °C

100917

4

C0G (NP0) Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

NP0 Specification Limits

Measuring Conditions

Temꢀerature Cycle Chamber

-55ºC to +125ºC

Within sꢀecified tolerance

ꢁ30 ꢀp: Qꢃ 400+20 x Caꢀ Value

ꢃ30 ꢀp: Qꢃ 1000

preq.: 1.0 MHz 10ꢂ for caꢀ ꢄ 1000 ꢀp

1.0 kHz 10ꢂ for caꢀ ꢅ 1000 ꢀp

Voltage: 1.0Vrms .2V

Q

100,000MΩ or 1000MΩ - µp,

whichever is less

Charge device with rated voltage for

60 5 secs ꢆ room temꢀꢇhumidity

Charge device with 250ꢂ of rated voltage for

1-5 seconds, wꢇcharge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Note: Charge device with 150ꢂ of rated

voltage for 500V devices.

Aꢀꢀearance

Caꢀacitance

No defects

5ꢂ or .5 ꢀp, whichever is greater

Deflection: 2mm

Test Time: 30 seconds

Resistance to

Flexure

Variation

Q

Meets Initial Values (As Above)

ꢃ Initial Value x 0.3

ꢃ 95ꢂ of each terminal should be covered

with fresh solder

No defects, ꢁ25ꢂ leaching of either end terminal

Stresses

Insulation

Resistance

Diꢀ device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Aꢀꢀearance

Caꢀacitance

Variation

ꢄ 2.5ꢂ or .25 ꢀp, whichever is greater

Diꢀ device in eutectic solder at 260ºC for 60

seconds. Store at room temꢀerature for 24

2

Resistance to

Solder Heat

Q

Meets Initial Values (As Above)

hours before measuring electrical ꢀroꢀerties.

Insulation

Resistance

Dielectric

Meets Initial Values (As Above)

No visual defects

ꢄ 2.5ꢂ or .25 ꢀp, whichever is greater

Strength

Aꢀꢀearance

Caꢀacitance

Variation

Steꢀ 1: -55ºC 2º

Steꢀ 2: Room Temꢀ

30 3 minutes

ꢄ 3 minutes

Thermal

Shock

Q

Meets Initial Values (As Above)

Steꢀ 3: +125ºC 2º

Steꢀ 4: Room Temꢀ

Reꢀeat for 5 cycles and measure after

24 hours at room temꢀerature

30 3 minutes

ꢄ 3 minutes

Insulation

Resistance

Dielectric

Meets Initial Values (As Above)

No visual defects

ꢄ 3.0ꢂ or .3 ꢀp, whichever is greater

Strength

Aꢀꢀearance

Caꢀacitance

Variation

Charge device with twice rated voltage in

test chamber set at 125ºC 2ºC

for 1000 hours (+48, -0).

ꢃ 30 ꢀp:

ꢃ10 ꢀp, ꢁ30 ꢀp:

ꢁ10 ꢀp:

Qꢃ 350

Qꢃ 275 +5Cꢇ2

Qꢃ 200 +10C

Q

Load Life

(C=Nominal Caꢀ)

Insulation

Resistance

Dielectric

Remove from test chamber and stabilize at

room temꢀerature for 24 hours

before measuring.

ꢃ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

No visual defects

ꢄ 5.0ꢂ or .5 ꢀp, whichever is greater

Strength

Aꢀꢀearance

Caꢀacitance

Variation

Store in a test chamber set at 85ºC 2ºCꢇ

85ꢂ 5ꢂ relative humidity for 1000 hours

(+48, -0) with rated voltage aꢀꢀlied.

ꢃ 30 ꢀp:

ꢃ10 ꢀp, ꢁ30 ꢀp:

ꢁ10 ꢀp:

Qꢃ 350

Qꢃ 275 +5Cꢇ2

Qꢃ 200 +10C

Load

Q

Humidity

Insulation

Resistance

Dielectric

Strength

Remove from chamber and stabilize at

room temꢀerature for 24 2 hours

before measuring.

ꢃ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

100917

5

C0G (NP0) Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

Soldering

Packaging

(L) Length

(W) Width

0101*

0201

0402

ReflowꢀWave

0603

ReflowꢀWave

0805

ReflowꢀWave

1206

ReflowꢀWave

Reflow Only Reflow Only

All Paper

PaperꢀEmbossed

mm

0.40 0.02

0.60 0.09

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(in.)

(0.016 0.0008)

(0.024 0.004)

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

0.20 0.02

0.30 0.09

0.50 0.10

0.81 0.15

1.25 0.20

1.60 0.20

(in.)

(0.008 0.0008)

(0.011 0.004)

(0.020 0.004)

(0.032 0.006)

(0.049 0.008)

(0.063 0.008)

mm

(in.)

0.10 0.04

0.15 0.05

0.25 0.15

0.35 0.15

0.50 0.25

(t) Terminal

(0.004 0.0016)

(0.006 0.002)

(0.010 0.006)

(0.014 0.006)

(0.020 0.010)

WVDC

16

25

A

50

16

C

25

C

50

16

G

25

G

50

G

100

200

16

J

N

P

25

J

N

P

50

J

N

P

100

J

200

J

16

J

M

P

25

J

M

P

50

100

200

J

500

J

Caꢀ

(ꢀp)

0.5

C

G

J

1.0

B

J

1.2

J

1.5

A

J

1.8

J

2.2

J

2.7

J

3.3

J

3.9

J

4.7

J

5.6

J

6.8

J

8.2

J

10

G

J

12

J

15

J

18

J

22

J

27

J

33

J

39

J

47

J

56

J

68

J

82

J

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.068

0.082

0.1

J

M

P

J

M

Q

J

M

P

N

M

P

Caꢀ

(µp)

WVDC

SIZE

16

0101*

50

16

25

0402

50

16

25

50

0603

100

200

16

25

50

0805

100

200

16

25

100

⁵⁰1206

200

500

²⁵0201

Letter

Max.

A

B

C

E

G

J

K

M

N

P

Q

X

Y

Z

0.±±

0.22

0.56

0.71

(0.028)

0.90

0.94

1.02

1.27

1.40

1.52

1.78

2.29

2.54

2.79

Thickness (0.01±)

(0.009)

(0.022)

(0.0±5)

(0.0±7)

(0.040)

(0.050)

(0.055)

(0.060)

(0.070)

(0.090)

(0.100)

(0.110)

PAPER

EMBOSSED

PAPER and EMBOSSED available for 01005

100917

6

C0G (NP0) Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

Soldering

Packaging

1210

Reflow Only

1812

Reflow Only

1825

Reflow Only

2220

Reflow Only

2225

Reflow Only

PaperꢀEmbossed

All Embossed

mm

(in.)

3.20 0.20

4.50 0.30

5.70 0.40

5.72 0.25

(L) Length

(0.126 0.008)

(0.177 0.012)

(0.225 0.016)

(0.225 0.010)

mm

2.50 0.20

3.20 0.20

6.40 0.40

5.00 0.40

6.35 0.25

(W) Width

(in.)

mm

(in.)

(0.098 0.008)

(0.126 0.008)

(0.252 0.016)

(0.197 0.016)

(0.250 0.010)

0.50 0.25

0.61 0.36

0.64 0.39

(t) Terminal

(0.020 0.010)

(0.024 0.014)

(0.025 0.015)

WVDC

25

50

100

200

500

25

50

100

200

500

50

100

200

50

100

200

50

100

200

Caꢀ

(ꢀp)

0.5

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

J

12

15

J

18

J

22

J

27

J

33

J

39

J

47

J

56

J

68

J

82

J

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

J

M

P

N

J

K

P

J

P

K

P

Q

X

K

M

P

Q

X

N

P

Q

X

N

P

Q

M

P

M

X

M

X

M

X

Y

M

P

M

Y

P

Y

P

N

P

N

Q

Y

X

Y

X

Y

Caꢀ

(µp)

Y

X

Y

X

Y

X

Z

0.068

0.082

0.1

Z

Y

Z

X

Z

WVDC

25

50

100

200

500

25

50

100

200

500

50

100

200

50

100

200

50

100

200

SIZE

1210

1812

1825

2220

2225

Letter

Max.

A

B

C

E

G

J

K

M

N

P

Q

X

Y

Z

0.±±

0.22

0.56

0.71

0.90

0.94

(0.0±7)

1.02

1.27

1.40

1.52

1.78

2.29

2.54

(0.100)

2.79

Thickness (0.01±)

(0.009)

(0.022)

(0.028)

(0.0±5)

(0.040)

(0.050)

(0.055)

(0.060)

(0.070)

(0.090)

(0.110)

PAPER

EMBOSSED

100917

7

RF/Microwave C0G (NP0)

Capacitors (RoHS)

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

GENERAL INFORMATION

“U” Series capacitors are C0G (NP0) chip capacitors spe-

cially designed for “Ultra” low ESR for applications in the

communications market. Max ESR and effective capacitance

are met on each value producing lot to lot uniformity.

Sizes available are EIA chip sizes 0402, 0603, 0805, and

1210.

DIMENSIONS: inches (millimeters)

0402

0603

0805

1210

inches (mm)

E

N/A

Size

0402

0603

0805

1210

A

B

C

D

N/A

0.039 0.004 (1.00 0.1)

0.060 0.010 (1.52 0.25) 0.030 0.010 (0.76 0.25)

0.079 0.008 (2.01 0.2)

0.126 0.008 (3.2 0.2)

0.020 0.004 (0.50 0.1)

0.022 (0.55mm) max

0.036 (0.91mm) max

0.040 0.005 (1.02 0.127) 0.020 0.010 (0.51 0.255)

0.010 0.005 (0.25 0.13)

0.030 (0.76) min

0.020 (0.51) min

0.049 0.008 (1.25 0.2)

0.098 0.008 (2.49 0.2)

0.050 0.005 (1.27 0.127) 0.025 0.015 (0.635 0.381) 0.040 (1.02) min

HOW TO ORDER

0805

1

U

100

J

A

T

2

A

Case Size

0402

0603

0805

1210

Dielectric =

Capacitance

Termination

T= Plated Ni and

Sn

Special Code

A = Standard

Ultra Low ESR

Tolerance Code

B = 0.1pF

C = 0.25pF

D = 0.5pF

F = 1ꢀ

G = 2ꢀ

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

Voltage Code

3 = 25V

5 = 50V

1 = 100V

2 = 200V

Failure Rate

Code

A = Not Applicable

Packaging

Code

2 = 7" Reel

4 = 13" Reel

Capacitance

EIA Capacitance Code in pF.

First two digits = significant figures or “R” for

decimal place.

Third digit = number of zeros or after “R” sig-

nificant figures.

NOTE: Contact factory for availability of Termination and Toler-

ance Options for Specific Part Numbers.

ELECTRICAL CHARACTERISTICS

Dielectric Working Voltage (DWV):

Capacitance Values and Tolerances:

Size 0402 - 0.2 pF to 30 pF @ 1 MHz

Size 0603 - 1.0 pF to 100 pF @ 1 MHz

Size 0805 - 1.6 pF to 160 pF @ 1 MHz

Size 1210 - 2.4 pF to 1000 pF @ 1 MHz

250ꢀ of rated WVDC

Equivalent Series Resistance Typical (ESR):

0402 - See Performance Curve, page 9

0603 - See Performance Curve, page 9

0805 - See Performance Curve, page 9

1210 - See Performance Curve, page 9

Temperature Coefficient of Capacitance (TC):

0 30 ppm/ꢁC (-55ꢁ to +125ꢁC)

Marking: Laser marking EIA J marking standard

(except 0603) (capacitance code and

tolerance upon request).

Insulation Resistance (IR):

10¹²Ω min. @ 25ꢁC and rated WVDC

10¹¹Ω min. @ 125ꢁC and rated WVDC

Working Voltage (WVDC):

MILITARY SPECIFICATIONS

Size

Working Voltage

Meets or exceeds the requirements of MIL-C-55681

0402 - 100, 50, 25 WVDC

0603 - 200, 100, 50 WVDC

0805 - 200, 100 WVDC

1210 - 200, 100 WVDC

120216

8

RF/Microwave C0G (NP0)

Capacitors (RoHS)

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

CAPACITANCE RANGE

Size

Cap (pF) Tolerance 0402 0603 0805 1210

Size

Cap (pF) Tolerance 0402 0603 0805 1210

Size

Cap (pF) Tolerance 0402 0603 0805 1210

Size

Cap (pF) Tolerance 0402 0603 0805 1210

Available

7.5

8.2

9.1

10

11

12

13

15

18

20

22

24

27

30

33

36

39

43

47

51

56

68

75

82

91

B,C,J,K,M 100V 200V 200V 200V

100

110

F,G,J,K,M N/A 100V 200V 200V

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

B,C

100V N/A N/A N/A

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

B,C,D

100V 200V 200V 200V

᭡

50V

᭡

B,C,J,K,M

120

50V

F,G,J,K,M 100V

50V

130

N/A 200V

B,C

B,C,D

140

100V

᭡

150

᭡

160

100V

N/A

᭡

180

B,C,D

200V

100V

200

220

270

300

᭡

330

50V

N/A

360

᭡

390

430

200V

100V

470

510

560

620

680

750

᭡

820

᭡

910

B,C,D

B,C,J,K,M

᭡

1000 F,G,J,K,M

ULTRA LOW ESR, “U” SERIES

ESR Measured on the Boonton 34A

120216

9

RF/Microwave C0G (NP0) Capacitors

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

120216

10

RF/Microwave C0G (NP0)

Capacitors (Sn/Pb)

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

GENERAL INFORMATION

“U” Series capacitors are C0G (NP0) chip capacitors specially

designed for “Ultra” low ESR for applications in the commu-

nications market. Max ESR and effective capacitance

are met on each value producing lot to lot uniformity.

Sizes available are EIA chip sizes 0402, 0603, 0805, and

1210.

DIMENSIONS: inches (millimeters)

0402

0603

0805

1210

A

E

A

E

C

B

C

B

C

D

E

inches (mm)

Size

0402

0603

0805

1210

A

B

C

D

N/A

E

N/A

0.039 0.004 (1.00 0.1)

0.060 0.010 (1.52 0.25) 0.030 0.010 (0.76 0.25)

0.079 0.008 (2.01 0.2)

0.126 0.008 (3.2 0.2)

0.020 0.004 (0.50 0.1)

0.022 (0.55mm) max

0.036 (0.91mm) max

0.040 0.005 (1.02 0.127) 0.020 0.010 (0.51 0.254)

0.050 0.005 (1.27 0.127) 0.025 0.015 (0.635 0.381) 0.040 (1.02) min

0.010 0.005 (0.25 0.13)

0.030 (0.76) min

0.020 (0.51) min

0.049 0.008 (1.25 0.2)

0.098 0.008 (2.49 0.2)

HOW TO ORDER

LD05

1

U

100

J

A

B

2

A

Case Size

LD02 = 0402

LD03 = 0603

LD05 = 0805

LD10 = 1210

Dielectric =

Ultra Low

ESR

Capacitance

Tolerance

Code

B = 0.1pF

C = 0.25pF

D = 0.5pF

F = 1ꢀ

Termination

*B = 5ꢀ min lead

Special Code

A = Standard

G = 2ꢀ

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

Voltage Code

3 = 25V

5 = 50V

1 = 100V

2 = 200V

Failure Rate

Code

A = Not Applica-

ble

Packaging

Code

2 = 7" Reel

4 = 13" Reel

Capacitance

EIA Capacitance Code in pF.

First two digits = significant figures

or “R” for decimal place.

Third digit = number of zeros or after

“R” significant figures.

*

Not RoHS Compliant

ELECTRICAL CHARACTERISTICS

Capacitance Values and Tolerances:

Size 0402 - 0.2 pF to 22 pF @ 1 MHz

Size 0603 - 1.0 pF to 100 pF @ 1 MHz

Size 0805 - 1.6 pF to 160 pF @ 1 MHz

Size 1210 - 2.4 pF to 1000 pF @ 1 MHz

Dielectric Working Voltage (DWV):

250ꢀ of rated WVDC

Equivalent Series Resistance Typical (ESR):

Temperature Coefficient of Capacitance (TC):

0402

0603

0805

1210

-

See Performance Curve, page 12

0 30 ppm/ꢁC (-55ꢁ to +125ꢁC)

Insulation Resistance (IR):

10¹²Ω min. @ 25ꢁC and rated WVDC

10¹¹Ω min. @ 125ꢁC and rated WVDC

Marking: Laser marking EIA J marking standard

(except 0603) (capacitance code and

tolerance upon request).

Working Voltage (WVDC):

Size

Working Voltage

50, 25 WVDC

200, 100, 50 WVDC

200, 100 WVDC

0402

0603

0805

1210

-

MILITARY SPECIFICATIONS

Meets or exceeds the requirements of MIL-C-55681

REV 1

11

RF/Microwave C0G (NP0)

Capacitors (Sn/Pb)

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

CAPACITANCE RANGE

Size

Cap (pF) Tolerance LD02 LD03 LD05 LD10

Size

Cap (pF) Tolerance LD02 LD03 LD05 LD10

Size

Cap (pF) Tolerance LD02 LD03 LD05 LD10

Available

Cap (pF) Tolerance LD02 LD03 LD05 LD10

7.5

8.2

9.1

10

11

12

13

15

18

20

22

24

27

30

33

36

39

43

47

51

56

68

75

82

91

B,C,J,K,M 50V 200V 200V 200V

100

110

120

130

140

150

160

180

200

220

270

300

330

360

390

430

470

510

560

620

680

750

820

910

F,G,J,K,M N/A 100V 200V 200V

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

B,C

50V N/A N/A N/A

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

B,C,D

50V 200V 200V 200V

᭡

50V

᭡

B,C,J,K,M

F,G,J,K,M

50V

N/A 200V

B,C

B,C,D

100V

᭡

100V

N/A

᭡

B,C,D

200V

100V

᭡

50V

N/A

᭡

200V

100V

᭡

B,C,D

B,C,J,K,M

᭡

᭡ ᭡

᭡

1000 F,G,J,K,M

ULTRA LOW ESR, “U” SERIES

TYPICAL ESR vs. FREQUENCY

0402 “U” SERIES

TYPICAL ESR vs. FREQUENCY

0603 “U” SERIES

1

10 pF

15 pF

3.3 pF

3.9 pF

4.7 pF

5.1 pF

6.8 pF

10.0 pF

15.0 pF

0.1

0.01

2500

0

500

1000

Frequency (MHz)

2000

500

1000

Frequency (MHz)

2000

1500

TYPICAL ESR vs. FREQUENCY

1210 “U” SERIES

TYPICAL ESR vs. FREQUENCY

0805 “U” SERIES

1

100 pF

10.0 pF

10 pF

100 pF

0.1

300 pF

0.01

2500

0

500

1000

2000

500

1000

Frequency (MHz)

2000

1500

Frequency (MHz)

ESR Measured on the Boonton 34A

REV 1

12

RF/Microwave Automotive C0G (NP0)

Capacitors (RoHS), AEC Q200 Qualified

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

GENERAL INFORMATION

DIMENSIONS: mm (inches)

Automotive “U” Series capacitors are C0G (NP0) chip capacitors

specially designed for “Ultra” low ESR for applications in the

automotive market. Max ESR and effective capacitance are met on

each value producing lot to lot uniformity. Sizes available are EIA

chip sizes 0402 and 0603.

0402

0603

Size

A

B

C

D

E

1.00 0.1

0.50 0.1

0.60 max

(0.024)

0.91 max

(0.036)

0402

N/A

(0.039 0.004)

1.52 0.25

(0.060 0.010)

(0.020 0.004)

0.76 0.25

(0.030 0.010)

0.25 0.13

(0.010 0.005)

0.76 min

(0.030)

0603

HOW TO ORDER

0402

1

U

100

J

4

T

2

A

Case Size

0402

0603

Dielectric =

Capacitance

Termination

T= Plated Ni and Sn

Special Code

A = Standard

Ultra Low ESR

Tolerance Code

B = 0.1pF

C = 0.25pF

D = 0.5pF

F = 1ꢀ

G = 2ꢀ

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

Voltage Code

5 = 50V

Failure Rate

Code

4 = Automotive

Packaging

Code

2 = 7" Reel

4 = 13" Reel

1 = 100V

Capacitance

EIA Capacitance Code in pF.

2 = 200V

First two digits = significant figures

or “R” for decimal place.

Third digit = number of zeros or

after “R” significant figures.

ELECTRICAL CHARACTERISTICS

Capacitance Values and Tolerances:

Size 0402 - 0.2 pF to 22 pF @ 1 MHz

Size 0603 - 1.0 pF to 100 pF @ 1 MHz

Dielectric Working Voltage (DWV):

250ꢀ of rated WVDC

Equivalent Series Resistance Typical (ESR):

0402 - See Performance Curve

0603 - See Performance Curve

Temperature Coefficient of Capacitance (TC):

0 30 ppm/ꢁC (-55ꢁ to +125ꢁC)

Insulation Resistance (IR):

Automotive Specifications

Meets or exceeds the requirements of AEC Q200

10¹²Ω min. @ 25ꢁC and rated WVDC

10¹¹Ω min. @ 125ꢁC and rated WVDC

Working Voltage (WVDC):

Size

Working Voltage

0402 - 50, 25 WVDC

0603 - 200, 100, 50 WVDC

REV 1

13

RF/Microwave Automotive C0G (NP0)

Capacitors (RoHS), AEC Q200 Qualified

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

CAPACITANCE RANGE

Size

Cap (pF) Tolerance 0402 0603

Size

Cap (pF) Tolerance 0402 0603

Size

Cap (pF) Tolerance 0402 0603

Available

Cap (pF) Tolerance 0402 0603

Available

7.5

8.2

9.1

10

11

12

13

15

18

20

22

24

27

30

33

36

39

43

47

51

56

68

75

82

91

B,C,J,K,M 50V 200V

100

110

F,G,J,K,M N/A 100V

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

B,C

50V N/A

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

B,C,D

50V 200V

᭡

50V

N/A

᭡

B,C,J,K,M

F,G,J,K,M

120

130

B,C

B,C,D

140

150

᭡

160

᭡

180

B,C,D

200V

100V

200

220

270

300

᭡

330

50V

N/A

360

390

430

470

510

560

620

680

750

᭡

820

᭡

910

B,C,D

B,C,J,K,M

᭡

1000 F,G,J,K,M

ULTRA LOW ESR, “U” SERIES

TYPICAL ESR vs. FREQUENCY

0402 “U” SERIES

TYPICAL ESR vs. FREQUENCY

0603 “U” SERIES

TYPICAL SERIES RESONANT FREQUENCY

“U” SERIES CHIP

10

0402

0603

1.0

0.1

1000

1.0

10

100

Capacitance (pF)

REV 1

14

Designer Kits

Communication Kits “U” Series

“U” SERIES KITS

0402

Kit 5000 UZ

Cap.

0603

Kit 4000 UZ

Cap.

Value Tolerance Value Tolerance

pF

0.5

1.0

1.5

1.8

2.2

2.4

3.0

3.6

4.7

5.6

6.8

1.0

1.2

1.5

1.8

2.0

2.4

2.7

3.0

3.3

3.9

4.7

5.6

6.8

7.5

8.2

B ( 0.1pF)

J ( 5ꢀ)

8.2

10.0

12.0

15.0

18.0

22.0

27.0

33.0

39.0

47.0

B ( 0.1pF)

10.0

12.0

15.0

B ( 0.1pF)

J ( 5ꢀ)

***25 each of 15 values

***25 each of 24 values

0805

Kit 3000 UZ

1210

Kit 3500 UZ

Cap.

Value Tolerance Value Tolerance

pF

1.0

1.5

2.2

2.4

2.7

3.0

3.3

3.9

4.7

5.6

7.5

8.2

9.1

10.0

12.0

15.0

18.0

22.0

24.0

27.0

33.0

2.2

2.7

4.7

5.1

6.8

8.2

9.1

10.0

13.0

15.0

18.0

20.0

24.0

27.0

30.0

36.0

39.0

47.0

B ( 0.1pF) 51.0

56.0

68.0

82.0

100.0

120.0

B ( 0.1pF) 36.0

39.0

47.0

56.0

68.0

82.0

J ( 5ꢀ)

130.0

240.0

J ( 5ꢀ)

300.0

100.0

130.0

390.0

470.0

680.0

J ( 5ꢀ)

160.0

***25 each of 30 values

REV 1

15

X8R/X8L Dielectric

General Specifications

AVX has develoꢀed a range of multilayer ceramic caꢀacitors designed for use in aꢀꢀlications uꢀ to 150ºC. These caꢀacitors

are manufactured with an X8R and an X8L dielectric material. X8R material has caꢀacitance variation of 15ꢂ between -

55ºC and +150ºC. The X8L material has caꢀacitance variation of 15ꢂ between -55ºC to 125ºC and +15ꢇ-40ꢂ from +125ºC

to +150ºC.

The need for X8R and X8L ꢀerformance has been driven by customer requirements for ꢀarts that oꢀerate at elevated

temꢀeratures. They ꢀrovide a highly reliable caꢀacitor with low loss and stable caꢀacitance over temꢀerature.

They are ideal for automotive under the hood sensors, and various industrial aꢀꢀlications. Tyꢀical industrial aꢀꢀlication would

be drilling monitoring system. They can also be used as bulk caꢀacitors for high temꢀerature camera modules.

Both X8R and X8L dielectric caꢀacitors are automotive AEC-Q200 qualified. Oꢀtional termination systems, tin, pLEXITERM^®and

conductive eꢀoxy for hybrid aꢀꢀlications are available. Providing this series with our pLEXITERM^®termination

system ꢀrovides further advantage to customers by way of enhanced resistance to both, temꢀerature cycling and

mechanical damage.

PART NUMBER (see page 2 for complete part number explanation)

0805

5

F

104

K

4

T

2

A

Size

0603

0805

1206

Voltage

16V = Y

25V = 3

50V = 5

100V = 1

Dielectric

X8R = p

Capacitance Capacitance

Failure

Rate

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

Special

Code

Code (In pF)

2 Sig. Digits +

Tolerance

J = 5ꢂ

X8L = L

4 = Automotive

A = Not

4 = 13" Reel

A = Std.

Product

K = 10ꢂ

M = 20ꢂ

Z = pLEXITERM^®

Number of Zeros

e.g. 10µp = 106

Aꢀꢀlicable

NOTE: Contact factory for availability of Termination and Tolerance Oꢀtions for Sꢀecific Part Numbers.

X8R

X8L

SIZE

Soldering

WVDC

0603

0805

1206

SIZE

Soldering

WVDC

0603

0805

1206

1210

ReflowꢇWave

25V

G

50V

G

25V

J

50V

J

25V

50V

25V

G

50V

G

100V

25V

50V

100V

16V

25V

50V

100V

10V

50V

100V

331

Caꢀ

(ꢀp)

330

470

271

Caꢀ

(ꢀp)

270

471

681

102

152

222

332

472

682

103

153

223

333

473

683

104

154

224

334

474

684

105

155

225

J

331

471

681

102

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

684

824

105

155

225

475

106

330

470

G

J

N

J

680

J

1000

1500

2200

3300

4700

6800

0.01

J

680

J

1000

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.01

J

M

P

J

Caꢀ

J

(µp) 0.015

0.022

0.033

0.047

0.068

0.1

J

N

M

J

Caꢀ

J

0.15

(µp) 0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.056

0.068

0.082

0.1

J

0.22

J

0.33

J

0.47

J

0.68

J

1

J

N

J

1.5

J

2.2

J

WVDC

25V

50V

25V

50V

25V

50V

J

SIZE

0603

0805

1206

J

M

Q

0.12

J

0.15

J

0.18

N

J

0.22

J

0.27

J

M

0.33

J

0.39

M

0.47

0.68

0.82

1

1.5

2.2

Z

WVDC

25V

50V

100V

25V

50V

100V

16V

25V

50V

100V

10V

50V

100V

SIZE

0603

0805

1206

1210

= AEC-Q200

Qualified

Letter

A

C

E

G

J

K

M

N

P

Q

X

Y

Z

Max.

0.±±

0.56

0.71

0.90

0.94

1.02

1.27

1.40

1.52

1.78

2.29

(0.090)

2.54

(0.100)

2.79

Thickness (0.01±)

(0.022)

(0.028)

(0.0±5)

(0.0±7)

(0.040)

(0.050)

(0.055)

(0.060)

(0.070)

(0.110)

PAPER

EMBOSSED

100917

16

X8R/X8L Dielectric

General Specifications

APPLICATIONS FOR X8R AND X8L CAPACITORS

• All market sectors with a 150°C requirement

• Automotive on engine aꢀꢀlications

• Oil exꢀloration aꢀꢀlications

• Hybrid automotive aꢀꢀlications

– Battery control

– Inverter ꢇ converter circuits

– Motor control aꢀꢀlications

– Water ꢀumꢀ

• Hybrid commercial aꢀꢀlications

– Emergency circuits

– Sensors

– Temꢀerature regulation

ADVANTAGES OF X8R AND X8L MLC CAPACITORS

• Both ranges are qualified to the highest automotive

AEC-Q200 standards

• Excellent reliability comꢀared to other caꢀacitor

technologies

• RoHS comꢀliant

• Low ESR ꢇ ESL comꢀared to other technologies

• Tin solder finish

• pLEXITERM^®available

• Eꢀoxy termination for hybrid available

• 100V range available

ENGINEERING TOOLS FOR HIGH VOLTAGE MLC CAPACITORS

• Samꢀles

• Technical Articles

• Aꢀꢀlication Engineering

• Aꢀꢀlication Suꢀꢀort

X8R/X8L Dielectric

0805, 50V, X8R/X8L Typical Temperature Coefficient

10.00

X8R

0.00

-10.00

X8L

-20.00

-30.00

-40.00

-50.00

-55 -35 -15

0

20 25 35 45 65 85 105 125 130 135 140 150

Temperature (°C)

100917

17

X8R/X8L Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X8R/X8L Specification Limits

Measuring Conditions

Temꢀerature Cycle Chamber

preq.: 1.0 kHz 10ꢂ

-55ºC to +150ºC

Within sꢀecified tolerance

ꢄ 2.5ꢂ for ꢃ 50V DC rating

ꢄ 3.5ꢂ for 25V DC and 16V DC rating

100,000MΩ or 1000MΩ - µp,

whichever is less

Voltage: 1.0Vrms .2V

Dissipation Factor

Charge device with rated voltage for

120 5 secs ꢆ room temꢀꢇhumidity

Charge device with 250ꢂ of rated voltage for

1-5 seconds, wꢇcharge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Note: Charge device with 150ꢂ of rated

voltage for 500V devices.

Aꢀꢀearance

Caꢀacitance

No defects

ꢄ 12ꢂ

Deflection: 2mm

Test Time: 30 seconds

Resistance to

Flexure

Variation

Dissiꢀation

pactor

Meets Initial Values (As Above)

ꢃ Initial Value x 0.3

ꢃ 95ꢂ of each terminal should be covered

with fresh solder

No defects, ꢁ25ꢂ leaching of either end terminal

Stresses

Insulation

Resistance

Diꢀ device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Aꢀꢀearance

Caꢀacitance

Variation

ꢄ 7.5ꢂ

Diꢀ device in eutectic solder at 260ºC for 60

Dissiꢀation

pactor

seconds. Store at room temꢀerature for 24

2

Resistance to

Solder Heat

Meets Initial Values (As Above)

hours before measuring electrical ꢀroꢀerties.

Insulation

Resistance

Dielectric

Strength

Meets Initial Values (As Above)

No visual defects

Aꢀꢀearance

Caꢀacitance

Variation

Steꢀ 1: -55ºC 2º

Steꢀ 2: Room Temꢀ

30 3 minutes

ꢄ 3 minutes

ꢄ 7.5ꢂ

Dissiꢀation

pactor

Thermal

Shock

Meets Initial Values (As Above)

Steꢀ 3: +125ºC 2º

Steꢀ 4: Room Temꢀ

30 3 minutes

ꢄ 3 minutes

Insulation

Resistance

Dielectric

Strength

Reꢀeat for 5 cycles and measure after

24 2 hours at room temꢀerature

Meets Initial Values (As Above)

No visual defects

Aꢀꢀearance

Caꢀacitance

Variation

Charge device with 1.5 rated voltage (ꢄ 10V) in

test chamber set at 150ºC 2ºC

for 1000 hours (+48, -0)

ꢄ 12.5ꢂ

Dissiꢀation

pactor

ꢄ Initial Value x 2.0 (See Above)

ꢃ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temꢀerature for 24 2 hours

before measuring.

Insulation

Resistance

Dielectric

Strength

Meets Initial Values (As Above)

No visual defects

Aꢀꢀearance

Caꢀacitance

Variation

Store in a test chamber set at 85ºC 2ºCꢇ

85ꢂ 5ꢂ relative humidity for 1000 hours

(+48, -0) with rated voltage aꢀꢀlied.

ꢄ 12.5ꢂ

Load

Dissiꢀation

pactor

ꢄ Initial Value x 2.0 (See Above)

ꢃ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Humidity

Remove from chamber and stabilize at

room temꢀerature and humidity for

24 2 hours before measuring.

Insulation

Resistance

Dielectric

Strength

100917

18

X7R Dielectric

General Specifications

X7R formulations are called “temꢀerature stable” ceramics and fall into EIA

Class II materials. X7R is the most ꢀoꢀular of these intermediate dielectric

constant materials. Its temꢀerature variation of caꢀacitance is within 15ꢂ

from -55°C to +125°C. This caꢀacitance change is non-linear.

Caꢀacitance for X7R varies under the influence of electrical oꢀerating con-

ditions such as voltage and frequency.

X7R dielectric chiꢀ usage covers the broad sꢀectrum of industrial

aꢀꢀlications where known changes in caꢀacitance due to aꢀꢀlied voltages

are acceꢀtable.

PART NUMBER (see page 2 for complete part number explanation)

0805

5

C

103

M

A

T

2

A

Size

Voltage

4V = 4

Dielectric

Capacitance

Code (In pF)

2 Sig. Digits + Num-

ber of Zeros

Capacitance

Tolerance

J = 5ꢂ%

Failure

Rate

Terminations

Packaging

2 = 7" Reel

Special

Code

(L" x W")

X7R = C

T = Plated Ni

6.3V = 6

10V = Z

16V = Y

25V = 3

50V = 5

100V = 1

200V = 2

500V = 7

A = Not

4 = 13" Reel

A = Std. Product

and Sn

K = 10ꢂ

Aꢀꢀlicable

7 = Gold Plated%

M = 20ꢂ

Z= pLEXITERM^®%%

Contact

Factory For

Multiples

%ꢄ1µp only,

contact factory for addi-

tional values

%Oꢀtional termination

%%See pLEXITERM^®

X7R section

NOTE: Contact factory for availability of Termination and Tolerance Oꢀtions for Sꢀecific Part Numbers.

Contact factory for non-sꢀecified caꢀacitance values.

100917

19

X7R Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X7R Specification Limits

Measuring Conditions

-55ºC to +125ºC

Temꢀerature Cycle Chamber

Within sꢀecified tolerance

ꢄ 10ꢂ for ꢃ 50V DC rating

preq.: 1.0 kHz 10ꢂ

Voltage: 1.0Vrms .2V

por Caꢀ ꢅ 10µp, 05Vrm ꢆ 120Hz

ꢄ 12.5ꢂ for 25V DC rating

ꢄ 12.5ꢂ for 25V and 16V DC rating

ꢄ 12.5ꢂ for ꢄ 10V DC rating

100,000MΩ or 1000MΩ - µp,

whichever is less

Dissipation Factor

Charge device with rated voltage for

120 5 secs ꢆ room temꢀꢇhumidity

Charge device with 250ꢂ of rated voltage for

1-5 seconds, wꢇcharge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Note: Charge device with 150ꢂ of rated

voltage for 500V devices.

Aꢀꢀearance

Caꢀacitance

No defects

ꢄ 12ꢂ

Deflection: 2mm

Test Time: 30 seconds

Resistance to

Flexure

Variation

Dissiꢀation

pactor

Meets Initial Values (As Above)

ꢃ Initial Value x 0.3

ꢃ 95ꢂ of each terminal should be covered

with fresh solder

No defects, ꢁ25ꢂ leaching of either end terminal

Stresses

Insulation

Resistance

Diꢀ device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Aꢀꢀearance

Caꢀacitance

Variation

ꢄ 7.5ꢂ

Diꢀ device in eutectic solder at 260ºC for 60

Dissiꢀation

pactor

seconds. Store at room temꢀerature for 24

2

Resistance to

Solder Heat

Meets Initial Values (As Above)

hours before measuring electrical ꢀroꢀerties.

Insulation

Resistance

Dielectric

Strength

Meets Initial Values (As Above)

No visual defects

Aꢀꢀearance

Caꢀacitance

Variation

Steꢀ 1: -55ºC 2º

Steꢀ 2: Room Temꢀ

30 3 minutes

ꢄ 3 minutes

ꢄ 7.5ꢂ

Dissiꢀation

pactor

Thermal

Shock

Meets Initial Values (As Above)

Steꢀ 3: +125ºC 2º

Steꢀ 4: Room Temꢀ

30 3 minutes

ꢄ 3 minutes

Insulation

Resistance

Dielectric

Strength

Reꢀeat for 5 cycles and measure after

24 2 hours at room temꢀerature

Meets Initial Values (As Above)

No visual defects

Aꢀꢀearance

Caꢀacitance

Variation

Charge device with 1.5 rated voltage (ꢄ 10V) in

test chamber set at 125ºC 2ºC

for 1000 hours (+48, -0)

ꢄ 12.5ꢂ

Dissiꢀation

pactor

ꢄ Initial Value x 2.0 (See Above)

ꢃ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temꢀerature for 24 2 hours

before measuring.

Insulation

Resistance

Dielectric

Strength

Meets Initial Values (As Above)

No visual defects

Aꢀꢀearance

Caꢀacitance

Variation

Store in a test chamber set at 85ºC 2ºCꢇ

85ꢂ 5ꢂ relative humidity for 1000 hours

(+48, -0) with rated voltage aꢀꢀlied.

ꢄ 12.5ꢂ

Load

Dissiꢀation

pactor

ꢄ Initial Value x 2.0 (See Above)

ꢃ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Humidity

Remove from chamber and stabilize at

room temꢀerature and humidity for

24 2 hours before measuring.

Insulation

Resistance

Dielectric

Strength

100917

20

X7R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

Soldering

Packaging

0101*

Reflow Only

0201

Reflow Only

0402

ReflowꢀWave

0603

ReflowꢀWave

0805

ReflowꢀWave

1206

ReflowꢀWave

PaperꢀEmbossed

All Paper

PaperꢀEmbossed

mm

(in.)

0.40 0.02

0.60 0.03

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.016 0.0008)

(0.024 0.001)

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

0.20 0.02

0.30 0.03

0.50 0.10

0.81 0.15

1.25 0.20

1.60 0.20

(W) Width

(in.)

mm

(in.)

(0.008 0.0008)

(0.011 0.001)

(0.020 0.004)

(0.032 0.006)

(0.049 0.008)

(0.063 0.008)

0.10 0.04

0.15 0.05

0.25 0.15

0.35 0.15

0.50 0.25

(t) Terminal

(0.004 0.0016)

(0.006 0.002)

(0.010 0.006)

(0.014 0.006)

(0.020 0.010)

WVDC

16

B

10

A

16 25

50

A

6.3

10

16

C

25

C

50

C

6.3

10

16

25

50

G

100 200 6.3

10

16

25

50

100 200 6.3

10

16

25

50

100 200 500

Caꢀ

(ꢀp)

100

101

151

221

331

471

681

102

152

222

332

472

682

103

153

223

333

473

683

104

154

224

334

474

684

105

225

475

106

226

476

107

A

G

J

G

150

220

A

330

A

J

N

J

N

K

470

A

680

J

1000

1500

2200

3300

4700

6800

0.01

0.015

0.022

0.033

0.047

0.068

0.1

C

J

M

P

J

Caꢀ

(µp)

G

J

P

J

M

P

J

X

J

N

J

X

G

J

G

J

P

Q

Q%%

0.15

0.22

0.33

0.47

0.68

1.0

G

J

C

J

N

P

J

N

P

N

P

J

M

Q

P

Q

C

J

M

Q

M

Q

J

N

P%%

2.2

J

4.7

10

P

22

Q

47

100

WVDC

16

10

16 25

50

6.3

10

16

25

50

6.3

10

16

25

50

100 200 6.3

10

16

25

50

100 200 6.3

10

16

25

50

100 200 500

SIZE

0101

0201

0402

0603

0805

1206

Letter

Max.

Thickness (0.01±)

A

B

C

E

G

J

K

M

N

P

Q

X

Y

Z

0.±±

0.22

0.56

(0.022)

PAPER

0.71

0.90

0.94

1.02

(0.040)

1.27

1.40

1.52

1.80

2.29

2.54

2.79

(0.009)

(0.028)

(0.0±5)

(0.0±7)

(0.050)

(0.055)

(0.060)

EMBOSSED

(0.071)

(0.090)

(0.100)

(0.110)

PAPER and EMBOSSED available for 01005

NOTE: Contact factory for non-sꢀecified caꢀacitance values

%EIA 01005

%%Contact pactory for Sꢀecifications

100917

21

X7R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

Soldering

Packaging

1210

Reflow Only

1812

Reflow Only

1825

Reflow Only

2220

Reflow Only

2225

Reflow Only

PaperꢀEmbossed

All Embossed

mm

(in.)

3.30 0.4

4.50 0.30

5.70 0.40

5.72 0.25

(L) Length

(0.130 0.016)

(0.177 0.012)

(0.225 0.016)

(0.225 0.010)

mm

2.50 0.20

3.20 0.20

6.40 0.40

5.00 0.40

6.35 0.25

(W) Width

(in.)

mm

(in.)

(0.098 0.008)

(0.126 0.008)

(0.252 0.016)

(0.197 0.016)

(0.250 0.010)

0.50 0.25

0.61 0.36

0.64 0.39

(t) Terminal

(0.020 0.010)

(0.024 0.014)

(0.025 0.015)

WVDC

10

16

25

50

100

200

500

16

25

50

100

200

500

50

100

200

25

50

100

200

500

50

100

200

Caꢀ

(ꢀp)

100

150

220

330

470

680

1000

1500

2200

3300

4700

6800

0.01

0.015

0.022

0.033

0.047

0.068

0.1

101

151

221

331

471

681

102

152

222

332

472

682

103

153

223

333

473

683

104

154

224

334

474

684

105

155

225

335

475

106

226

476

107

WVDC

J

M

P

Q

X

J

Caꢀ

(µp)

J

K

M

Z

K

M

Z

K

M

P

Q

X

Z

K

P

X

K

P

X

Z

M

Q

M

P

M

X

Z

X

Z

X

M

P

X

P

X

Z

J

M

Z

J

0.15

0.22

0.33

0.47

0.68

1.0

J

M

P

Q

X

Z

J

M

N

X

Z

M

N

X

Z

M

P

Z

M

X

Z

P

1.5

2.2

Z

3.3

Z

4.7

Z

10

Z

22

Z

47

100

10

16

25

50

100

200

500

16

25

50

100

200

500

50

100

200

25

50

100

200

500

50

100

200

SIZE

1210

1812

1825

2220

2225

Letter

Max.

A

B

C

E

G

J

K

M

N

P

Q

X

Y

Z

0.±±

0.22

0.56

0.71

0.90

0.94

1.02

1.27

1.40

1.52

1.80

2.29

(0.090)

2.54

2.79

Thickness (0.01±)

(0.009)

(0.022)

(0.028)

(0.0±5)

(0.0±7)

(0.040)

(0.050)

(0.055)

(0.060)

(0.071)

(0.100)

(0.110)

PAPER

EMBOSSED

NOTE: Contact factory for non-sꢀecified caꢀacitance values

100917

22

X7S Dielectric

General Specifications

GENERAL DESCRIPTION

X7S formulations are called “temperature stable” ceramics and

fall into EIA Class II materials. Its temperature variation of

capacitance s within 22ꢀ from –55ꢁC to +125ꢁC. This

capacitance change is non-linear.

Capacitance for X7S varies under the influence of electrical

operating conditions such as voltage and frequency.

X7S dielectric chip usage covers the broad spectrum of

industrial applications where known changes in capacitance due

to applied voltages are acceptable.

PART NUMBER (see page 2 for complete part number explanation)

1206

Z

105

M

A

T

2

A

Size

(L" x W")

Voltage

4 = 4V

Dielectric

Z = X7S

Capacitance Capacitance

Failure

Rate

A = N/A

Special

Code

A = Std.

Product

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

4 = 13" Reel

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

K = 10ꢀ

M = 20ꢀ

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

2 = 200V

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

TYPICAL ELECTRICAL CHARACTERISTICS

X7S Dielectric

Typical Temperature Coefficient

Insulation Resistance vs Temperature

⌬ Capacitance vs. Frequency

10,000

1,000

100

10

5

+30

+20

+10

0

-5

0

-10

-20

-30

-10

-15

-20

-25

-60 -40 -20

0

20 40 60 80 100 120 140

0

20

40

60

80

100

120

1KHz

10 KHz

100 KHz

1 MHz

10 MHz

Temperature (°C)

Frequency

Temperature °C

Variation of Impedance with Cap Value

Impedance vs. Frequency

1,000 pF vs. 10,000 pF - X7S

0805

Variation of Impedance with Chip Size

Impedance vs. Frequency

100,000 pF - X7S

Variation of Impedance with Chip Size

Impedance vs. Frequency

10,000 pF - X7S

10

10.00

10

1206

0805

1210

1206

0805

1210

1,000 pF

10,000 pF

1.0

0.1

.01

1.00

1.0

0.10

0.01

0.1

.01

100

1,000

1

10

100

1000

10

100

1,000

1

10

Frequency, MHz

101316

23

X7S Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X7S Specification Limits

Measuring Conditions

Temperature Cycle Chamber

-55ºC to +125ºC

Within specified tolerance

≤ 5.0ꢀ for ≥ 100V DC rating

≤ 5.0ꢀ for ≥ 25V DC rating

≤ 10.0ꢀ for ≥ 10V DC rating

≤ 10.0ꢀ for ≤ 10V DC rating

100,000MΩ or 1000MΩ - μF,

whichever is less

Freq.: 1.0 kHz 10ꢀ

Voltage: 1.0Vrms .2V

For Cap > 10 μF, 0.5Vrms @ 120Hz

Dissipation Factor

Charge device with rated voltage for

120 5 secs @ room temp/humidity

Charge device with 250ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

No defects

Deflection: 2mm

Test Time: 30 seconds

≤

12ꢀ

Resistance to

Flexure

Meets Initial Values (As Above)

≥ Initial Value x 0.3

Stresses

≥ 95ꢀ of each terminal should be covered

with fresh solder

No defects, <25ꢀ leaching of either end terminal

Dip device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

≤

7.5ꢀ

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24

hours before measuring electrical properties.

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

2

Resistance to

Solder Heat

Meets Initial Values (As Above)

No visual defects

Appearance

Capacitance

Variation

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

≤

7.5ꢀ

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +125ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Charge device with 1.5 rated voltage (≤ 10V) in

test chamber set at 125ºC 2ºC

for 1000 hours (+48, -0)

≤

12.5ꢀ

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC 2ºC/

85ꢀ 5ꢀ relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤

12.5ꢀ

Load

Humidity

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 2 hours before measuring.

101316

24

X7S Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0402

0603

0805

1206

1210

Soldering

Packaging

Reflow/Wave

All Paper

Reflow/Wave

All Paper

Reflow/Wave

Reflow Only

Paper/Embossed

mm

(in.)

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

(in.)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

(W) Width

mm

(in.)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

6.3

4

10

50

100

6.3

Cap

(pF)

100

150

220

330

470

680

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

Cap

(μF

C

G

1.5

2.2

3.3

4.7

N

Q

Q*

10

22

Z

47

100

WVDC

6.3

4

10

50

100

6.3

SIZE

0402

0603

0805

1206

1210

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.90

(0.075)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

*Contact Factory for Specifications

101316

25

X5R Dielectric

General Specifications

GENERAL DESCRIPTION

• General Purꢀose Dielectric for Ceramic Caꢀacitors

• EIA Class II Dielectric

• Temꢀerature variation of caꢀacitance is within 15ꢂ

from -55°C to +85°C

• Well suited for decouꢀling and filtering aꢀꢀlications

• Available in High Caꢀacitance values (uꢀ to 100µp)

PART NUMBER (see page 2 for complete part number explanation)

1210

4

D

107

M

A

T

2

A

Size

(L" x W")

0101%%

0201

Voltage

4 = 4V

Dielectric

Capacitance Capacitance

Failure

Rate

Special

Code

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

Code (In pF)

2 Sig. Digits +

Tolerance

K = 10ꢂ

D = X5R

A = NꢇA

A = Std.

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

D = 35V

5 = 50V

1 = 100V

4 = 13" Reel

U = 4mm TR

(01005)

Number of Zeros

M = 20ꢂ

0402

0603

0805

1206

1210

1812

%%EIA 01005

NOTE: Contact factory for availability of Tolerance Oꢀtions for Sꢀecific Part Numbers.

Contact factory for non-sꢀecified caꢀacitance values.

TYPICAL ELECTRICAL CHARACTERISTICS

Temperature Coefficient

Insulation Resistance vs Temperature

10,000

1,000

100

20

15

10

5

0

-5

-10

-15

-20

0

-60 -40

-20

0

+20 +40 +60 +80

0

20

40

60

80

100

120

Temperature °C

100917

26

X5R Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X5R Specification Limits

Measuring Conditions

-55ºC to +85ºC

Within sꢀecified tolerance

Temꢀerature Cycle Chamber

ꢄ 2.5ꢂ for ꢃ 50V DC rating

ꢄ 12.5ꢂ for 25V, 35V DC rating

ꢄ 12.5ꢂ Max. for 16V DC rating and lower

Contact pactory for Dp by PN

10,000MΩ or 500MΩ - µp,

whichever is less

preq.: 1.0 kHz 10ꢂ

Voltage: 1.0Vrms .2V

por Caꢀ ꢅ 10 µp, 0.5Vrms ꢆ 120Hz

Dissipation Factor

Charge device with rated voltage for

120 5 secs ꢆ room temꢀꢇhumidity

Charge device with 250ꢂ of rated voltage for

1-5 seconds, wꢇcharge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Aꢀꢀearance

Caꢀacitance

No defects

ꢄ 12ꢂ

Deflection: 2mm

Test Time: 30 seconds

Resistance to

Flexure

Variation

Dissiꢀation

pactor

Meets Initial Values (As Above)

ꢃ Initial Value x 0.3

ꢃ 95ꢂ of each terminal should be covered

with fresh solder

No defects, ꢁ25ꢂ leaching of either end terminal

Stresses

Insulation

Resistance

Diꢀ device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Aꢀꢀearance

Caꢀacitance

Variation

ꢄ 7.5ꢂ

Diꢀ device in eutectic solder at 260ºC for 60

Dissiꢀation

pactor

seconds. Store at room temꢀerature for 24

2

Resistance to

Solder Heat

Meets Initial Values (As Above)

hours before measuring electrical ꢀroꢀerties.

Insulation

Resistance

Dielectric

Strength

Meets Initial Values (As Above)

No visual defects

Aꢀꢀearance

Caꢀacitance

Variation

Steꢀ 1: -55ºC 2º

Steꢀ 2: Room Temꢀ

30 3 minutes

ꢄ 3 minutes

ꢄ 7.5ꢂ

Dissiꢀation

pactor

Thermal

Shock

Meets Initial Values (As Above)

Steꢀ 3: +85ºC 2º

Steꢀ 4: Room Temꢀ

30 3 minutes

ꢄ 3 minutes

Insulation

Resistance

Dielectric

Strength

Reꢀeat for 5 cycles and measure after

24 2 hours at room temꢀerature

Meets Initial Values (As Above)

No visual defects

Aꢀꢀearance

Caꢀacitance

Variation

Charge device with 1.5X rated voltage in

test chamber set at 85ºC 2ºC for 1000 hours (+48, -0).

Note: Contact factory for %oꢀtional

ꢄ 12.5ꢂ

Dissiꢀation

pactor

sꢀecification ꢀart numbers that are tested at

ꢁ 1.5X rated voltage.

ꢄ Initial Value x 2.0 (See Above)

ꢃ Initial Value x 0.3 (See Above)

Load Life

Insulation

Resistance

Dielectric

Strength

Remove from test chamber and stabilize

at room temꢀerature for 24 2 hours

Meets Initial Values (As Above)

No visual defects

Aꢀꢀearance

Caꢀacitance

Variation

Store in a test chamber set at 85ºC 2ºCꢇ

85ꢂ 5ꢂ relative humidity for 1000 hours

(+48, -0) with rated voltage aꢀꢀlied.

ꢄ 12.5ꢂ

Load

Dissiꢀation

pactor

ꢄ Initial Value x 2.0 (See Above)

ꢃ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Humidity

Remove from chamber and stabilize at

room temꢀerature and humidity for

24 2 hours before measuring.

Insulation

Resistance

Dielectric

Strength

100917

27

X5R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

Case Size

Soldering

Packaging

0101*

0201

0402

0603

0805

Reflow Only

All Paꢀer

ReflowꢇWave

All Paꢀer

ReflowꢇWave

All Paꢀer

ReflowꢇWave

PaꢀerꢇEmbossed

(L) Length

mm

(in.)

0.40 0.02

0.60 0.09

1.00 0.10

1.60 0.15

2.01 0.20

(0.016 0.0008)

(0.024 0.004)

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(W) Width

mm

0.20 0.02

0.30 0.09

0.50 0.10

0.81 0.15

1.25 0.20

(in.)

mm

(in.)

(0.008 0.0008

(0.011 0.004)

(0.020 0.004)

(0.032 0.006)

(0.049 0.008)

(t) Terminal

0.10 0.04

0.15 0.05

0.25 0.15

0.35 0.15

0.50 0.25

(0.004 0.0016)

(0.006 0.002)

(0.010 0.006

(0.014 0.006)

(0.020 0.010)

Voltage:

100

6.3

16

B

4

6.3

10

16

25

A

4

6.3

10

16

25

50

4

6.3

10

16

25

35

50

4

6.3

10

16

25

35

50

Caꢀ (ꢀp)

101

150

220

330

470

680

151

221

331

471

681

102

152

222

332

472

682

103

153

223

333

473

683

104

154

224

334

474

684

105

155

225

335

475

106

226

476

107

C

1000

1500

2200

3300

4700

6800

0.01

0.015

0.022

0.033

0.047

0.068

0.1

0.15

0.22

0.33

0.47

0.68

1.0

1.5

2.2

3.3

4.7

10

22

47

100

A

B

A

C

G

Caꢀ (µp)

G

J

G

A

p

C

N

C

A

C

E

C

G

N

B

A

p

C

G

N

P

C

P

p

E

G

J

G

N

G

J

K

G

J

K

J

K

J

N

J

P

N

P

E

G

J

N

P

4

N

P

N

P

Voltage:

6.3

16

4

6.3

10

16

25

4

6.3

10

16

25

50

4

6.3

10

16

25

35

50

6.3

10

16

25

35

50

Case Size

0101*

0201

0402

0603

0805

Letter

Max.

A

B

C

E

F

G

J

K

M

N

P

Q

X

Y

Z

0.±±

0.22

0.56

(0.022)

0.71

0.40

0.90

0.94

1.02

1.27

1.40

1.52

1.78

2.29

(0.090)

2.54

2.79

Thickness (0.01±)

(0.009)

(0.028)

(0.016)

(0.0±5)

(0.0±7)

(0.040)

(0.050)

(0.055)

(0.060)

(0.070)

(0.100)

(0.110)

PAPER

EMBOSSED

PAPER and EMBOSSED available for 01005

NOTE: Contact factory for non-sꢀecified caꢀacitance values

%EIA 01005

100917

28

X5R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

Case Size

Soldering

Packaging

1206

1210

1812

ReflowꢇWave

PaꢀerꢇEmbossed

Reflow Only

All Embossed

PaꢀerꢇEmbossed

(L) Length

mm

(in.)

3.20 0.20

4.50 0.30

(0.126 0.008)

(0.177 0.012

(W) Width

mm

1.60 0.20

2.50 0.20

3.20 0.20

(in.)

mm

(in.)

(0.063 0.008)

(0.098 0.008)

(0.126 0.008

(t) Terminal

0.50 0.25

0.61 0.36

(0.020 0.010)

(0.024 0.014)

Voltage:

100

4

6.3

10

16

25

35

50

100

4

6.3

10

16

25

35

50

4

6.3

10

16

25

35

50

Caꢀ (ꢀp)

101

150

220

330

470

680

151

221

331

471

681

102

152

222

332

472

682

103

153

223

333

473

683

104

154

224

334

474

684

105

155

225

335

475

106

226

476

107

1000

1500

2200

3300

4700

6800

0.01

0.015

0.022

0.033

0.047

0.068

0.1

0.15

0.22

0.33

0.47

0.68

1.0

1.5

2.2

3.3

4.7

10

22

47

100

Caꢀ (µp)

Q

X

Z

X

Z

Q

X

Q

X

Q

X

4

X

Q

X

Z

Q

Z

X

Z

6.3

Z

4

X

6.3

Voltage

10

16

25

35

50

100

10

16

25

35

50

4

6.3

10

16

25

35

50

Case Size

1206

1210

1812

Letter

Max.

A

B

C

E

F

G

J

K

M

N

P

Q

X

Y

Z

0.±±

0.22

(0.009)

0.56

0.71

0.40

0.90

0.94

1.02

1.27

1.40

1.52

1.78

2.29

2.54

2.79

Thickness (0.01±)

(0.022)

(0.028)

(0.016)

(0.0±5)

(0.0±7)

(0.040)

(0.050)

(0.055)

(0.060)

(0.070)

(0.090)

(0.100)

(0.110)

PAPER

EMBOSSED

NOTE: Contact factory for non-sꢀecified caꢀacitance values

%EIA 01005

100917

29

Y5V Dielectric

General Specifications

Y5V formulations are for general-purpose use in a limited

temperature range. They have a wide temperature

characteristic of +22ꢀ –82ꢀ capacitance change over the

operating temperature range of –30ꢁC to +85ꢁC.

These characteristics make Y5V ideal for decoupling

applications within limited temperature range.

PART NUMBER (see page 2 for complete part number explanation)

0805

3

G

104

Z

A

T

2

A

Size

(L" x W")

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

50V = 5

Dielectric

Y5V = G

Capacitance Capacitance

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Std.

Product

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

Z = +80 –20ꢀ

Capacitance Change

vs. DC Bias Voltage

Temperature Coefficient

Insulation Resistance vs. Temperature

10,000

+20

+10

0

+40

+20

0

-10

1,000

100

0

-20

-30

-40

-50

-60

-70

-80

-20

-40

-60

-80

-100

-55 -35

+125

+20

+30

+40 +50 +60

+70 +80 +90

-15 +5 +25 +45 +65 +85 +105

0

20

40

60

100

80

Temperature °C

% DC Bias Voltage

0.1 ␮F - 0603

Impedance vs. Frequency

0.22 ␮F - 0805

Impedance vs. Frequency

1 ␮F - 1206

Impedance vs. Frequency

1,000

100

10

1,000

10,000

1,000

100

10

1

100

10

1

0.1

0.01

10,000

0.01

10,000

0.01

10,000

100,000

1,000,000

10,000,000

1,000,000

10,000,000

1,000,000

10,000,000

Frequency (Hz)

101316

30

Y5V Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

Y5V Specification Limits

Measuring Conditions

Temperature Cycle Chamber

-30ºC to +85ºC

Within specified tolerance

≤ 5.0ꢀ for ≥ 50V DC rating

≤ 7.0ꢀ for 25V DC rating

≤ 9.0ꢀ for 16V DC rating

≤ 12.5ꢀ for ≤ 10V DC rating

10,000MΩ or 500MΩ - μF,

whichever is less

Freq.: 1.0 kHz 10ꢀ

Voltage: 1.0Vrms .2V

For Cap > 10 μF, 0.5Vrms @ 120Hz

Dissipation Factor

Charge device with rated voltage for

120 5 secs @ room temp/humidity

Charge device with 250ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

No defects

Deflection: 2mm

Test Time: 30 seconds

≤

30ꢀ

Resistance to

Flexure

Meets Initial Values (As Above)

≥ Initial Value x 0.1

Stresses

≥ 95ꢀ of each terminal should be covered

with fresh solder

No defects, <25ꢀ leaching of either end terminal

Dip device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

≤

20ꢀ

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24

hours before measuring electrical properties.

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

2

Resistance to

Solder Heat

Meets Initial Values (As Above)

No visual defects

Appearance

Capacitance

Variation

Step 1: -30ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

≤

20ꢀ

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +85ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Charge device with twice rated voltage in

test chamber set at 85ºC 2ºC

for 1000 hours (+48, -0)

≤

30ꢀ

≤ Initial Value x 1.5 (See Above)

≥ Initial Value x 0.1 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC 2ºC/

85ꢀ 5ꢀ relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤

30ꢀ

Load

Humidity

≤ Initial Value x 1.5 (See above)

≥ Initial Value x 0.1 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 2 hours before measuring.

101316

31

Y5V Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

Soldering

Packaging

0201

Reflow Only

All Paper

0402

Reflow/Wave

All Paper

0603

Reflow/Wave

All Paper

0805

1206

1210

Reflow/Wave

Reflow Only

Paper/Embossed

mm

(in.)

0.60 0.09

(0.024 0.004)

1.00 0.10

(0.040 0.004)

1.60 0.15

(0.063 0.006)

2.01 0.20

(0.079 0.008)

3.20 0.20

(0.126 0.008)

3.20 0.20

(0.126 0.008)

(L) Length

mm

(in.)

0.30 0.09

(0.011 0.004)

0.50 0.10

(0.020 0.004)

.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

(W) Width

mm

(in.)

0.15 0.05

(0.006 0.002)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

6.3

10

6

10

16

25

50

10

16

25

50

10

16

25

50

10

16

25

50

10

16

25

50

Cap

(pF)

820

1000

2200

A

4700

0.010

0.022

A

Cap

(μF)

A

0.047

0.10

0.22

A

C

G

K

N

G

0.33

0.47

1.0

G

C

G

J

C

6

C

G

J

N

M

Q

N

2.2

4.7

10.0

N

P

N

K

Q

X

N

P

Q

N

Q

N

Q

X

22.0

47.0

Z

WVDC

6.3

10

16

25

50

10

16

25

50

10

16

25

50

10

16

25

50

10

16

25

50

SIZE

0201

0402

0603

0805

1206

1210

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.90

(0.035)

PAPER

EMBOSSED

101316

32

MLCC Gold Termination – AU Series

General Specifications

AVX Corporation will support those customers for

commercial and military Multilayer Ceramic Capacitors with

a termination consisting of Gold. This termination is

indicated by the use of a “7” or “G” in the 12th position of

the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our

customers. Please contact the factory if you require

additional information on our MLCC Gold Termination.

PART NUMBER

AU03

C

104

K

A

7

2

A

Y

Size

Dielectric

Capacitance

Tolerance

Failure

Rate

A = Not

Applicable

Terminations

G* = 1.9 μ" to

7.87 μ"

Packaging

2 = 7" Reel

Special

Code

A = Std.

Product

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

35V = D

50V = 5

100V = 1

200V = 2

500V = 7

AU01 - 0201

AU02 - 0402

AU03 - 0603

AU05 - 0805

AU06 - 1206

AU10 - 1210

AU12 - 1812

AU13 - 1825

AU14 - 2225

AU16 - 0306

AU17 - 0508

AU18 - 0612

C0G (NP0) = A Code (In pF)

X7R = C

X5R = D

B = .10 pF (<10pF)

C = .25 pF (<10pF)

D = .50 pF (<10pF)

F = 1ꢀ (≥ 10 pF)

G = 2ꢀ (≥ 10 pF)

4 = 13" Reel

U = 4mm TR

(01005)

2 Sig. Digits +

Number of

Zeros

7 = 100 μ"

minimum

Contact

Factory

For

J

=

5ꢀ

K = 10ꢀ

M = 20ꢀ

Multiples*

* Contact factory for availability.

041416

33

MLCC Gold Termination – AU Series

Capacitance Range (NP0 Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

AU01

AU02

AU03

AU05

AU06

Soldering

Reflow/Epoxy/

Wire Bond*

Wire Bond

Packaging

All Paper

Paper/Embossed

mm

(in.)

0.60 0.09

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.024 0.004

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

(in.)

0.30 0.09

(0.011 0.004)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

(W) Width

mm

(in.)

0.15 0.05

(0.006 0.002)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

0.5

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

12

15

18

22

27

33

39

47

56

68

16

A

25

A

16

25

C

50

C

16

G

25

G

50

G

100

G

16

J

25

J

50

J

N

100

J

200

J

16

J

M

25

J

M

50

J

M

100

J

M

P

200

J

500

J

Cap

(pF)

C

82

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.068

0.082

0.1

J

M

P

M

J

M

Q

Cap

(μF)

WVDC

16

25

16

25

50

16

25

50

100

16

25

50

100

200

16

25

50

Z

100

200

500

SIZE

AU01

AU02

AU03

AU05

AU06

* Contact factory

Letter

Max.

A

0.33

C

0.56

E

0.71

(0.028)

G

J

K

1.02

(0.040)

M

N

1.40

(0.055)

P

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

0.90

(0.035)

0.94

(0.037)

1.27

(0.050)

1.52

(0.060)

2.79

(0.110)

Thickness (0.013)

(0.022)

(0.100)

PAPER

EMBOSSED

041416

34

MLCC Gold Termination – AU Series

Capacitance Range (NP0 Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

AU10

AU12

AU13

AU14

Soldering

Reflow/Epoxy/

Wire Bond*

Packaging

Paper/Embossed

All Embossed

mm

(in.)

3.20 0.20

4.50 0.30

5.72 0.25

(L) Length

(0.126 0.008)

(0.177 0.012)

(0.225 0.010)

mm

(in.)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

6.40 0.40

(0.252 0.016)

6.35 0.25

(0.250 0.010)

(W) Width

mm

(in.)

0.50 0.25

(0.020 0.010)

0.61 0.36

(0.024 0.014)

0.61 0.36

(0.024 0.014)

0.64 0.39

(0.025 0.015)

(t) Terminal

WVDC

0.5

1.0

25

50

100

200

500

25

50

100

200

500

50

100

200

50

100

200

Cap

(pF)

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

12

J

15

J

18

J

22

J

27

J

33

J

39

J

47

J

56

J

68

J

82

J

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

J

M

J

K

M

K

P

X

M

P

Q

X

M

P

M

P

M

Y

P

Y

M

Q

J

M

K

M

Cap

(μF)

K

M

P

Y

P

0.068

0.082

0.1

M

P

Q

WVDC

25

50

100

200

500

25

50

100

200

500

50

100

200

50

100

200

SIZE

* Contact factory

AU10

AU12

AU13

AU14

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

041416

35

MLCC Gold Termination – AU Series

Capacitance Range (X7R Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

AU02

AU03

AU05

AU06

Soldering

Reflow/Epoxy

Wire Bond*

Packaging

All Paper

Paper/Embossed

mm

(in.)

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

(in.)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

(W) Width

mm

(in.)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

16

25

50

6.3

10

16

25

50

100

200

6.3

10

16

25

50

100

200

6.3

10

16

25

50

100 200

500

Cap

(pF)

100

150

220

330

470

680

C

G

J

N

J

N

J

N

J

N

K

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

K

J

P

Q

J

M

P

C

Cap

(μF

J

P

G

M

P

N

G

J

C*

G

M

Q

G

N

N*

J

M

Q

J*

M

P

Q

M

Q

J*

1.5

2.2

J*

P*

3.3

4.7

10

P*

Q*

P*

22

Q*

47

100

WVDC

16

25

50

6.3

10

16

25

50

100

200

6.3

10

16

25

50

100

200

6.3

10

16

25

50

100 200

500

SIZE

AU02

AU03

AU05

AU06

* Contact factory

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

J

0.94

(0.037)

K

M

1.27

(0.050)

N

1.40

(0.055)

P

Q

1.78

(0.070)

X

2.29

(0.090)

Y

Z

2.79

(0.110)

0.90

(0.035)

1.02

(0.040)

1.52

(0.060)

2.54

(0.100)

PAPER

EMBOSSED

041416

36

MLCC Gold Termination – AU Series

Capacitance Range (X7R Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

AU10

AU12

AU13

AU14

Soldering

Reflow/Epoxy/

Reflow/Epoxy/ Reflow/Epoxy/

Wire Bond*

Wire Bond* Wire Bond*

Packaging

Paper/Embossed

All Embossed

All Embossed All Embossed

mm

(in.)

3.20 0.20

4.50 0.30

5.72 0.25

(L) Length

(0.126 0.008)

(0.177 0.012)

(0.225 0.010)

mm

(in.)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

6.40 0.40

(0.252 0.016)

6.35 0.25

(0.250 0.010)

(W) Width

mm

(in.)

0.50 0.25

(0.020 0.010)

0.61 0.36

(0.024 0.014)

0.61 0.36

(0.024 0.014)

0.64 0.39

(0.025 0.015)

(t) Terminal

WVDC

10

16

25

50

100

200

500

50

100

200

500

50

100

50

100

Cap

(pF)

100

150

220

330

470

680

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

J

M

N

X

Z

J

M

N

X

Z

J

M

P

Z

J

M

X

Z

J

M

P

Cap

(μF

K

M

Z

K

M

P

Q

X

K

P

X

K

P

X

Z

M

P

M

P

X

Q

J

M

Z

M

P

Q

X

Z

P

1.5

2.2

3.3

4.7

Z

10

22

47

100

WVDC

10

16

25

50

100

200

500

50

100

200

500

50

100

50

100

SIZE

* Contact factory

AU10

AU12

AU13

AU14

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

041416

37

MLCC Gold Termination – AU Series

Capacitance Range (X5R Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

AU01

AU02

AU03

AU05

AU06

AU10

AU12

Soldering

Reflow/Epoxy/

Wire Bond*

Packaging

All Paper

Paper/Embossed

mm

(in.)

0.60 0.09

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.024 0.004)

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

(in.)

0.30 0.09

(0.011 0.004)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

(W) Width

mm

(in.)

0.15 0.05

(0.006 0.002)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

6.3 10 16 25

4

6.3 10 16 25 50

4

6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50

4

6.3 10 16 25 35 50 6.3 10 25 50

Cap

(pF)

100

150

220

A

C

330

470

680

A

C

1000

1500

2200

A

C

3300

4700

6800

A

C

G

Cap

(μF)

0.010

0.015

0.022

A

C

G

C

N

0.033

0.047

0.068

A

C

G

N

0.10

0.15

0.22

A

C

G

N

C*

G

Q

0.33

0.47

0.68

G

N

C* C*

Q

X

1.0

1.5

2.2

G

J*

N

P*

Q

X

Z

X

C*

G* G* J* J*

N

Q

3.3

4.7

10

J* J* J* J*

J* J* J*

K*

N

Q

N* N*

Q

Q*

Q

Z

P* P* P*

X

Z

22

47

P*

Q* Q* Q*

Q*

Z

Z*

Z

100

Z* Z*

6.3 10 16 25 35 50 6.3 10 25 50

WVDC

6.3 10 16 25

4

6.3 10 16 25 50

4

6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50

4

SIZE

* Contact factory

AU01

AU02

AU03

AU05

AU06

AU10

AU12

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

= *Optional Specifications – Contact factory

NOTE: Contact factory for non-specified capacitance values

041416

38

MLCC Gold Termination – AU Series

AU16/AU17/AU18

SIZE

AU16

AU17

AU18

PHYSICAL DIMENSIONS AND

PAD LAYOUT

(0306)

(0508)

(0612)

Packaging

Embossed

mm

(in.)

0.81 0.15

1.27 0.25

1.60 0.25

Length

(0.032 0.006)

(0.050 0.010)

(0.063 0.010)

mm

(in.)

1.60 0.15

2.00 0.25

3.20 0.25

Width

(0.063 0.006)

(0.080 0.010)

(0.126 0.010)

t

W

Cap Code

102

222

332

472

682

103

153

223

333

473

683

104

154

224

334

474

684

105

155

225

335

475

WVDC

4

6.3 10 16 25 6.3 10 16 25 50 6.3 10 16 25 50

Cap 0.001

(μF) 0.0022

0.0033

0.0047

0.0068

0.01

A

S

V

A

S

V

A

S

V

A

S

V

A

V

A

S

V

W

A

S

V

W

A

S

V

W

A

S

V

T

V

L

V

0.015

0.022

0.033

0.047

0.068

0.1

W

PHYSICAL DIMENSIONS

mm (in)

L

W

t

V

AU16

(0306)

AU17

(0508)

AU18

(0612)

0.81 0.15

(0.032 0.006)

1.60 0.15

(0.063 0.006)

0.13 min.

(0.005 min.)

0.15

W

0.22

1.27 0.25

(0.050 0.010)

2.00 0.25

(0.080 0.010)

0.13 min.

(0.005 min.)

0.33

0.47

1.60 0.25

(0.063 0.010)

3.20 0.25

(0.126 0.010)

0.13 min.

(0.005 min.)

0.68

1

A

T - See Range Chart for Thickness and Codes

1.5

2.2

3.3

PAD LAYOUT DIMENSIONS

mm (in)

4.7

A

B

C

685

106

6.8

10

AU16

(0306)

0.31 (0.012)

1.52 (0.060)

0.51 (0.020)

AU17

0.51 (0.020)

0.76 (0.030)

2.03 (0.080)

3.05 (0.120)

0.51 (0.020)

Solid = X7R

= X5R

= X7S

(0508)

AU18

(0612)

0.635 (0.025)

mm (in.)

AU16

(0306)

AU17

(0508)

AU18

(0612)

Code Thickness

A

0.56 (0.022)

S

V

A

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

S

V

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

1.27 (0.050)

W

A

“B”

C

“A”

C

041416

39

MLCC Tin/Lead Termination “B”

C0G (NP0) – General Specifications

AVX Corporation will support those customers for

commercial and military Multilayer Ceramic Capacitors with

a termination consisting of 5ꢀ minimum lead. This

termination is indicated by the use of a “B” in the 12th

position of the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our

customers. AVX has provided in the following pages a full

range of values that we are currently offering in this special

“B” termination. Please contact the factory if you require

additional information on our MLCC Tin/Lead Termination

“B” products.

Not RoHS Compliant

PART NUMBER (see page 2 for complete part number explanation)

LD05

A

101

J

A

B

2

A

5

Size

Dielectric

Capacitance

Tolerance

Failure

Rate

Terminations

B = 5ꢀ min lead

X = FLEXITERM^®

with 5ꢀ min

lead**

Packaging

Special

Code

A = Std.

Product

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

35V = D

50V = 5

100V = 1

200V = 2

500V = 7

LD02 - 0402

LD03 - 0603

LD04 - 0504*

LD05 - 0805

LD06 - 1206

LD10 - 1210

LD12 - 1812

LD13 - 1825

LD14 - 2225

LD20 - 2220

C0G (NP0) = A Code (In pF)

2 = 7" Reel

X7R = C

B = .10 pF (<10pF) A = Not

C = .25 pF (<10pF) Applicable

D = .50 pF (<10pF)

4 = 13" Reel

2 Sig. Digits +

Number of

X5R = D

X8R = F

Contact Factory

For

Zeros

F = 1ꢀ (≥ 10 pF)

G = 2ꢀ (≥ 10 pF)

Multiples

**X7R only

J

=

5ꢀ

K = 10ꢀ

M = 20ꢀ

See FLEXITERM^®section for CV options

*LD04 has the same CV ranges as LD03.

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

Contact factory for non-specified capacitance values.

Insulation Resistance vs Temperature

10,000

1,000

100

0

40

60

80

100

0

20

Temperature °C

112916

40

MLCC Tin/Lead Termination “B”

C0G (NP0) – Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

NP0 Specification Limits

-55ºC to +125ºC

Within specified tolerance

<30 pF: Q≥ 400+20 x Cap Value

≥30 pF: Q≥ 1000

Measuring Conditions

Temperature Cycle Chamber

Freq.: 1.0 MHz 10ꢀ for cap ≤ 1000 pF

1.0 kHz 10ꢀ for cap > 1000 pF

Voltage: 1.0Vrms .2V

Q

100,000MΩ or 1000MΩ - μF,

whichever is less

Charge device with rated voltage for

60 5 secs @ room temp/humidity

Charge device with 250ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Note: Charge device with 150ꢀ of rated

voltage for 500V devices.

Appearance

Capacitance

Variation

No defects

Deflection: 2mm

Test Time: 30 seconds

5ꢀ or .5 pF, whichever is greater

Resistance to

Flexure

Q

Meets Initial Values (As Above)

≥ Initial Value x 0.3

Stresses

Insulation

Resistance

≥ 95ꢀ of each terminal should be covered

with fresh solder

No defects, <25ꢀ leaching of either end terminal

Dip device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

≤

2.5ꢀ or .25 pF, whichever is greater

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24

hours before measuring electrical properties.

2

Resistance to

Solder Heat

Q

Meets Initial Values (As Above)

Insulation

Resistance

Dielectric

Meets Initial Values (As Above)

No visual defects

Strength

Appearance

Capacitance

Variation

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

2.5ꢀ or .25 pF, whichever is greater

Thermal

Shock

Q

Meets Initial Values (As Above)

Step 3: +125ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Insulation

Resistance

Dielectric

Repeat for 5 cycles and measure after

24 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Strength

Appearance

Capacitance

Variation

3.0ꢀ or .3 pF, whichever is greater

Charge device with twice rated voltage in

test chamber set at 125ºC 2ºC

for 1000 hours (+48, -0).

≥ 30 pF:

≥10 pF, <30 pF:

<10 pF:

Q≥ 350

Q≥ 275 +5C/2

Q≥ 200 +10C

Q

Load Life

(C=Nominal Cap)

Insulation

Resistance

Dielectric

Remove from test chamber and stabilize at

room temperature for 24 hours

before measuring.

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

No visual defects

Strength

Appearance

Capacitance

Variation

≤

5.0ꢀ or .5 pF, whichever is greater

Store in a test chamber set at 85ºC 2ºC/

85ꢀ 5ꢀ relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≥ 30 pF:

≥10 pF, <30 pF:

<10 pF:

Q≥ 350

Q≥ 275 +5C/2

Q≥ 200 +10C

Load

Q

Humidity

Insulation

Resistance

Dielectric

Strength

Remove from chamber and stabilize at

room temperature for 24 2 hours

before measuring.

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

112916

41

MLCC Tin/Lead Termination “B”

Capacitance Range (NP0 Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD02

LD03

LD05

LD06

Soldering

Packaging

Reflow/Wave

All Paper

Reflow/Wave

All Paper

Reflow/Wave

Paper/Embossed

mm

(in.)

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

(in.)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

(W) Width

mm

(in.)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

0.5

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

12

15

18

22

27

33

39

47

56

68

16

C

25

C

50

C

16

G

25

G

50

G

100

G

16

J

25

50

J

N

100

200

J

16

J

M

25

J

M

50

J

M

100

J

M

P

200

J

500

J

Cap

(pF)

J

82

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.068

0.082

0.1

J

M

P

M

J

M

Q

Cap

(μF)

WVDC

16

25

50

E

16

25

50

100

16

25

50

100

200

16

25

50

100

200

500

SIZE

LD02

LD03

LD05

LD06

Letter

Max.

Thickness (0.013)

A

C

G

J

K

M

N

P

Q

X

Y

Z

0.33

0.56

(0.022)

0.71

(0.028)

0.90

(0.035)

0.94

(0.037)

1.02

(0.040)

1.27

(0.050)

1.40

(0.055)

1.52

(0.060)

1.78

(0.070)

2.29

(0.090)

2.54

(0.100)

2.79

(0.110)

PAPER

EMBOSSED

112916

42

MLCC Tin/Lead Termination “B”

Capacitance Range (NP0 Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD10

LD12

LD13

LD14

Soldering

Reflow Only

Packaging

Paper/Embossed

All Embossed

mm

(in.)

3.20 0.20

4.50 0.30

5.72 0.25

(L) Length

(0.126 0.008)

(0.177 0.012)

(0.225 0.010)

mm

(in.)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

6.40 0.40

(0.252 0.016)

6.35 0.25

(0.250 0.010)

(W) Width

mm

(in.)

0.50 0.25

(0.020 0.010)

0.61 0.36

(0.024 0.014)

0.61 0.36

(0.024 0.014)

0.64 0.39

(0.025 0.015)

(t) Terminal

WVDC

0.5

1.0

25

50

100

200

500

25

50

100

200

500

50

100

200

50

100

200

Cap

(pF)

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

12

J

15

J

18

J

22

J

27

J

33

J

39

J

47

J

56

J

68

J

82

J

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

J

M

J

K

M

K

P

X

M

P

Q

X

M

P

M

P

M

Y

P

Y

M

Q

J

M

K

M

Cap

(μF)

K

M

P

Y

P

0.068

0.082

0.1

M

P

Q

WVDC

25

50

100

200

500

25

50

100

200

500

50

100

200

50

100

200

SIZE

LD10

LD12

LD13

LD14

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

112916

43

MLCC Tin/Lead Termination “B”

X8R – General Specifications

AVX Corporation will support those customers for

commercial and military Multilayer Ceramic Capacitors with

a termination consisting of 5ꢀ minimum lead. This

termination is indicated by the use of a “B” in the 12th

position of the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our

customers. AVX has provided in the following pages a full

range of values that we are currently offering in this special

“B” termination. Please contact the factory if you require

additional information on our MLCC Tin/Lead Termination

“B” products.

Not RoHS Compliant

PART NUMBER (see page 2 for complete part number explanation)

LD05

F

101

J

A

B

2

A

5

Size

Dielectric

X8R = F

Capacitance

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Capacitance

Tolerance

Failure

Rate

Terminations

B = 5ꢀ min lead

X = FLEXITERM^®

with 5ꢀ min

lead**

Packaging

Special

Code

A = Std.

Product

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

35V = D

50V = 5

100V = 1

200V = 2

500V = 7

LD02 - 0402

LD03 - 0603

LD04 - 0504*

LD05 - 0805

LD06 - 1206

LD10 - 1210

LD12 - 1812

LD13 - 1825

LD14 - 2225

LD20 - 2220

2 = 7" Reel

B = .10 pF (<10pF) A = Not

C = .25 pF (<10pF) Applicable

D = .50 pF (<10pF)

4 = 13" Reel

Contact Factory

For

F = 1ꢀ (≥ 10 pF)

G = 2ꢀ (≥ 10 pF)

Multiples

**X7R only

J

=

5ꢀ

K = 10ꢀ

M = 20ꢀ

See FLEXITERM^®section for CV options

*LD04 has the same CV ranges as LD03.

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

Contact factory for non-specified capacitance values.

112916

44

MLCC Tin/Lead Termination “B”

X8R – Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X8R Specification Limits

-55ºC to +150ºC

Within specified tolerance

≤ 2.5ꢀ for ≥ 50V DC rating

≤ 3.5ꢀ for 25V DC and 16V DC rating

100,000MΩ or 1000MΩ - μF,

whichever is less

Measuring Conditions

Temperature Cycle Chamber

Freq.: 1.0 kHz 10ꢀ

Voltage: 1.0Vrms .2V

Dissipation Factor

Charge device with rated voltage for

120 5 secs @ room temp/humidity

Charge device with 250ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Note: Charge device with 150ꢀ of rated

voltage for 500V devices.

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

No defects

Deflection: 2mm

Test Time: 30 seconds

≤

12ꢀ

Resistance to

Flexure

Meets Initial Values (As Above)

≥ Initial Value x 0.3

Stresses

≥ 95ꢀ of each terminal should be covered

with fresh solder

No defects, <25ꢀ leaching of either end terminal

Dip device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

≤

7.5ꢀ

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24

hours before measuring electrical properties.

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

2

Resistance to

Solder Heat

Meets Initial Values (As Above)

No visual defects

Appearance

Capacitance

Variation

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

≤

7.5ꢀ

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +125ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Charge device with 1.5 rated voltage (≤ 10V) in

test chamber set at 150ºC 2ºC

for 1000 hours (+48, -0)

≤

12.5ꢀ

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC 2ºC/

85ꢀ 5ꢀ relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤

12.5ꢀ

Load

Humidity

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 2 hours before measuring.

112916

45

MLCC Tin/Lead Termination “B”

Capacitance Range (X8R Dielectric)

SIZE

LD03

LD05

LD06

WVDC

270

330

470

680

25V

G

50V

G

25V

50V

25V

50V

271

331

471

681

102

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

684

824

105

Cap

(pF)

J

N

J

N

1000

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.01

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.056

0.068

0.082

0.1

J

Cap

(μF)

J

M

0.12

0.15

0.18

0.22

0.27

0.33

0.39

0.47

0.68

0.82

1

WVDC

25V

50V

25V

50V

25V

50V

SIZE

LD03

LD05

LD06

Letter

Max.

Thickness (0.013)

A

0.33

C

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.56

(0.022)

1.40

(0.055)

PAPER

EMBOSSED

112916

46

MLCC Tin/Lead Termination “B”

X7R – General Specifications

AVX Corporation will support those customers for

commercial and military Multilayer Ceramic Capacitors with

a termination consisting of 5ꢀ minimum lead. This

termination is indicated by the use of a “B” in the 12th

position of the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our

customers. AVX has provided in the following pages a full

range of values that we are currently offering in this special

“B” termination. Please contact the factory if you require

additional information on our MLCC Tin/Lead Termination

“B” products.

Not RoHS Compliant

PART NUMBER (see page 2 for complete part number explanation)

LD05

C

101

J

A

B

2

A

5

Size

Dielectric

X7R = C

Capacitance

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Capacitance

Tolerance

Failure

Rate

Terminations

B = 5ꢀ min lead

X = FLEXITERM^®

with 5ꢀ min

lead**

Packaging

Special

Code

A = Std.

Product

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

35V = D

50V = 5

100V = 1

200V = 2

500V = 7

LD02 - 0402

LD03 - 0603

LD04 - 0504*

LD05 - 0805

LD06 - 1206

LD10 - 1210

LD12 - 1812

LD13 - 1825

LD14 - 2225

LD20 - 2220

2 = 7" Reel

B = .10 pF (<10pF) A = Not

C = .25 pF (<10pF) Applicable

D = .50 pF (<10pF)

4 = 13" Reel

Contact Factory

For

F = 1ꢀ (≥ 10 pF)

G = 2ꢀ (≥ 10 pF)

Multiples

**X7R only

J

=

5ꢀ

K = 10ꢀ

M = 20ꢀ

See FLEXITERM^®section for CV options

*LD04 has the same CV ranges as LD03.

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

Contact factory for non-specified capacitance values.

112916

47

MLCC Tin/Lead Termination “B”

X7R – Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X7R Specification Limits

-55ºC to +125ºC

Measuring Conditions

Temperature Cycle Chamber

Within specified tolerance

≤ 10ꢀ for ≥ 50V DC rating

≤ 12.5ꢀ for 25V DC rating

≤ 12.5ꢀ for 25V and 16V DC rating

≤ 12.5ꢀ for ≤ 10V DC rating

100,000MΩ or 1000MΩ - μF,

whichever is less

Freq.: 1.0 kHz 10ꢀ

Voltage: 1.0Vrms .2V

Dissipation Factor

Charge device with rated voltage for

120 5 secs @ room temp/humidity

Charge device with 250ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Note: Charge device with 150ꢀ of rated

voltage for 500V devices.

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

No defects

Deflection: 2mm

Test Time: 30 seconds

≤

12ꢀ

Resistance to

Flexure

Meets Initial Values (As Above)

≥ Initial Value x 0.3

Stresses

≥ 95ꢀ of each terminal should be covered

with fresh solder

No defects, <25ꢀ leaching of either end terminal

Dip device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

≤

7.5ꢀ

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24

hours before measuring electrical properties.

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

2

Resistance to

Solder Heat

Meets Initial Values (As Above)

No visual defects

Appearance

Capacitance

Variation

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

≤

7.5ꢀ

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +125ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Charge device with 1.5 rated voltage (≤ 10V) in

test chamber set at 125ºC 2ºC

for 1000 hours (+48, -0)

≤

12.5ꢀ

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC 2ºC/

85ꢀ 5ꢀ relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤

12.5ꢀ

Load

Humidity

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 2 hours before measuring.

112916

48

MLCC Tin/Lead Termination “B”

Capacitance Range (X7R Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD02

LD03

LD05

LD06

Soldering

Packaging

Reflow/Wave

All Paper

Reflow/Wave

All Paper

Reflow/Wave

Paper/Embossed

mm

(in.)

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

(in.)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

(W) Width

mm

(in.)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

16

25

50

6.3

10

16

25

50

100

200

6.3

10

16

25

50

100

200

6.3

10

16

25

50

100 200

500

Cap

(pF)

100

150

220

330

470

680

C

G

J

N

J

N

J

N

J

N

K

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

K

J

P

Q

J

M

P

C

Cap

(μF

J

P

G

M

P

N

G

J

C*

G

P

Q

G

N

N*

J

M

Q

J*

M

P

Q

M

Q

J*

1.5

2.2

J*

P*

3.3

4.7

10

P*

P

P*

Q*

Q

P*

22

Q*

47

100

WVDC

16

25

50

6.3

10

16

25

50

100

200

6.3

10

16

25

50

100

200

6.3

10

16

25

50

100 200

500

SIZE

LD02

LD03

LD05

LD06

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

J

0.94

(0.037)

K

M

1.27

(0.050)

N

1.40

(0.055)

P

Q

1.78

(0.070)

X

2.29

(0.090)

Y

Z

2.79

(0.110)

0.90

(0.035)

1.02

(0.040)

1.52

(0.060)

2.54

(0.100)

PAPER

EMBOSSED

= Under Development

112916

49

MLCC Tin/Lead Termination “B”

Capacitance Range (X7R Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD10

LD12

LD13

LD20

LD14

Soldering

Reflow Only

Packaging

Paper/Embossed

All Embossed

mm

(in.)

3.20 0.20

4.50 0.30

5.70 0.40

5.72 0.25

(L) Length

(0.126 0.008)

(0.177 0.012)

(0.225 0.016)

(0.225 0.010)

mm

(in.)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

6.40 0.40

(0.252 0.016)

5.00 0.40

(0.197 0.016)

6.35 0.25

(0.250 0.010)

(W) Width

mm

(in.)

0.50 0.25

(0.020 0.010)

0.61 0.36

(0.024 0.014)

0.61 0.36

(0.024 0.014)

0.64 0.39

(0.025 0.015)

0.64 0.39

(0.025 0.015)

(t) Terminal

WVDC

10

16

25

50

100

200

500

50

100

200

500

50

100

25

50

100

200

50

100

Cap

(pF)

100

150

220

330

470

680

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

J

M

N

X

Z

J

M

N

X

Z

J

M

P

Z

J

M

X

Z

J

M

P

Cap

(μF

K

M

Z

K

M

P

Q

X

K

P

X

K

P

X

Z

M

P

X

Z

X

Z

X

M

P

X

Q

J

M

Z

M

P

Q

X

Z

P

1.5

2.2

3.3

4.7

10

22

Z

47

100

WVDC

10

16

25

50

100

200

500

50

100

200

500

50

100

25

50

100

200

50

100

SIZE

LD10

LD12

LD13

LD20

LD14

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

Z

2.79

(0.110)

2.54

(0.100)

PAPER

EMBOSSED

112916

50

MLCC Tin/Lead Termination “B”

X5R – General Specifications

AVX Corporation will support those customers for

commercial and military Multilayer Ceramic Capacitors with

a termination consisting of 5ꢀ minimum lead. This

termination is indicated by the use of a “B” in the 12th

position of the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our

customers. AVX has provided in the following pages a full

range of values that we are currently offering in this special

“B” termination. Please contact the factory if you require

additional information on our MLCC Tin/Lead Termination

“B” products.

Not RoHS Compliant

PART NUMBER (see page 2 for complete part number explanation)

LD05

D

101

J

A

B

2

A

5

Size

Dielectric

X5R = D

Capacitance

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Capacitance

Tolerance

Failure

Rate

Terminations

B = 5ꢀ min lead

X = FLEXITERM^®

with 5ꢀ min

lead**

Packaging

Special

Code

A = Std.

Product

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

35V = D

50V = 5

100V = 1

200V = 2

500V = 7

LD02 - 0402

LD03 - 0603

LD04 - 0504*

LD05 - 0805

LD06 - 1206

LD10 - 1210

LD12 - 1812

LD13 - 1825

LD14 - 2225

LD20 - 2220

2 = 7" Reel

B = .10 pF (<10pF) A = Not

C = .25 pF (<10pF) Applicable

D = .50 pF (<10pF)

4 = 13" Reel

Contact Factory

For

F = 1ꢀ (≥ 10 pF)

G = 2ꢀ (≥ 10 pF)

Multiples

**X7R only

J

=

5ꢀ

K = 10ꢀ

M = 20ꢀ

See FLEXITERM^®section for CV options

*LD04 has the same CV ranges as LD03.

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

Contact factory for non-specified capacitance values.

TYPICAL ELECTRICAL CHARACTERISTICS

Temperature Coefficient

Insulation Resistance vs Temperature

10,000

1,000

100

20

15

10

5

0

-5

-10

-15

-20

0

-60 -40

-20

0

+20 +40 +60 +80

0

20

40

60

80

100

120

Temperature °C

112916

51

MLCC Tin/Lead Termination “B”

X5R – Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X5R Specification Limits

-55ºC to +85ºC

Measuring Conditions

Temperature Cycle Chamber

Within specified tolerance

≤ 2.5ꢀ for ≥ 50V DC rating

≤ 3.0ꢀ for 25V, 35V DC rating

≤ 12.5ꢀ Max. for 16V DC rating and lower

Contact Factory for DF by PN

10,000MΩ or 500MΩ - μF,

whichever is less

Freq.: 1.0 kHz 10ꢀ

Voltage: 1.0Vrms .2V

For Cap > 10 μF, 0.5Vrms @ 120Hz

Dissipation Factor

Charge device with rated voltage for

120 5 secs @ room temp/humidity

Charge device with 250ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

No defects

Deflection: 2mm

Test Time: 30 seconds

≤

12ꢀ

Resistance to

Flexure

Meets Initial Values (As Above)

≥ Initial Value x 0.3

Stresses

≥ 95ꢀ of each terminal should be covered

with fresh solder

No defects, <25ꢀ leaching of either end terminal

Dip device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

≤

7.5ꢀ

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24

hours before measuring electrical properties.

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

2

Resistance to

Solder Heat

Meets Initial Values (As Above)

No visual defects

Appearance

Capacitance

Variation

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

≤

7.5ꢀ

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +85ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 2 hours at room temperature

Charge device with 1.5X rated voltage in

test chamber set at 85ºC 2ºC for 1000 hours

(+48, -0). Note: Contact factory for *optional

specification part numbers that are tested at

< 1.5X rated voltage.

Meets Initial Values (As Above)

No visual defects

≤

12.5ꢀ

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC 2ºC/

85ꢀ 5ꢀ relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤

12.5ꢀ

Load

Humidity

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 2 hours before measuring.

112916

52

MLCC Tin/Lead Termination “B”

Capacitance Range (X5R Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD02

LD03

LD05

LD06

LD10

LD12

Soldering

Packaging

Reflow/Wave

All Paper

Reflow/Wave

All Paper

Reflow/Wave

Paper/Embossed

mm

(in.)

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

(in.)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

(W) Width

mm

(in.)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

4

6.3 10 16 25 50

4

6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50

4

6.3 10 16 25 35 50 6.3 10 25 50

Cap

(pF)

100

150

220

C

330

470

680

C

1000

1500

2200

C

3300

4700

6800

C

G

Cap

(μF)

0.010

0.015

0.022

C

G

C

N

0.033

0.047

0.068

C

G

N

0.10

0.15

0.22

C

G

N

C*

C* C*

G

Q

0.33

0.47

0.68

G

N

Q

X

1.0

1.5

2.2

C* C* C*

C*

G

J*

N

P*

Q

X

Z

X

G* G* J* J*

N

Q

3.3

4.7

10

J* J* J* J*

J* J* J*

K*

N

P

N

P

X

N* N*

P

X

Q

Z

X

Z

22

47

100

P*

X

Z

Z*

Z

Z*

4

WVDC

4

6.3 10 16 25 50

4

6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50

6.3 10 16 25 35 50 6.3 10 25 50

SIZE

LD02

LD03

LD05

LD06

LD10

LD12

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

*Optional Specifications – Contact factory

NOTE: Contact factory for non-specified capacitance values

112916

53

MLCC Low Profile

General Specifications

GENERAL DESCRIPTION

AVX introduces the LT series comprising a range of low

profile products in our X5R and X7R dielectric. X5R is a

Class II dielectric with temperature varation of

capacitance within 15ꢀ from –55ꢁC to +85ꢁC. Offerings

include 0201, 0402, 0603, 0805 1206, and 1210

packages in compact, low profile designs. The LT series

is ideal for decoupling and filtering applications where

height clearance is limited.

AVX is also expanding the low profile products in our X7R

dielectric. X7R is a Class II dielectric with temperature

variation of capacitance within 15ꢀ from -55ºC to

+125ºC. Please contact the factory for availability of any

additional values not listed.

PART NUMBER (see page 2 for complete part number explanation)

LT05

Z

D

475

K

A

T

2

S

Size

Voltage

4V = 4

6.3V = 6

10V = Z

16V = Y

25V = 3

Dielectric

X5R = D

X7R = C

Capacitance Capacitance

Failure

Rate

A = Not

Applicable

Special

Code

See table below

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

K = 10ꢀ

M = 20ꢀ

LT01 - 0201

LT02 - 0402

LT03 - 0603

LT05 - 0805

LT06 - 1206

LT10 - 1210

4 = 13" Reel

Contact

Factory

For

Multiples

NOTE: Contact factory for availability of tolerance options for specific part numbers.

SIZE

LT01

LT02

LT03

LT05

LT06

LT10

WVDC

4

Z

6.3

4

6.3

Q

10

16

S

4

6.3

16

25

6.3

10

16

25

X

6.3

10

X

16

25

50

W

16

25

Cap

(μF)

0.10

0.22

0.47

1.0

Z

X

Q

C

S

X

1.5

2.2

C

S

X

S

X

4.7

S

4

X

W

10

W

22

47

WVDC

4

6.3

4

6.3

10

16

6.3

16

25

6.3

10

16

25

6.3

10

16

25

50

16

25

SIZE

LT01

LT02

LT03

LT05

LT06

LT10

= X7R

Letter

Max.

Thickness (0.006)

J

0.15

Z

0.22

(0.009)

Q

0.25

(0.010)

C

0.36

(0.014)

S

0.56

(0.022)

X

0.95

(0.038)

W

1.02

(0.040)

EMBOSSED

PAPER

REV 01

54

Automotive MLCC

Automotive

GENERALDESCRIPTION

AVX Corꢀoration has suꢀꢀorted the Automotive Industry requirements for Multilayer

Ceramic Caꢀacitors consistently for more than 10 years. Products have been de- veloꢀed

and tested sꢀecifically for automotive aꢀꢀlications and all manufacturing facilities are

QS9000 and VDA 6.4aꢀꢀroved.

As ꢀart of our sustained investment in caꢀacity and state of the art technology, we are now

transitioning from the established PdꢇAg electrode system to a Base Metal Electrode

system(BME).

AVX is using AECQ200 as the qualification vehicle for this transition. A detailed qualification

ꢀackage is available on request and contains results on a range of ꢀart numbers including:

• X7R dielectric comꢀonents containing BME electrode and coꢀꢀer

terminations with a NiꢇSn ꢀlated overcoat.

• X7R dielectric comꢀonents, BME electrode with eꢀoxy finish for conductive glue mounting.

• X7R dielectric comꢀonents BME electrode and soft terminations with a NiꢇSn ꢀlated over-

coat.

• NP0 dielectric comꢀonents containing PdꢇAg electrode and silver termination with a NiꢇSn

ꢀlated overcoat.

HOW TO ORDER

0805

5

A

104

K

4

2

A

T

Size

0402

0603

0805

1206

1210

1812

Voltage

10V =Z

Failure Rate

Packaging

2 = 7" Reel

Special Code

Capacitance

Code (InpF)

2Significant

Capacitance

Tolerance

p = 1ꢂ

Dielectric

NP0 = A

X7R = C

X8R =p

Terminations

4=Automotive

A = Std. Product

T = Plated Ni and Sn

®

16V =Y

4 =13" Reel

Z =pLEXITERM %%

Digits + Numberof

Zeros

ꢀꢁꢂS)ꢃꢄꢅꢅ

G = 2ꢂ

25V =3

U =Conductive Eꢀoxy%%

%%X7R X8Ronly

50V =5

e.g. 10 p =106

ꢀꢁꢂS)ꢃꢄꢅꢅ

J = 5ꢂ

100V =1

200V =2

250V = V

500V =7

ꢀꢁ)ꢃꢅꢅ

K = 10ꢂ

M = 20ꢂ

%NPOonly

Contact factory for availability of Tolerance Oꢀtions for Sꢀecific PartNumbers.

NOTE: Contact factory for non-sꢀecified caꢀacitancevalues.

0402 case size available in T termination only.

COMMERCIAL VS AUTOMOTIVE MLCC PROCESS COMPARISON

Commercial

Standard PartNumbers.

No restriction on who purchases these parts.

Automotive

Administrative

Design

Specific Automotive Part Number. sed tocontrol

supply of product to Automotivecustomers.

Minimum Ceramic thickness of 0.029" (0.74mm)

on all X7R product.

Minimum ceramic thickness of 0.020"

Side & End Margins = 0.004" min

Cover Layers = 0.00±" min

Dicing

Side & End Margins = 0.00±" min

As per EIARS469

Lot Qualification

(Destructive Physical

Analysis - DPA)

Increased sample plan

stricter criteria.

Visual/Cosmetic Quality

Application Robustness

Standard process and inspection

100ꢁ inspection

Standard sampling for accelerated

wave solder on X7R dielectrics

Increased sampling for accelerated wave solder on

X7R and NP0 followed by lot by lot reliability testing.

All Tests have Accept/Re ect Criteria0/1

112817

55

Automotive MLCC

NP0/X7R Dielectric

FLEXITERM FEATURES

a) Bend Test

b) Temꢀerature Cycle testing

®

The caꢀacitor is soldered to the PC Board as shown:

pLEXITERM has the ability to withstand at least 1000 cycles be-

tween –55°C and +125°C

Tyꢀical bend test results are shown below:

Style

0603

0805

1206

Conventional Term

ꢅ2mm

Sof

t

T

erm

ꢅ5

ꢅ2mm

112817

56

Automotive MLCC-NP0

Capacitance Range

0402

0603

0805

1206

Soldering ReflowꢇWave

ReflowꢇWave

25V

C

50V

C

25V

G

50V

G

100V

G

200V 25V

50V

J

100V

J

200V

250V 25V

50V

J

100V

J

200V

J

250V 500V

100 10ꢀp

G

J

N

J

120

150

180

220

270

330

390

470

510

560

680

820

12

15

18

22

27

33

39

47

51

56

68

82

C

J

C

J

C

J

C

J

C

J

C

J

C

J

101 100

121 120

151 150

181 180

221 220

271 270

331 330

391 390

471 470

561 560

681 680

821 820

102 1000

122 1200

152 1500

182 1800

222 2200

272 2700

332 3300

392 3900

472 4700

103 10np

J

25V

50V

25V

50V

100V

200V 25V

50V

100V

200V

250V 25V

50V

100V

200V

250V 500V

0402

0603

0805

1206

Letter

Max.

A

C

E

G

J

K

M

N

P

Q

X

Y

Z

0.±±

0.56

0.71

0.90

0.94

1.02

(0.040)

1.27

1.40

(0.055)

1.52

1.78

(0.070)

2.29

2.54

2.79

Thickness (0.01±)

(0.022)

(0.028)

PAPER

(0.0±5)

(0.0±7)

(0.050)

(0.060)

EMBOSSED

(0.090)

(0.100)

(0.110)

112817

57

Automotive MLCC-X7R

Capacitance Range

0402

0603

0805

1206

1210

1812

2220

Soldering

ReflowꢇWave

Reflow Only

16V 25V 50V 10V 16V 25V 50V 100V 200V 250V 16V 25V 50V 100V 200V 250V 16V 25V 50V 100V 200V 250V 500V 16V 25V 50V 100V 50V 100V 25V 50V 100V

221

Caꢀ 220

(ꢀp) 270

C

271

331

391

471

561

681

821

102

182

222

332

472

330

390

C

470

560

680

820

1000

1800

2200

3300

4700

G

J

K

G

103 Caꢀ 0.01

C

G

J

K

123 (p) 0.012

C

G

J

N

J

K

153

183

223

273

333

473

563

683

823

104

124

154

224

334

474

684

105

155

225

335

475

106

226

0.015

0.018

0.022

0.027

0.033

0.047

0.056

0.068

0.082

0.01

0.12

0.15

0.22

0.33

0.47

0.68

1

C

G

J

N

J

K

M

P

X

Z

K

M

P

Q

Z

K

M

P

Q

Z

K

M

P

Q

X

Z

K

M

X

Z

K

M

X

Z

J

M

Q

M

Q

M

Q

J

M

N

J

M

P

Q

M

N

J

G

J

M

Q

J

M

Q

Z

1.5

2.2

Z

3.3

Z

4.7

Z

10

Z

22

25V

10V 16V

16V 25V

100V 200V 250V 16V 25V

⁵0^0V805

16V

100V 50V 100V

50V

^16V0402 ^50V

^25V0⁵6⁰0^V3^{100V 200V 250V}

^50V1¹2⁰0^0V6^{200V 250V 500V}

²1^5V21⁵0^0V

1812 ^25V2220^100V

Letter

A

C

E

G

J

K

M

N

P

Q

X

Y

Z

Max.

0.±±

0.56

0.71

0.90

0.94

1.02

1.27

1.40

1.52

1.78

2.29

2.54

2.79

Thickness (0.01±)

(0.022)

(0.028)

PAPER

(0.0±5)

(0.0±7)

(0.040)

(0.050)

(0.055)

(0.060)

EMBOSSED

(0.070)

(0.090)

(0.100)

(0.110)

112817

58

Automotive MLCC-X8R

Capacitance Range

SIZE

0603

0805

1206

Soldering

ReflowꢇWave

WVDC

270

25V

G

50V

G

25V

50V

25V

50V

271

Caꢀ

(ꢀp)

331

471

681

102

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

684

824

105

330

G

J

N

470

680

J

1000

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.01

J

Caꢀ

J

( p) 0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.056

0.068

0.082

0.1

J

N

M

0.12

0.15

0.18

0.22

0.27

0.33

0.39

0.47

0.68

0.82

1

WVDC

25V

50V

25V

50V

25V

50V

SIZE

0603

0805

1206

Letter

Max.

A

C

E

G

J

K

M

N

P

Q

X

Y

Z

0.±±

0.56

0.71

0.90

0.94

1.02

1.27

1.40

1.52

(0.060)

1.78

2.29

2.54

2.79

Thickness (0.01±)

(0.022)

(0.028)

PAPER

(0.0±5)

(0.0±7)

(0.040)

(0.050)

(0.055)

(0.070)

(0.090)

(0.100)

(0.110)

EMBOSSED

112817

59

APS COTS+ for High Reliability Applications

Surface Mount NPO, X7R and X8R/L MLCCs

AVX’s APS COTS+ series of multilayer ceramic capacitors offers the customer a

high reliability solution with an ultralow failure rate, ≤1ppb, in a variety of case sizes

and voltages. The APS range encompasses a wide range of dielectric types to

meet the customer’s requirements from low temperature/voltage capacitance

change dielectric, NPO, to high preforming capacitance voltage X7R to high

temperature reliability dielectrics, X8R/L.

APS capacitors have a wider capacitance range than MIL spec parts that satisfies

the need for higher CV demands and board space saving requirements. Each

production lot is extensively tested and removes the requirement for customer

specific drawings. The testing regime uses many of the MIL-STD test methods as

per MIL-PRF-55681 and has a field failure rate of less than 1 ppb. The APS testing

series uses AVX’s unique in-house maverick testing detection system that

eliminates infant mortality failures.

Applications suitable for APS include Industrial, Telecommunications, Aviation, and

Military. The APS is available with a range of different termination finishes,

Flexiterm^®, Nickel / Tin and Tin with Pb¹. Flexiterm^®technology delivers improved

thermo-mechanical stress resistance.

Dielectric

NPO

Temperature/Percentage Cap Change

-30ppm +30ppm from -55ꢁC to + 125ꢁC

-15ꢀ +15ꢀ from -55ꢁC to + 125ꢁC

-15ꢀ +15ꢀ from -55ꢁC to + 150ꢁC

-15ꢀ +40ꢀ from -55ꢁC to + 150ꢁC

AVX’S APS RELIABILITY

TEST SUMMARY

X7R

X8R

X8L

• 100 ꢀ Visual Inspection

• DPA

• IR, DF, Cap, DWV

• Maverick Lot Review

• Thermal Shock

FEATURES

• The APS range has been extensively reliability tested as standard resulting in an

ultralow failure rate, ≤1ppb.

• The APS range is available with Flexiterm^®that deliver’s high thermo-mechanical

• 85/85 Testing

• Life Testing 125ꢁC 2xRV

• C of C with every Order

• Quarterly Data Package

stress resistance.

• High CV range enabling board space saving requirements.

HOW TO ORDER

AP03

5

A

104

K

Q

2

A

T

Size

Voltage Dielectric

Capacitance

Code (In pF)

2 Significant Digits +

Number of Zeros

e.g. 10μF = 106

Capacitance Failure Rate

Packaging

2 = 7" Reel

4 = 13" Reel

Special Code

A = Std. Product

Terminations

T = Plated Ni and Sn**

Z = FLEXITERM^®**

B =10ꢀ min lead

X = FLEXITERM^®with

10ꢀ min lead

Tolerance

J = 5ꢀ

AP03=0603

AP05=0805

AP06=1206

16V = Y

25V = 3

50V = 5

NP0 = A

X7R = C

X8R = F

X8L = L

Q = APS

K = 10ꢀ

M = 20ꢀ

AP10=1210 100V = 1

AP12=1812 200V = 2

AP20=2220 500V = 7

Z,X for X7R only

**RoHS compliant

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

082917

60

APS COTS+ NP0 Series

Capacitance Range

AP03 = 0603

AP05 = 0805

AP06 = 1206

AP10 = 1210

25V

50V

G

100V

G

25V

50V

J

100V

J

25V

J

50V

100V

J

200V

J

500V

25V

50V

100V

200V

100

120

150

180

220

270

330

390

470

510

560

680

820

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

103

10pF

12

15

18

22

27

33

39

47

51

56

68

82

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

10nF

G

J

M

25V

50V

100V

25V

50V

100V

25V

50V

100V

200V

500V

25V

50V

100V

200V

Y

2.54

(0.100)

AP03 = 0603

AP05 = 0805

AP06 = 1206

AP10 = 1210

Letter

Max.

Thickness (0.013)

A

C

0.56

E

G

0.90

(0.035)

J

0.94

(0.037)

K

M

1.27

(0.050)

N

1.40

(0.055)

P

Q

X

2.29

(0.090)

Z

2.79

(0.110)

0.33

0.71

(0.028)

1.02

1.52

(0.060)

1.78

(0.070)

(0.022)

(0.040)

PAPER

EMBOSSED

TS 16949, ISO 9001Certified

082917

61

APS COTS+ X7R Series

Capacitance Range

AP03 = 0603

25V 50V 100V 200V 16V

AP05 = 0805

25V 50V 100V 200V 16V

AP06 = 1206

AP10 = 1210

AP12 = 1812

AP20 = 2220

50V 100V

16V

G

25V

J

50V 100V 200V 500V 16V

25V

K

M

P

Q

Z

50V 100V 50V 100V 25V

102 Cap 1000

182 (pF) 1800

G

J

K

M

P

X

K

M

P

Q

Z

K

M

P

Q

X

K

M

X

K

M

X

222

332

472

103

123

153

183

223

273

333

473

563

683

823

104

124

154

224

334

474

684

2200

3300

4700

0.01

J

0.012

0.015

0.018

0.022

0.027

0.033

0.047

0.056

0.068

0.082

0.1

0.12

0.15

0.22

0.33

0.47

0.68

J

N

J

M

N

J

M

Q

J

M

Q

J

M

N

J

M

P

Q

M

N

M

Q

X

105 Cap 1.0

155 (μF) 1.5

X

Z

X

225

335

475

106

226

2.2

3.3

4.7

10

Z

X

Z

22

Z

16V

25V

50V 100V 200V 16V

25V

50V 100V 200V 16V

25V

50V 100V 200V 500V 16V

25V

50V 100V 50V 100V 25V

50V 100V

AP03 = 0603

AP05 = 0805

AP06 = 1206

AP10 = 1210

AP12 = 1812

AP20 = 2220

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

TS 16949, ISO 9001Certified

082917

62

APS COTS+ X8R/L Series

Capacitance Range

X8R

X8L

SIZE

AP03 = 0603

AP05 = 0805

AP06 = 1206

SIZE

AP03 = 0603

AP05 = 0805

AP06 = 1206

WVDC

25V

G

50V

G

25V

J

50V

J

25V

50V

WVDC

25V

50V

G

100V

25V

50V

J

100V

16V

25V

50V

100V

331

471

681

102

152

222

332

472

682

103

153

223

333

473

683

104

154

224

334

474

684

105

Cap

(pF)

330

470

680

1000

1500

2200

3300

4700

6800

331

471

681

102

152

222

332

472

682

103

153

223

333

473

683

104

154

224

334

474

684

105

Cap

(pF)

330

470

680

1000

1500

2200

3300

4700

6800

G

J

N

J

P

J

M

Q

J

Cap 0.01

(μF) 0.015

0.022

0.033

0.047

0.068

0.1

J

Cap 0.01

(μF) 0.015

0.022

0.033

0.047

0.068

0.1

J

G

J

N

M

J

0.15

0.22

0.33

0.47

0.15

0.22

0.33

0.47

J

N

J

M

16V

J

M

N

0.68

1

WVDC

25V

50V

25V

50V

25V

50V

WVDC

25V

50V

100V

25V

50V

100V

25V

50V

100V

SIZE

0603

0805

1206

SIZE

0603

0805

1206

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

Y

2.54

(0.100)

Z

2.29

(0.090)

2.79

(0.110)

PAPER

EMBOSSED

TS 16949, ISO 9001Certified

082917

63

MLCC with FLEXITERM^®

General Specifications

GENERAL DESCRIPTION

With increased requirements from the automotive industry for additional

component robustness, AVX recognized the need to produce a MLCC with

enhanced mechanical strength. It was noted that many components may be

subject to severe flexing and vibration when used in various under the hood

automotive and other harsh environment applications.

To satisfy the requirement for enhanced mechanical strength, AVX had to

find a way of ensuring electrical integrity is maintained whilst external forces

are being applied to the component. It was found that the structure of the

termination needed to be flexible and after much research and development,

AVX launched FLEXITERM^®. FLEXITERM^®is designed to enhance the

mechanical flexure and temperature cycling performance of a standard

ceramic capacitor with an X7R dielectric. The industry standard for

flexure is 2mm minimum. Using FLEXITERM^®, AVX provides up to

5mm of flexure without internal cracks. Beyond 5mm, the capacitor

will generally fail “open”.

As well as for automotive applications FLEXITERM^®will provide Design

Engineers with a satisfactory solution when designing PCB’s which may be

subject to high levels of board flexure.

APPLICATIONS

High Flexure Stress Circuit Boards

• e.g. Depanelization: Components near edges

of board.

PRODUCT ADVANTAGES

• High mechanical performance able to withstand, 5mm bend test

guaranteed.

• Increased temperature cycling performance, 3000 cycles and beyond.

• Flexible termination system.

• Reduction in circuit board flex failures.

Variable Temperature Applications

• Soft termination offers improved reliability per-

formance in applications where there is tem-

perature variation.

• e.g. All kind of engine sensors: Direct

connection to battery rail.

Automotive Applications

• Base metal electrode system.

• Automotive or commercial grade products available.

• Improved reliability.

• Excellent mechanical performance and

thermo mechanical performance.

HOW TO ORDER

0805

5

C

104

K

2

A

Z

Style

0603

0805

1206

1210

1812

2220

Voltage

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

2 = 200V

Dielectric

C = X7R

F = X8R

Capacitance

Code (In pF)

Capacitance

Tolerance

J = 5ꢀ*

K = 10ꢀ

M = 20ꢀ

Packaging

2 = 7" reel

4 = 13" reel

Special Code

A = Std. Product

Failure

Rate

A=Commercial

4 = Automotive

Terminations

Z = FLEXITERM^®

2 Sig Digits +

For FLEXITERM^®

with Tin/Lead

termination see

AVX LD Series

Number of Zeros

e.g., 104 = 100nF

*≤1μF only

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

020117

64

MLCC with FLEXITERM^®

Specifications and Test Methods

BOARD BEND TEST PROCEDURE

PERFORMANCE TESTING

According to AEC-Q200

AEC-Q200 Qualification:

• Created by the Automotive Electronics

Council

Test Procedure as per AEC-Q200:

Sample size:

Span: 90mm

20 components

LOADING

KNIFE

Minimum deflection spec: 2 mm

• Specification defining stress

test qualification for

passive components

• Components soldered onto FR4 PCB (Figure 1)

• Board connected electrically to the test equipment

(Figure 2)

MOUNTING

ASSEMBLY

DIGITAL

CALIPER

Testing:

BEND TESTPLATE

Key tests used to compare

soft termination to

AEC-Q200 qualification:

• Bend Test

CONNECTOR

CONTROL

PANEL

CONTROL PANEL

• Temperature Cycle Test

Fig 2 - Board Bend test

equipment

Fig 1 - PCB layout with electrical connections

BOARD BEND TEST RESULTS

AEC-Q200 Vrs AVX FLEXITERM^®Bend Test

0603

0805

12

10

8

6

4

2

12

10

8

6

4

2

AVX ENHANCED SOFT

TERMINATION BEND TEST

PROCEDURE

0

NPO

X7R

X7R soft term

NPO

X7R

X7R soft term

Bend Test

The capacitor is soldered to the printed circuit

board as shown and is bent up to 10mm at

1mm per second:

1210

1206

12

10

8

12

10

8

6

4

2

0

6

4

2

0

Max. = 10mm

NPO

X7R

X7R soft term

NPO

X7R

X7R soft term

TABLE SUMMARY

90mm

Typical bend test results are shown below:

Style

0603

0805

1206

Conventional Termination

FLEXITERM^®

>5mm

>2mm

• The board is placed on 2 supports 90mm

apart (capacitor side down)

• The row of capacitors is aligned with the

load stressing knife

>5mm

TEMPERATURE CYCLE TEST PROCEDURE

Test Procedure as per AEC-Q200:

Max. = 10mm

The test is conducted to determine the resistance of the

component when it is exposed to extremes of alternating

high and low temperatures.

• Sample lot size quantity 77 pieces

• TC chamber cycle from -55ºC to +125ºC for 1000 cycles

• Interim electrical measurements at 250, 500, 1000 cycles

• Measure parameter capacitance dissipation factor,

insulation resistance

• The load is applied and the deflection where

the part starts to crack is recorded (Note:

Equipment detects the start of the crack

using a highly sensitive current detection

circuit)

Test Temperature Profile (1 cycle)

• The maximum deflection capability is 10mm

020117

65

MLCC with FLEXITERM^®

Specifications and Test Methods

BEYOND 1000 CYCLES: TEMPERATURE CYCLE TEST RESULTS

0603

0805

10

8

10

8

6

4

2

0

500 1000 1500 2000 2500 3000

0

500 1000 1500 2000 2500 3000

1206

1210

10

8

10

8

6

4

2

0

500 1000 1500 2000 2500 3000

0

500 1000 1500 2000 2500 3000

AEC-Q200 specification states

1000 cycles compared to AVX

3000 temperature cycles.

Soft Term - No Defects up to 3000 cycles

FLEXITERM® TEST SUMMARY

• Qualified to AEC-Q200 test/specification with the exception • Board bend test improvement by a factor of 2 to 4 times.

of using AVX 3000 temperature cycles (up to +150ꢁC bend

• Temperature Cycling:

test guaranteed greater than 5mm).

– 0ꢀ Failure up to 3000 cycles

• FLEXITERM^®provides improved performance compared to

– No ESR change up to 3000 cycles

standard termination systems.

WITHOUT SOFT TERMINATION

WITH SOFT TERMINATION

Major fear is of latent board flex failures.

Far superior mechanical performance.

Generally open failure mode beyond

5mm flexure.

020117

66

MLCC with FLEXITERM^®

X8R Dielectric Capacitance Range

SIZE

0603

0805

1206

Soldering

Reflow/Wave

WVDC

270

330

470

680

1000

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.01

25V

50V

G

25V

50V

25V

50V

271

331

471

681

102

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

684

824

105

Cap

(pF)

G

J

N

J

N

J

Cap

(μF)

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.056

0.068

0.082

0.1

J

M

0.12

0.15

0.18

0.22

0.27

0.33

0.39

0.47

0.68

0.82

1

WVDC

25V

50V

25V

50V

25V

50V

SIZE

0603

0805

1206

Letter

Max.

Thickness (0.013)

A

0.33

C

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.56

(0.022)

PAPER

EMBOSSED

AEC-Q200 Qualified

020117

67

MLCC with FLEXITERM^®

X7R Dielectric Capacitance Range

0402

0603

0805

1206

1210

1812

2220

Soldering

Reflow/Wave

Reflow Only

16V

25V

C

50V

10V

16V

25V

50V 100V 200V 250V 16V

25V

50V 100V 200V 250V 16V

25V

50V 100V 200V 250V 500V 16V

25V

50V 100V 50V 100V 25V 50V 100V

221 Cap 220

271 (pF) 270

C

331

391

471

561

681

821

102

182

222

332

472

330

390

470

560

680

820

1000

1800

2200

3300

4700

G

J

K

M

P

X

K

M

P

Q

Z

K

M

P

Q

Z

K

M

P

Q

X

K

M

X

K

M

X

J

103 Cap 0.01

123 (μF) 0.012

J

M

N

J

M

N

153

183

223

273

333

473

563

683

823

104

124

154

224

334

474

684

105

155

225

335

475

106

226

0.015

0.018

0.022

0.027

0.033

0.047

0.056

0.068

0.082

0.1

0.12

0.15

0.22

0.33

0.47

0.68

1

J

M

Q

J

M

Q

J

M

N

J

M

P

Q

N

G

M

Q

X

Z

X

1.5

2.2

3.3

4.7

10

22

X

Z

X

Z

16V

25V

50V

10V

16V

25V

50V 100V 200V 250V 16V

25V

50V 100V 200V 250V 16V

25V

50V 100V 200V 250V 500V 16V

25V

50V 100V 50V 100V 25V 50V 100V

0402

0603

0805

1206

1210

1812

2220

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

020117

68

FLEXISAFE MLC Chips

For Ultra Safety Critical Applications

AVX have developed a range of components specifically for safety

critical applications.

Utilizing the award-winning FLEXITERM™ layer in conjunction with the

cascade design previously used for high voltage MLCCs, a range of

ceramic capacitors is now available for customers who require

components designed with an industry leading set of safety features.

The FLEXITERM™ layer protects the component from any damage to

the ceramic resulting from mechanical stress during PCB assembly or

use with end customers. Board flexure type mechanical damage

accounts for the majority of MLCC failures. The addition of the cascade

structure protects the component from low insulation resistance failure

resulting from other common causes for failure; thermal stress damage,

repetitive strike ESD damage and placement damage. With the inclusion

of the cascade design structure to complement the FLEXITERM™ layer,

the FLEXISAFE range of capacitors has unbeatable safety features.

HOW TO ORDER

C

104

K

Q

Z

2

A

FS03

5

Dielectric

X7R = C

Capacitance

Code (In pF)

2 Sig. Digits +

Number of

Capacitance

Tolerance

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

Failure

Rate

A = Commercial

4 = Automotive

Q = APS

Terminations

Z = FLEXITERM^TM

^*X = FLEXITERM^TM

with 5ꢀ min lead

Packaging

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Std. Product

Size

Voltage

16V = Y

25V = 3

50V = 5

100V = 1

FS03 = 0603

FS05 = 0805

FS06 = 1206

FS10 = 1210

Zeros

e.g. 10μF =106

*Not RoHS Compliant

FLEXISAFE X7R RANGE

Capacitance

FS03 = 0603

Code

FS05 = 0805

Reflow/Wave

25 50

FS06 = 1206

FS10 = 1210

Soldering

Reflow/Wave

Reflow Only

16

25

50

100

16

100

16

25

50

16

25

50

102 μF 0.001

182

222

332

472

103

123

153

183

223

273

333

473

563

683

823

104

124

154

224

334

474

0.0018

0.0022

0.0033

0.0047

0.01

0.012

0.015

0.018

0.022

0.027

0.033

0.047

0.056

0.068

0.082

0.1

0.12

0.15

0.22

0.33

0.47

Qualified

061416

69

Capacitor Array

Capacitor Array (IPC)

BENEFITS OF USING CAPACITOR

ARRAYS

AVX capacitor arrays offer designers the opportunity to

lower placement costs, increase assembly line output

through lower component count per board and to reduce

real estate requirements.

For high volume users of cap arrays using the very latest

placement equipment capable of placing 10 components per

second, the increase in throughput can be very significant and

can have the overall effect of reducing the number of place-

ment machines required to mount components:

Reduced Costs

Placement costs are greatly reduced by effectively placing

one device instead of four or two. This results in increased

throughput and translates into savings on machine time.

Inventory levels are lowered and further savings are made

on solder materials, etc.

If 120 million 2-element arrays or 40 million 4-element arrays

were placed in a year, the requirement for placement

equipment would be reduced by one machine.

During a 20Hr operational day a machine places 720K

components. Over a working year of 167 days the machine

can place approximately 120 million. If 2-element arrays are

mounted instead of discrete components, then the number

of placements is reduced by a factor of two and in the

scenario where 120 million 2-element arrays are placed there

is a saving of one pick and place machine.

Space Saving

Space savings can be quite dramatic when compared to

the use of discrete chip capacitors. As an example, the

0508 4-element array offers a space reduction of >40ꢀ vs.

4 x 0402 discrete capacitors and of >70ꢀ vs. 4 x 0603

discrete capacitors. (This calculation is dependent on the

spacing of the discrete components.)

Smaller volume users can also benefit from replacing

discrete components with arrays. The total number of place-

ments is reduced thus creating spare capacity on placement

machines. This in turn generates the opportunity to increase

overall production output without further investment in new

equipment.

Increased Throughput

Assuming that there are 220 passive components placed in a

mobile phone:

A reduction in the passive count to 200 (by replacing

discrete components with arrays) results in an increase in

throughput of approximately 9ꢀ.

A reduction of 40 placements increases throughput by 18ꢀ.

W2A (0508) Capacitor Arrays

4 pcs 0402 Capacitors

=

1 pc 0508 Array

1.88

(0.074)

1.4

1.0

(0.055) (0.039)

5.0 (0.197)

AREA = 7.0mm (0.276 in )

2.1 (0.083)

AREA = 3.95mm (0.156 in )

2

The 0508 4-element capacitor array gives a PCB space saving of over 40ꢀ

vs four 0402 discretes and over 70ꢀ vs four 0603 discrete capacitors.

W3A (0612) Capacitor Arrays

4 pcs 0603 Capacitors

=

1 pc 0612 Array

1.60

(0.063)

2.3

(0.091)

1.5

(0.059)

6.0 (0.236)

AREA = 13.8mm (0.543 in )

3.2 (0.126)

AREA = 6.4mm (0.252 in )

2

The 0612 4-element capacitor array gives a PCB space saving of over 50ꢀ

vs four 0603 discretes and over 70ꢀ vs four 0805 discrete capacitors.

032417

70

Capacitor Array

Capacitor Array (IPC)

GENERAL DESCRIPTION

AVX is the market leader in the development and manufacture of

capacitor arrays. The array family of products also includes the 0612

4-element device as well as 0508 2-element and 4-element series,

all of which have received widespread acceptance in the

marketplace.

0508 - 2 Element

AVX capacitor arrays are available in X5R, X7R and NP0 (C0G)

ceramic dielectrics to cover a broad range of capacitance values.

Voltage ratings from 6.3 Volts up to 100 Volts are offered. AVX

also now offers a range of automotive capacitor arrays qualified to

AEC-Q200 (see separate table).

Key markets for capacitor arrays are Mobile and Cordless Phones,

Digital Set Top Boxes, Computer Motherboards and Peripherals

as well as Automotive applications, RF Modems, Networking

Products, etc.

0612 - 4 Element

0508 - 4 Element

AVX Capacitor Array - W2A41A***K

S21 Magnitude

0

-5

-10

-15

-20

-25

5pF

10pF

22pF

39pF

15pF

33pF

68pF

-30

-35

-40

0.01

0.1

1

10

Frequency (GHz)

HOW TO ORDER

W

2

A

4

3

C

103

M

2A

A

T

Style

W = RoHS

L = SnPb

Case

Size

2 = 0508

3 = 0612

Array

Number

of Caps

2 = 2 Element

4 = 4 Element

Voltage Dielectric Capacitance Capacitance

Packaging &

Quantity

Code

Failure

Rate

A = Commercial

4 = Automotive

Termination

Code

2 Sig Digits +

Number of

Zeros

Tolerance

J = 5ꢀ

6 = 6V

A = NP0

C = X7R

D = X5R

*T = Plated Ni

and Sn

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

2A = 7" Reel

(4000)

K = 10ꢀ

M = 20ꢀ

*Z = FLEXITERM^®

*B = 5ꢀ min lead

*X = FLEXITERM^®

with 5ꢀ min

lead

4A = 13" Reel

(10000)

2F = 7" Reel

(1000)

*RoHS Compliant

*Not RoHS Compliant

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

032417

71

Capacitor Array

Capacitance Range – NP0/C0G

SIZE

# Elements

Soldering

W2 = 0508

W3 = 0612

4

Reflow/Wave

Paper/Embossed

Reflow/Wave

Paper/Embossed

Packaging

mm

(in.)

1.30 0.15

(0.051 0.006)

1.60 0.150

(0.063 0.006)

Length

mm

(in.)

2.10 0.15

(0.083 0.006)

3.20 0.20

(0.126 0.008)

Width

Max.

Thickness

mm

(in.)

0.94

(0.037)

1.35

(0.053)

WVDC

Cap 1.0

16

25

50

16

25

50

1R0

1R2

1R5

(pF)

1.2

1.5

1R8

2R2

2R7

1.8

2.2

2.7

3R3

3R9

4R7

3.3

3.9

4.7

5R6

6R8

8R2

5.6

6.8

8.2

100

120

150

10

12

15

180

220

270

18

22

27

330

390

470

33

39

47

560

680

820

56

68

82

101

121

151

100

120

150

181

221

271

180

220

270

331

391

471

330

390

470

561

681

821

560

680

820

102

122

152

1000

1200

1500

182

222

272

1800

2200

2700

332

392

472

3300

3900

4700

562

682

822

5600

6800

8200

= Supported Values

032417

72

Capacitor Array

Capacitance Range – X7R

SIZE

# Elements

Soldering

W2 = 0508

W3 = 0612

2

4

Reflow/Wave

All Paper

Reflow/Wave

Paper/Embossed

Reflow/Wave

Paper/Embossed

Packaging

mm

(in.)

1.30 0.15

(0.051 0.006)

1.30 0.15

(0.051 0.006)

1.60 0.150

(0.063 0.006)

Length

mm

(in.)

2.10 0.15

(0.083 0.006)

2.10 0.15

(0.083 0.006)

3.20 0.20

(0.126 0.008)

Width

Max.

Thickness

mm

(in.)

0.94

(0.037)

0.94

(0.037)

1.35

(0.053)

WVDC

6

10

16

25

50 100

6

10

16

25

50 100

6

10

16

25

50 100

101 Cap

121 (pF)

151

100

120

150

181

221

271

180

220

270

331

391

471

330

390

470

561

681

821

560

680

820

102

122

152

1000

1200

1500

182

222

272

1800

2200

2700

332

392

472

3300

3900

4700

562

682

822

5600

6800

8200

103 Cap

123 (μF)

153

0.010

0.012

0.015

183

223

273

0.018

0.022

0.027

333

393

473

0.033

0.039

0.047

563

683

823

0.056

0.068

0.082

104

124

154

0.10

0.12

0.15

184

224

274

0.18

0.22

0.27

334

474

564

0.33

0.47

0.56

684

824

105

0.68

0.82

1.0

125

155

185

1.2

1.5

1.8

225

335

475

2.2

3.3

4.7

106

226

476

107

10

22

47

100

REV 01

73

Automotive Capacitor Array (IPC)

As the market leader in the development and manufacture of capacitor

arrays AVX is pleased to offer a range of AEC-Q200 qualified arrays to

compliment our product offering to the Automotive industry. Both the

AVX 0612 and 0508 4-element capacitor array styles are qualified to the

AEC-Q200 automotive specifications.

AEC-Q200 is the Automotive Industry qualification standard and a

detailed qualification package is available on request.

0508 - 4 Element

All AVX automotive capacitor array production facilities are certified to

ISO/TS 16949:2002.

0612 - 4 Element

HOW TO ORDER

Y

C

104

K

4

T

3

A

4

2A

W

Voltage Dielectric Capacitance Capacitance Failure Rate

Case

Size

2 = 0508

3 = 0612

Array

Packaging

& Quantity

Code

Style

W = RoHS

L = SnPb

Number

of Caps

Terminations

*T = Plated Ni and Sn

*Z = FLEXITERM^®

B = 5ꢀ min lead

X = FLEXITERM^®

with 5ꢀ min lead

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

A = NP0

C = X7R

F = X8R

Code (In pF)

Significant

Digits +

Tolerance

*J = 5ꢀ

4 = Automotive

2A = 7" Reel

(4000)

*K = 10ꢀ

M = 20ꢀ

Number of

Zeros

4A = 13" Reel

(10000)

2F = 7" Reel

(1000)

e.g. 10μF=106

*RoHS compliant

*Contact factory for availability by part number for K = 10ꢀ and J = 5ꢀ tolerance.

NP0/C0G

X7R

SIZE

No. of Elements

W2 = 0508

W3 = 0612

SIZE

No. of Elements

W2 = 0508

W3 = 0612

4

2

4

WVDC

16

25

50

100

16

25

50

100

WVDC

16

25

50

100

16

25

50

100

10

16

25

50

100

1R0

1R2

1R5

Cap 1.0

(pF) 1.2

1.5

101

121

151

Cap 100

(pF) 120

150

1R8

2R2

2R7

1.8

2.2

2.7

181

221

271

180

220

270

3R3

3R9

4R7

3.3

3.9

4.7

331

391

471

330

390

470

5R6

6R8

8R2

5.6

6.8

8.2

561

681

821

560

680

820

100

120

150

10

12

15

102

122

152

1000

1200

1500

180

220

270

18

22

27

182

222

272

1800

2200

2700

330

390

470

33

39

47

332

392

472

3300

3900

4700

560

680

820

56

68

82

562

682

822

5600

6800

8200

101

121

151

100

120

150

103 Cap 0.010

123

153

(μF) 0.012

0.015

181

221

271

180

220

270

183

223

273

0.018

0.022

0.027

331

391

471

330

390

470

333

393

473

0.033

0.039

0.047

561

681

821

560

680

820

563

683

823

0.056

0.068

0.082

102

122

152

1000

1200

1500

104

124

154

0.10

0.12

0.15

182

222

272

1800

2200

2700

224

0.22

= X7R

332

392

472

3300

3900

4700

Not RoHS Compliant

562

682

822

5600

6800

8200

= NPO/COG

LEAD-FREE COMPATIBLE

COMPONENT

For RoHS compliant products,

please select correct termination style.

REV 01

74

Capacitor Array

PART & PAD LAYOUT DIMENSIONS

millimeters (inches)

0508 - 4 Element

0612 - 4 Element

0508 - 2 Element

W

X

W

S

P

X

S

P

T

BW

C/L OF CHIP

BW

C/L OF CHIP

C

L

BL

L

BL

L

PAD LAYOUT

PART DIMENSIONS

PAD LAYOUT DIMENSIONS

0508 - 2 Element

L

W

2.10 0.15

T

BW

0.43 0.10

BL

0.33 0.08

P

1.00 REF

S

A

B

C

D

E

1.30 0.15

0.94 MAX

0.50 0.10

0.68

1.32

2.00

0.46

1.00

(0.051 0.006) (0.083 0.006) (0.037 MAX) (0.017 0.004) (0.013 0.003

)

(0.039 REF) (0.020 0.004)

(0.027)

(0.052)

(0.079)

(0.018)

(0.039)

0508 - 4 Element

L

W

2.10 0.15

T

BW

0.25 0.06

BL

0.20 0.08

P

0.50 REF

X

S

A

B

C

D

E

1.30 0.15

0.94 MAX

0.75 0.10

0.25 0.10

0.56

1.32

1.88

0.30

0.50

(0.051 0.006) (0.083 0.006) (0.037 MAX) (0.010 0.003) (0.008 0.003

)

(0.020 REF) (0.030 0.004) (0.010 0.004)

(0.022)

(0.052)

(0.074)

(0.012)

(0.020)

0612 - 4 Element

A

B

C

D

E

L

W

T

BW

BL

P

X

S

+0.25

0.89

1.65

2.54

0.46

0.76

1.60 0.20

3.20 0.20

1.35 MAX

0.41 0.10

0.18

0.76 REF

1.14 0.10

0.38 0.10

-0.08

(0.035)

(0.065)

(0.100)

(0.018)

(0.030)

+0.010

(0.063 0.008) (0.126 0.008) (0.053 MAX) (0.016 0.004) (0.007

)

(0.030 REF) (0.045 0.004) (0.015 0.004)

-0.003

REV 01

75

Low Inductance Capacitors

Introduction

The signal integrity characteristics of a Power Delivery

Network (PDN) are becoming critical aspects of board level

and semiconductor package designs due to higher operating

frequencies, larger power demands, and the ever shrinking

lower and upper voltage limits around low operating voltages.

These power system challenges are coming from mainstream

designs with operating frequencies of 300MHz or greater,

modest ICs with power demand of 15 watts or more, and

operating voltages below 3 volts.

capacitor, one resistor, and one inductor. The RLC values in

this model are commonly referred to as equivalent series

capacitance (ESC), equivalent series resistance (ESR), and

equivalent series inductance (ESL).

The ESL of a capacitor determines the speed of energy

transfer to a load. The lower the ESL of a capacitor, the faster

that energy can be transferred to a load. Historically, there

has been a tradeoff between energy storage (capacitance)

and inductance (speed of energy delivery). Low ESL devices

typically have low capacitance. Likewise, higher capacitance

devices typically have higher ESLs. This tradeoff between

ESL (speed of energy delivery) and capacitance (energy

storage) drives the PDN design topology that places the

fastest low ESL capacitors as close to the load as possible.

Low Inductance MLCCs are found on semiconductor

packages and on boards as close as possible to the load.

The classic PDN topology is comprised of a series of

capacitor stages. Figure 1 is an example of this architecture

with multiple capacitor stages.

An ideal capacitor can transfer all its stored energy to a load

instantly. A real capacitor has parasitics that prevent

instantaneous transfer of a capacitor’s stored energy. The

true nature of a capacitor can be modeled as an RLC

equivalent circuit. For most simulation purposes, it is possible

to model the characteristics of a real capacitor with one

Slowest Capacitors

Fastest Capacitors

Semiconductor Product

VR

Bulk

Board-Level

Package-Level

Die-Level

Low Inductance Decoupling Capacitors

Figure 1 Classic Power Delivery Network (PDN) Architecture

LOW INDUCTANCE CHIP CAPACITORS

INTERDIGITATED CAPACITORS

The key physical characteristic determining equivalent series

inductance (ESL) of a capacitor is the size of the current loop

it creates. The smaller the current loop, the lower the ESL. A

standard surface mount MLCC is rectangular in shape with

electrical terminations on its shorter sides. A Low Inductance

Chip Capacitor (LICC) sometimes referred to as Reverse

Geometry Capacitor (RGC) has its terminations on the longer

side of its rectangular shape.

The size of a current loop has the greatest impact on the ESL

characteristics of a surface mount capacitor. There is a

secondary method for decreasing the ESL of a capacitor.

This secondary method uses adjacent opposing current

loops to reduce ESL. The InterDigitated Capacitor (IDC)

utilizes both primary and secondary methods of reducing

inductance. The IDC architecture shrinks the distance

between terminations to minimize the current loop size, then

further reduces inductance by creating adjacent opposing

current loops.

When the distance between terminations is reduced, the size

of the current loop is reduced. Since the size of the current

loop is the primary driver of inductance, an 0306 with a

smaller current loop has significantly lower ESL then an 0603.

The reduction in ESL varies by EIA size, however, ESL is

typically reduced 60ꢀ or more with an LICC versus a

standard MLCC.

An IDC is one single capacitor with an internal structure that

has been optimized for low ESL. Similar to standard MLCC

versus LICCs, the reduction in ESL varies by EIA case size.

Typically, for the same EIA size, an IDC delivers an ESL that

is at least 80ꢀ lower than an MLCC.

REV 01

76

Low Inductance Capacitors

Introduction

LAND GRID ARRAY (LGA) CAPACITORS

LOW INDUCTANCE CHIP ARRAYS (LICA^®)

Land Grid Array (LGA) capacitors are based on the first Low

ESL MLCC technology created to specifically address the

design needs of current day Power Delivery Networks (PDNs).

This is the 3rd low inductance capacitor technology

developed by AVX. LGA technology provides engineers with

new options. The LGA internal structure and manufacturing

technology eliminates the historic need for a device to be

physically small to create small current loops to minimize

inductance.

The LICA^®product family is the result of a joint development

effort between AVX and IBM to develop a high performance

MLCC family of decoupling capacitors. LICA was introduced

in the 1980s and remains the leading choice of designers in

high performance semiconductor packages and high

reliability board level decoupling applications.

LICA^®products are used in 99.999ꢀ uptime semiconductor

package applications on both ceramic and organic

substrates. The C4 solder ball termination option is the

perfect compliment to flip-chip packaging technology.

Mainframe class CPUs, ultimate performance multi-chip

modules, and communications systems that must have the

reliability of 5 9’s use LICA^®.

LICA^®products with either Sn/Pb or Pb-free solder balls are

used for decoupling in high reliability military and aerospace

applications. These LICA^®devices are used for decoupling of

large pin count FPGAs, ASICs, CPUs, and other high power

ICs with low operating voltages.

The first family of LGA products are 2 terminal devices. A

2 terminal 0306 LGA delivers ESL performance that is equal

to or better than an 0306 8 terminal IDC. The 2 terminal 0805

LGA delivers ESL performance that approaches the 0508

8 terminal IDC. New designs that would have used 8 terminal

IDCs are moving to 2 terminal LGAs because the layout is

easier for a 2 terminal device and manufacturing yield is better

for a 2 terminal LGA versus an 8 terminal IDC.

LGA technology is also used in a 4 terminal family of products

that AVX is sampling and will formerly introduce in 2008.

Beyond 2008, there are new multi-terminal LGA product

families that will provide even more attractive options for PDN

designers.

When high reliability decoupling applications require the very

lowest ESL capacitors, LICA^®products are the best option.

470 nF 0306 Impedance Comparison

1

0306 2T-LGA

0306 LICC

0306 8T-IDC

0603 MLCC

0.1

0.01

0.001

1

10

100

1000

Frequency (MHz)

Figure 2 MLCC, LICC, IDC, and LGA technologies deliver different levels of equivalent series inductance (ESL).

REV 01

77

Low Inductance Ceramic

Capacitors LICC

0306/0508/0612 RoHS Compliant

GENERAL DESCRIPTION

The key physical characteristic determining equivalent series

inductance (ESL) of a capacitor is the size of the current loop

it creates. The smaller the current loop, the lower the ESL.

A standard surface mount MLCC is rectangular in shape with

electrical terminations on its shorter sides. A Low Inductance

Chip Capacitor (LICC) sometimes referred to as Reverse

Geometry Capacitor (RGC) has its terminations on the longer

sides of its rectangular shape. The image on the right shows

the termination differences between an MLCC and an LICC.

When the distance between terminations is reduced, the size

of the current loop is reduced. Since the size of the current

loop is the primary driver of inductance, an 0306 with a

smaller current loop has significantly lower ESL then an

0603. The reduction in ESL varies by EIA size, however, ESL

is typically reduced 60ꢀ or more with an LICC versus a

LICC

MLCC

PERFORMANCE CHARACTERISTICS

Capacitance Tolerances K = 10ꢀ; M = 20ꢀ

standard MLCC.

AVX LICC products are available with a lead-free finish of

plated Nickel/Tin.

Operation

X7R = -55ꢁC to +125ꢁC

X5R = -55ꢁC to +85ꢁC

X7S = -55ꢁC to +125ꢁC

Temperature Range

Temperature Coefficient X7R, X5R = 15ꢀ; X7S = 22ꢀ

Voltage Ratings

4, 6.3, 10, 16, 25 VDC

Dissipation Factor

4V, 6.3V = 6.5ꢀ max; 10V = 5.0ꢀ max;

16V = 3.5ꢀ max; 25V = 3.0ꢀ max

Insulation Resistance

(@+25°C, RVDC)

100,000MΩ min, or 1,000MΩ per

μF min.,whichever is less

HOW TO ORDER

0612

Z

D

105

M

A

T

2

A*

Size

0306

0508

0612

Voltage

4 = 4V

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

Dielectric

C = X7R

D = X5R

W = X6S

Z = X7S

Capacitance

Code (In pF)

2 Sig. Digits +

Number of Zeros

Capacitance

Tolerance

K = 10ꢀ

Failure Rate Terminations

Packaging

Available

2 = 7" Reel

4 = 13" Reel

Thickness

mm (in)

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

1.27 (0.050)

A = N/A

T = Plated Ni

and Sn

M = 20ꢀ

*See the thickness tables on the next page.

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

TYPICAL IMPEDANCE CHARACTERISTICS

10

MLCC_1206

1

0.1

LICC_0612

0.01

0.001

1

10

100

1000

Frequency (MHz)

041416

78

Low Inductance Ceramic

Capacitors LICC

0306/0508/0612 RoHS Compliant

PHYSICAL DIMENSIONS AND

PAD LAYOUT

SIZE

0306

0508

0612

Packaging

Embossed

mm

(in.)

0.81 0.15

(0.032 0.006)

1.27 0.25

(0.050 0.010)

1.60 0.25

(0.063 0.010)

Length

mm

(in.)

1.60 0.15

2.00 0.25

3.20 0.25

Width

(0.063 0.006)

(0.080 0.010)

(0.126 0.010)

t

W

Cap Code WVDC4

4

6.3 10 16 25 6.3 10 16 25 50 6.3 10 16 25 50

102

222

332

472

682

103

153

223

333

473

683

104

154

224

334

474

684

105

155

225

335

475

Cap 0.001

(μF) 0.0022

0.0033

0.0047

0.0068

0.01

A

S

V

A

S

V

A

S

V

A

S

V

A

V

A

S

V

W

A

S

V

W

A

S

V

W

A

S

V

T

V

L

V

0.015

0.022

0.033

0.047

0.068

0.1

W

PHYSICAL DIMENSIONS

mm (in)

t

0.13 min.

(0.005 min.)

V

L

W

0.15

W

0.81 0.15

(0.032 0.006)

1.60 0.15

(0.063 0.006)

0.22

0306

0508

0612

0.33

1.27 0.25

(0.050 0.010)

2.00 0.25

(0.080 0.010)

0.13 min.

(0.005 min.)

0.47

0.68

1.60 0.25

(0.063 0.010)

3.20 0.25

(0.126 0.010)

0.13 min.

(0.005 min.)

1

A

1.5

2.2

T - See Range Chart for Thickness and Codes

3.3

4.7

685

106

6.8

10

PAD LAYOUT DIMENSIONS

mm (in)

A

B

C

0306

0508

0612

0.31 (0.012)

0.51 (0.020)

0.76 (0.030)

1.52 (0.060)

2.03 (0.080)

3.05 (0.120)

0.51 (0.020)

0.76 (0.030)

0.635 (0.025)

Solid = X7R

= X6S

= X5R

= X7S

mm (in.)

0306

0508

0612

Code Thickness

A

0.56 (0.022)

S

V

A

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

S

V

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

1.27 (0.050)

W

A

“B”

C

“A”

C

041416

79

Low Inductance Capacitors

with SnPb Terminations

LD16/LD17/LD18 Tin-Lead Termination “B”

GENERAL DESCRIPTION

The key physical characteristic determining equivalent

series inductance (ESL) of a capacitor is the size of the

current loop it creates. The smaller the current loop, the

lower the ESL.

A standard surface mount MLCC is rectangular in shape

with electrical terminations on its shorter sides. A Low

Inductance Chip Capacitor (LICC) sometimes referred to

as Reverse Geometry Capacitor (RGC) has its

terminations on the longer sides of its rectangular shape.

The image on the right shows the termination differences

between an MLCC and an LICC.

LICC

MLCC

When the distance between terminations is reduced, the

size of the current loop is reduced. Since the size of the

current loop is the primary driver of inductance, an 0306

with a smaller current loop has significantly lower ESL

then an 0603. The reduction in ESL varies by EIA size,

however, ESL is typically reduced 60ꢀ or more with an

LICC versus a standard MLCC.

PERFORMANCE CHARACTERISTICS

Capacitance Tolerances K = 10ꢀ; M = 20ꢀ

Operation

X7R = -55ꢁC to +125ꢁC

X5R = -55ꢁC to +85ꢁC

X7S = -55ꢁC to +125ꢁC

Temperature Range

AVX LICC products are available with a lead termination

for high reliability military and aerospace applications that

must avoid tin whisker reliability issues.

Temperature Coefficient X7R, X5R = 15ꢀ; X7S = 22ꢀ

Voltage Ratings

4, 6.3, 10, 16, 25 VDC

Dissipation Factor

4V, 6.3V = 6.5ꢀ max; 10V = 5.0ꢀ max;

16V = 3.5ꢀ max; 25V = 3.0ꢀ max

Not RoHS Compliant

Insulation Resistance

(@+25°C, RVDC)

100,000MΩ min, or 1,000MΩ per

μF min.,whichever is less

HOW TO ORDER

LD18

Z

D

105

M

A

B

2

A*

Size

Voltage

4 = 4V

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

Dielectric

C = X7R

D = X5R

W = X6S

Capacitance

Code (In pF)

2 Sig. Digits +

Number of Zeros

Capacitance

Tolerance

K = 10ꢀ

Failure Rate Terminations

Packaging

Available

2 = 7" Reel

4 = 13" Reel

Thickness

mm (in)

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

1.27 (0.050)

LD16 = 0306

LD17 = 0508

LD18 = 0612

A = N/A

B = 5ꢀ min lead

M = 20ꢀ

*See the thickness tables on the next page.

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

TYPICAL IMPEDANCE CHARACTERISTICS

10

MLCC_1206

1

0.1

LICC_0612

0.01

0.001

1

10

100

1000

Frequency (MHz)

041416

80

Low Inductance Capacitors

with SnPb Terminations

LD16/LD17/LD18 Tin-Lead Termination “B”

SIZE

LD16

(0306)

LD17

(0508)

LD18

(0612)

PHYSICAL DIMENSIONS AND

PAD LAYOUT

Packaging

Embossed

mm

(in.)

0.81 0.15

(0.032 0.006)

1.27 0.25

(0.050 0.010)

1.60 0.25

(0.063 0.010)

Length

mm

(in.)

1.60 0.15

(0.063 0.006)

2.00 0.25

(0.080 0.010)

3.20 0.25

(0.126 0.010)

Width

t

W

Cap Code

102

222

332

472

682

103

153

223

333

473

683

104

154

224

334

474

684

105

155

225

335

475

WVDC

6.3 10 16 25 6.3 10 16 25 50 6.3 10 16 25

50

V

Cap 0.001

(μF) 0.0022

0.0033

0.0047

0.0068

0.01

A

S

V

A

S

V

A

S

V

A

S

V

A

V

A

S

V

W

A

S

V

W

A

S

V

W

A

S

V

T

V

L

V

0.015

0.022

0.033

0.047

0.068

0.1

W

PHYSICAL DIMENSIONS

mm (in)

t

0.13 min.

(0.005 min.)

L

W

V

0.15

W

LD16

0.81 0.15

1.60 0.15

(0.063 0.006)

(0306) (0.032 0.006)

LD17 1.27 0.25

(0508) (0.050 0.010)

LD18 1.60 0.25

(0612) (0.063 0.010)

0.22

2.00 0.25

(0.080 0.010)

0.13 min.

(0.005 min.)

0.33

0.47

3.20 0.25

(0.126 0.010)

0.13 min.

(0.005 min.)

0.68

1

1.5

T - See Range Chart for Thickness and Codes

2.2

3.3

4.7

PAD LAYOUT DIMENSIONS

685

106

6.8

10

mm (in)

C

A

B

LD16

(0306)

0.31 (0.012)

1.52 (0.060)

0.51 (0.020)

Solid = X7R

= X6S

= X5R

LD17

0.51 (0.020)

0.76 (0.030)

2.03 (0.080)

3.05 (0.120)

0.76 (0.030)

mm (in.)

LD16

(0306)

mm (in.)

(0508)

LD17

(0508)

Code Thickness

LD18

(0612)

Code Thickness

LD18

(0612)

0.635 (0.025)

Code Thickness

A

0.56 (0.022)

S

V

A

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

S

V

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

1.27 (0.050)

W

A

“B”

C

“A”

C

041416

81

IDC Low Inductance Capacitors (RoHS)

0306/0612/0508 IDC (InterDigitated Capacitors)

GENERAL DESCRIPTION

Inter-Digitated Capacitors (IDCs) are used for both semiconductor

package and board level decoupling. The equivalent series

inductance (ESL) of a single capacitor or an array of capacitors in

0612

parallel determines the response time of a Power Delivery Network

(PDN). The lower the ESL of a PDN, the faster the response time.

A designer can use many standard MLCCs in parallel to reduce

ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC

devices are available in versions with a maximum height of 0.95mm

+

–

+

–

or 0.55mm.

0508

IDCs are typically used on packages of semiconductor products

with power levels of 15 watts or greater. Inter-Digitated Capacitors

are used on CPU, GPU, ASIC, and ASSP devices produced on

0.13μ, 90nm, 65nm, and 45nm processes. IDC devices are used

on both ceramic and organic package substrates. These low ESL

surface mount capacitors can be placed on the bottom side or the

top side of a package substrate. The low profile 0.55mm maximum

height IDCs can easily be used on the bottom side of BGA

packages or on the die side of packages under a heat spreader.

+

–

+

–

0306

TYPICAL IMPEDANCE

10

IDCs are used for board level decoupling of systems with speeds of

300MHz or greater. Low ESL IDCs free up valuable board space by

reducing the number of capacitors required versus standard

MLCCs. There are additional benefits to reducing the number of

capacitors beyond saving board space including higher reliability

from a reduction in the number of components and lower

placement costs based on the need for fewer capacitors.

MLCC_1206

LICC_0612

1

0.1

IDC_0612

0.01

The Inter-Digitated Capacitor (IDC) technology was developed by

AVX. This is the second family of Low Inductance MLCC products

created by AVX. IDCs are a cost effective alternative to AVX’s first

generation low ESL family for high-reliability applications known as

LICA (Low Inductance Chip Array).

0.001

1

10

100

1000

Frequency (MHz)

AVX IDC products are available with a lead-free finish of plated

Nickel/Tin.

HOW TO ORDER

225

M

W

3

L

1

6

D

A

T

3

A

Capacitance Capacitance

Style

IDC

Low

Inductance

Number Voltage Dielectric

Failure Termination Packaging

Thickness

Max. Thickness

mm (in.)

A=Standard

S=0.55 (0.022)

Code (In pF)

Tolerance

Case

of

Rate

4 = 4V

C = X7R

D = X5R

Z = X7S

T = Plated Ni

and Sn

Available

1=7" Reel

3=13" Reel

Size

Terminals

1 = 8 Terminals

2 Sig. Digits + M = 20ꢀ

Number of

Zeros

A = N/A

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

2 = 0508

3 = 0612

4 = 0306

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

PERFORMANCE CHARACTERISTICS

Capacitance Tolerance

Operation

20ꢀ Preferred

Dielectric Strength

CTE (ppm/C)

No problems observed after 2.5 x RVDC

for 5 seconds at 50mA max current

X7R = -55ꢁC to +125ꢁC

X5R = -55ꢁC to +85ꢁC

X7S = -55ꢁC to +125ꢁC

15ꢀ (0VDC), 22ꢀ (X7S)

4, 6.3, 10, 16, 25 VDC

Temperature Range

12.0

Thermal Conductivity 4-5W/M K

Temperature Coefficient

Voltage Ratings

Terminations

Available

Plated Nickel and Solder

Dissipation Factor

≤ 6.3V = 6.5ꢀ max;

10V = 5.0ꢀ max;

≥ 16V = 3.5ꢀ max

Insulation Resistance

(@+25°C, RVDC)

100,000MΩ min, or 1,000MΩ per

μF min.,whichever is less

REV 01

82

IDC Low Inductance Capacitors (RoHS)

0306/0612/0508 IDC (InterDigitated Capacitors)

SIZE

W4 = 0306

W2 = Thin 0508

W2 = 0508

W3= Thin 0612

W3 = 0612

W3 = THICK 0612

Max.

mm

(in.)

0.55

0.55.

0.95

0.55

0.95

1.22

Thickness

(0.022)

(0.037)

(0.022)

(0.037)

(0.048)

WVDC

4

6.3

4

6.3

10

16

25

4

6.3

10

16

25

4

6.3

10

16

4

6.3

10

16

25

4

6.3

10

16

Cap

(μF)

0.010

0.022

0.033

0.047

0.068

0.10

0.22

0.33

0.47

0.68

1.0

1.5

2.2

3.3

Consult factory for

additional requirements

PHYSICAL DIMENSIONS AND PAD LAYOUT

= X7R

= X5R

= X7S

PAD LAYOUT

DIMENSIONS

PHYSICAL CHIP DIMENSIONS millimeters (inches)

SIZE

0306

W

L

BW

0.25 0.10

BL

0.20 0.10

P

SIZE

0306

A

0.38

B

0.89

C

1.27

D

0.20

E

0.40

1.60 0.20

0.82 0.10

0.40 0.05

(0.015 0.002)

(0.063 0.008) (0.032 0.006 (0.010 0.004) (0.008 0.004)

2.03 0.20 1.27 0.20 0.30 0.10 0.25 0.15

(0.080 0.008) (0.050 0.008) (0.012 0.004) (0.010 0.006)

3.20 0.20 1.60 0.20 0.50 0.10 0.25 0.15

(0.015) (0.035) (0.050) (0.008) (0.015)

0.64 1.27 1.91 0.28 0.50

(0.025) (0.050) (0.075) (0.011) (0.020)

0.89 1.65 2.54 0.45 0.80

(0.035) (0.065) (0.010) (0.018) (0.031)

0.50 0.05

(0.020 0.002)

0508

0612

0508

0612

0.80 0.10

(0.126 0.008) (0.063 0.008) (0.020 0.004) (0.010 0.006) (0.031 0.004)

REV 01

83

IDC Low Inductance Capacitors (SnPb)

0306/0612/0508 IDC with Sn/Pb Termination

GENERAL DESCRIPTION

Inter-Digitated Capacitors (IDCs) are used for both semiconductor

package and board level decoupling. The equivalent series

inductance (ESL) of a single capacitor or an array of capacitors in

0612

parallel determines the response time of a Power Delivery Network

(PDN). The lower the ESL of a PDN, the faster the response time.

A designer can use many standard MLCCs in parallel to reduce

ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC

devices are available in versions with a maximum height of 0.95mm

or 0.55mm.

+

–

+

–

0508

IDCs are typically used on packages of semiconductor products

+

–

+

–

with power levels of 15 watts or greater. Inter-Digitated Capacitors

are used on CPU, GPU, ASIC, and ASSP devices produced on

0.13μ, 90nm, 65nm, and 45nm processes. IDC devices are used

on both ceramic and organic package substrates. These low ESL

0306

surface mount capacitors can be placed on the bottom side or the

top side of a package substrate. The low profile 0.55mm maximum

height IDCs can easily be used on the bottom side of BGA

packages or on the die side of packages under a heat spreader.

TYPICAL IMPEDANCE

IDCs are used for board level decoupling of systems with speeds of

300MHz or greater. Low ESL IDCs free up valuable board space by

10

reducing the number of capacitors required versus standard

MLCCs. There are additional benefits to reducing the number of

MLCC_1206

LICC_0612

1

capacitors beyond saving board space including higher reliability

from a reduction in the number of components and lower

0.1

placement costs based on the need for fewer capacitors.

IDC_0612

The Inter-Digitated Capacitor (IDC) technology was developed by

AVX. This is the second family of Low Inductance MLCC products

created by AVX. IDCs are a cost effective alternative to AVX’s first

generation low ESL family for high-reliability applications known as

LICA (Low Inductance Chip Array).

0.01

0.001

1

10

100

1000

Frequency (MHz)

AVX IDC products are available with a lead termination for high

reliability military and aerospace applications that must avoid tin

whisker reliability issues.

Not RoHS Compliant

HOW TO ORDER

225

M

L

3

L

1

6

D

A

B

3

A

Capacitance Capacitance

Style

IDC

Low

Inductance

Number

of

Terminals

1 = 8 Terminals

Dielectric

C = X7R

D = X5R

Z = X7S

Failure Termination Packaging

Thickness

Max. Thickness

mm (in.)

A=Standard

S=0.55 (0.022)

Voltage

4 = 4V

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

Code (In pF)

Tolerance

Case

Rate

B = 5ꢀ min.

Lead

Available

1=7" Reel

3=13" Reel

Size

2 Sig. Digits + M = 20ꢀ

Number of

Zeros

A = N/A

2 = 0508

3 = 0612

4 = 0306

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

PERFORMANCE CHARACTERISTICS

Capacitance Tolerance

Operation

20ꢀ Preferred

Dielectric Strength

CTE (ppm/C)

No problems observed after 2.5 x RVDC

for 5 seconds at 50mA max current

X7R = -55ꢁC to +125ꢁC

X5R = -55ꢁC to +85ꢁC

X7S = -55ꢁC to +125ꢁC

15ꢀ (0VDC), 22ꢀ (X7S)

4, 6.3, 10, 16, 25 VDC

Temperature Range

12.0

Thermal Conductivity 4-5W/M K

Temperature Coefficient

Voltage Ratings

Terminations

Available

Plated Nickel and Solder

Dissipation Factor

≤ 6.3V = 6.5ꢀ max;

10V = 5.0ꢀ max;

≥ 16V = 3.5ꢀ max

Insulation Resistance

(@+25°C, RVDC)

100,000MΩ min, or 1,000MΩ per

μF min.,whichever is less

REV 01

84

IDC Low Inductance Capacitors (SnPb)

0306/0612/0508 IDC with Sn/Pb Termination

SIZE

W4 = 0306

W2 = Thin 0508

W2 = 0508

W3= Thin 0612

W3 = 0612

W3 = THICK 0612

Max.

mm

(in.)

0.55

0.55.

0.95

0.55

0.95

1.22

Thickness

(0.022)

(0.037)

(0.022)

(0.037)

(0.048)

WVDC

4

6.3

4

6.3

10

16

25

4

6.3

10

16

25

4

6.3

10

16

4

6.3

10

16

25

4

6.3

10

16

Cap

(μF)

0.010

0.022

0.033

0.047

0.068

0.10

0.22

0.33

0.47

0.68

1.0

1.5

2.2

3.3

Consult factory for

additional requirements

PHYSICAL DIMENSIONS AND PAD LAYOUT

= X7R

= X5R

= X7S

PAD LAYOUT

DIMENSIONS

PHYSICAL CHIP DIMENSIONS millimeters (inches)

SIZE

0306

W

L

BW

0.25 0.10

BL

0.20 0.10

P

SIZE

0306

A

0.38

B

0.89

C

1.27

D

0.20

E

0.40

1.60 0.20

0.82 0.10

0.40 0.05

(0.015 0.002)

(0.063 0.008) (0.032 0.006 (0.010 0.004) (0.008 0.004)

2.03 0.20 1.27 0.20 0.30 0.10 0.25 0.15

(0.080 0.008) (0.050 0.008) (0.012 0.004) (0.010 0.006)

3.20 0.20 1.60 0.20 0.50 0.10 0.25 0.15

(0.015) (0.035) (0.050) (0.008) (0.015)

0.64 1.27 1.91 0.28 0.50

(0.025) (0.050) (0.075) (0.011) (0.020)

0.89 1.65 2.54 0.45 0.80

(0.035) (0.065) (0.010) (0.018) (0.031)

0.50 0.05

(0.020 0.002)

0508

0612

0508

0612

0.80 0.10

(0.126 0.008) (0.063 0.008) (0.020 0.004) (0.010 0.006) (0.031 0.004)

REV 01

85

LGA Low Inductance Capacitors

0204/0306 Land Grid Array

Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from AVX.

These new LGA products are the third low inductance family developed by AVX. The in-

novative LGA technology sets a new standard for low inductance MLCC performance.

Our initial 2 terminal versions of LGA technology deliver the performance of an 8 terminal

IDC low inductance MLCC with a number of advantages including:

• Simplified layout of 2 large solder pads compared to 8 small pads for IDCs

• Opportunity to reduce PCB or substrate contribution to system ESL by using multi-

ple parallel vias in solder pads

• Advanced FCT manufacturing process used to create uniformly flat terminations on

the capacitor that resist “tombstoning”

• Better solder joint reliability

APPLICATIONS

Semiconductor Packages

• Microprocessors/CPUs

• Graphics Processors/GPUs

• Chipsets

Board Level Device Decoupling

• Frequencies of 300 MHz or more

• ICs drawing 15W or more

• Low voltages

• FPGAs

• High speed buses

• ASICs

0306 2 TERMINAL LGA COMPARISON WITH 0306 8 TERMINAL IDC

1

0.1

0.01

0.001

1

10

100

1000

Frequency (MHz)

051316

86

LGA Low Inductance Capacitors

0204/0306 Land Grid Array

SIZE

LG12 (0204)

0.50 (0.020)

1.00 (0.039)

X7S (Z)

LG22 (0306)

0.76 (0.030)

1.60 (0.063)

Length

Width

mm (in.)

Temp. Char.

Working Voltage

X5R (D)

X6S (W)

X7R (C)

X5R (D)

X7S (Z)

X6S (W)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

6.3

4

(4)

10

(Z)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

(6)

Cap (μF)

0.010 (103)

0.022 (223)

0.047 (473)

0.100 (104)

0.220 (224)

0.330 (334)

0.470 (474)

1.000 (105)

2.200 (225)

= X7R

= X5R

= X7S

= X6S

HOW TO ORDER

LG

1

2

6

Z

104

M

A

T

2

S

1

Style Case Number of Working Temperature Coded

Cap

Termination Termination Packaging

Thickness

Number of

Size

Terminals Voltage Characteristic Cap Tolerance

Style

100ꢀ Sn*

Tape & Reel S = 0.55mm Capacitors

1 = 0204

2 = 0306

2

4 = 4V

6 = 6.3V

Z = 10V

C = X7R

D = X5R

Z = X7S

W = X6S

M = 20ꢀ A = “U” Land

2 = 7" Reel

max

*Contact factory for

other termination

finishes

4 = 13" Reel

Reverse

Geometry LGA

LG12, LG22

BL

L

T

BL

BW

W

L

PART DIMENSIONS

mm (inches)

Series

L

W

T

BW

BL

0.5 0.05

(0.020 0.002)

1.00 0.10

(0.039 0.004)

0.50 0.05

(0.020 0.002)

0.8 0.10

(0.031 0.004)

0.13 0.08

(0.005 0.003)

LG12 (0204)

0.76 0.10

(0.030 0.004)

1.60 0.10

(0.063 0.004)

0.50 0.05

(0.020 0.002)

1.50 0.10

(0.059 0.004)

0.28 0.08

(0.011 0.003)

LG22 (0306)

RECOMMENDED SOLDER PAD DIMENSIONS mm (inches)

PL

Series

PL

PW1

G

LG12 (0204)

0.50 (0.020)

1.00 (0.039)

0.20 (0.008)

G

LG22 (0306)

0.65 (0.026)

1.50 (0.059)

0.20 (0.008)

PW1

051316

87

LGA Low Inductance Capacitors

0204/0306 Land Grid Array – Tin/Lead Termination “B”

SIZE

PG12 (0204)

0.50 (0.020)

1.00 (0.039)

X7S (Z)

PG22 (0306)

0.76 (0.030)

1.60 (0.063)

Length

Width

mm (in.)

Temp. Char.

Working Voltage

X5R (D)

X6S (W)

X7R (C)

X5R (D)

X7S (Z)

X6S (W)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

6.3

4

(4)

10

(Z)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

(6)

Cap (μF)

0.010 (103)

0.022 (223)

0.047 (473)

0.100 (104)

0.220 (224)

0.330 (334)

0.470 (474)

1.000 (105)

2.200 (225)

= X7R

= X5R

= X7S

= X6S

HOW TO ORDER

PG

1

2

6

Z

104

M

A

B

2

S

1

Style Case Number of Working Temperature Coded

Cap

Termination Termination Packaging

Thickness

Number of

Size

Terminals Voltage Characteristic Cap Tolerance

Style

5ꢀ Min Lead Tape & Reel S = 0.55mm Capacitors

1 = 0204

2 = 0306

2

4 = 4V

6 = 6.3V

Z = 10V

C = X7R

D = X5R

Z = X7S

W = X6S

M = 20ꢀ A = “U” Land

2 = 7" Reel

4 = 13" Reel

max

Not RoHS Compliant

Reverse

Geometry LGA

PG12, PG22

LG12, LG22

BL

L

T

BL

BW

W

L

PART DIMENSIONS

mm (inches)

Series

L

W

T

BW

BL

0.5 0.05

(0.020 0.002)

1.00 0.10

(0.039 0.004)

0.50 0.05

(0.020 0.002)

0.8 0.10

(0.031 0.004)

0.13 0.08

(0.005 0.003)

PG12 (0204)

0.76 0.10

(0.030 0.004)

1.60 0.10

(0.063 0.004)

0.50 0.05

(0.020 0.002)

1.50 0.10

(0.059 0.004)

0.28 0.08

(0.011 0.003)

PG22 (0306)

RECOMMENDED SOLDER PAD DIMENSIONS mm (inches)

PL

Series

PL

PW1

G

PG12 (0204)

0.50 (0.020)

1.00 (0.039)

0.20 (0.008)

G

PG22 (0306)

0.65 (0.026)

1.50 (0.059)

0.20 (0.008)

PW1

051316

88

AT Series

High Temperature MLCC – 200ºC & 250°C Rated

Present military specifications, as well as a majority of commercial

applications, require a maximum operating temperature of 125ꢁC.

However, the emerging market for high temperature electronics demands

capacitors operating reliably at temperatures beyond 125ꢁC. AVX’s high

temperature chip capacitor product line, has been extended with the

BME C0G chip. All AT chips have verified capabilities of long term

operation up to 250ꢁC for applications in both military and commercial

businesses. These capacitors demonstrate high volumetric efficiency,

high insulation resistance and low ESR/ESL for the most demanding

applications, such as “down-hole” oil exploration and aerospace

programs.

HOW TO ORDER

AT10

3

T

104

K

A

T

2

A

AVX

Voltage Temperature Capacitance Code Capacitance Test Level

Termination

Packaging

2 = 7" Reel

4 = 13" Reel

9 = Bulk

Special

Code

A = Standard

Style

Code

Coefficient

PME

(2 significant digits

+ no. of zeros)

101 = 100pF

102 = 1nF

Tolerance

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

A = Standard 1 = Pd/Ag

AT03 = 0603 16V = Y

AT05 = 0805 25V = 3 C0G 250ꢁC = A

AT06 = 1206 50V = 5 C0G 200ꢁC = 2

AT10 = 1210

AT12 = 1812

AT14 = 2225

T = 100ꢀ Sn Plated

(RoHS Compliant)

7 = Ni/Au Plated

(For 250ꢁC BME

C0G Only)

VHT 250ꢁC = T

VHT 200ꢁC = 4

BME

103 = 10nF

104 = 100nF

105 = 1μF

C0G 250ꢁC = 5

C0G 200ꢁC = 3

ELECTRICAL SPECIFICATIONS

Temperature Coefficient

Insulation Resistance 25°C (MIL-STD-202, Method 302)

PME C0G 0 30ppm/ꢁC, -55C to 250ꢁC

BME C0G 0 30ppm/ꢁC, -55C to 200ꢁC

See TCC Plot for +250ꢁC

100GΩ or 1000MΩ-μF (whichever is less)

Insulation Resistance 125°C (MIL-STD-202, Method 302)

10GΩ or 100MΩ-μF (whichever is less)

VHT:

T

15ꢀ, -55ꢁC to +150ꢁC

See TCC Plot for +250ꢁC

Insulation Resistance 200°C (MIL-STD-202, Method 302)

1GΩ or 10MΩ-μF (whichever is less)

Capacitance Test (MIL-STD-202, Method 305)

25ꢁC, 1.0 0.2 Vrms (open circuit voltage) @ 1kHz

Insulation Resistance 250°C (MIL-STD-202, Method 302)

100MΩ or 1MΩ-μF (whichever is less)

Dissipation factor 25°C

C0G: 0.15ꢀ Max at 1.0 0.2 Vrms (open circuit voltage) @ 1kHz

VHT: 2.5ꢀ Max at 1.0 0.2 Vrms (open circuit voltage) @ 1kHz

Direct Withstanding Voltage 25°C (Flash Test)

250ꢀ rated voltage for 5 seconds with 50mA max charging current

DIMENSIONS

millimeters (inches)

Size

AT03 = 0603

1.60 0.15

AT05 = 0805

AT06 = 1206

AT10 = 1210

AT12 = 1812

AT14 = 2225

(L) Length

2.01 0.20

3.20 0.20

4.50 0.30

5.72 0.25

(0.063 0.006) (0.079 0.008) (0.126 0.008) (0.126 0.008) (0.177 0.012) (0.225 0.010)

0.81 0.15 1.25 0.20 1.60 0.20 2.50 0.20 3.20 0.20 6.35 0.25

(0.032 0.006) (0.049 0.008) (0.063 0.008) (0.098 0.008) (0.126 0.008) (0.250 0.010)

(W) Width

(T) Thickness

Max.

1.02

(0.040)

1.30

(0.051)

1.52

(0.060)

1.70

(0.067)

2.54

(0.100)

2.54

(0.100)

(t) terminal min.

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

max. 0.75 (0.030)

080416

89

AT Series

High Temperature MLCC – 200ºC & 250°C Rated

PERFORMANCE CHARACTERISTICS

Typical Temperature Coefficient of Capacitance (VHT Dielectric)

Typical Temperature Coefficient of Capacitance (C0G Dielectric)

1.5

15

1

BME

-13.75

-42.5

-71.25

-100

0.5

0

+30ppm/°C

-30ppm/°C

PME

-0.5

-1

-50

-25

0

25

50

75

100

125

150

175

200

225

250

-50

-25

0

25

50

75

100

125

150

175

200

225

250

Temperature (°C)

Typical Voltage Coefficient of Capacitance (VHT Dielectric)

Typical Voltage Coefficient of Capacitance (C0G Dielectric)

1

5

0.8

0.6

0.4

0.2

0

Legend:

Capacitor’s Rated

Voltage

0

-5

16VDC

25VDC

50VDC

100VDC

200VDC

-10

-15

-20

-0.2

-0.4

-0.6

-0.8

-1

0

10

20

30

40

50

60

70

80

90

100

0

10

20

30

40

50

60

70

80

90

100

Percentage of Rated Voltage

Typical RC vs Temperature (VHT Dielectric)

Typical RC vs Temperature (C0G Dielectric)

1000000

100000

10000

1000

100

10

1000

100

10

1

25

50

75

100

125

150

175

200

225

250

25

50

75

100

125

150

175

200

225

250

Temperature (°C)

080416

90

AT Series

High Temperature MLCC – 200ºC & 250°C Rated

RELIABILITY

250°C Life Test @ 2x Rated Voltage (VHT Dielectric)

250°C Life Test @ 2x Rated Voltage (C0G Dielectric)

1.1

0.825

0.55

0.275

0

48000

36000

24000

12000

AT05YT104

AT103T104

AT123T334

AT143T105

AT143A473

AT123A123

0

250

500

750

1000

0

250

500

750

1000

Time (hrs)

VHT - Failure Rate @ 90% Confidence Level (%/1000 hours)

C0G - Failure Rate @ 90% Confidence Level (%/1000 hours)

Temperature (°C)

50% Rated Voltage

100% Rated Voltage

Temperature (°C)

50% Rated Voltage

100% Rated Voltage

200

0.002

0.017

200

0.006

0.047

250

0.026

0.210

250

0.074

0.590

*Typical 1210, 1812, 2225 Failure Rate Analysis based on 250°C testing and

voltage ratings specified on the following page.

*Typical 1812 and 2225 Failure Rate Analysis based on 250°C testing and volt-

age ratings specified on the following page.

FREQUENCY RESPONSE

Impedance Frequency Response (C0G Dielectric)

Impedance Frequency Response (VHT Dielectric)

1E+06

1E+05

AT143A473

AT05YT104

AT123A123

AT123T334

AT143T105

1E+05

1E+04

1E+03

1E+04

1E+03

1E+02

1E+01

1E+00

1E-01

1E-02

1E+02

1E+01

1E+00

1E-01

1E-02

1E+01

1E+02

1E+03

1E+04

1E+05

1E+06

1E+07

1E+08

1E+01

1E+02

1E+03

1E+04

1E+05

1E+06

1E+07

1E+08

Frequency (Hz)

ESR Frequency Response (C0G Dielectric)

Frequency (Hz)

ESR Frequency Response (VHT Dielectric)

1E+03

1E+02

1E+01

1E+00

1E-01

1E-02

1E+03

AT143A473

AT123A123

AT05YT104

AT123T334

AT143T105

1E+02

1E+01

1E+00

1E-01

1E-02

1E-03

1E+01

1E+02

1E+03

1E+04

1E+05

1E+06

1E+07

1E+08

1E+01

1E+02

1E+03

1E+04

1E+05

1E+06

1E+07

1E+08

Frequency (Hz)

080416

91

AT Series

High Temperature MLCC – 200ºC & 250°C Rated

CAPACITANCE RANGE

PREFERRED SIZES ARE SHADED

Temp. Coefficient: 4

Temp. Coefficient: T

VHT

200ºC Rated

250ºC Rated

Case Size AT03 = 0603 AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225

Soldering

Reflow/Wave

Reflow Only

Soldering

Reflow/Wave

Reflow Only

(L) Length

mm

1.60 0.15

2.01 0.20

3.20 0.20

4.50 0.30

5.72 0.25

(L) Length

mm

1.60 0.15

2.01 0.20

3.20 0.20

4.50 0.30

5.72 0.25

(in.)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

(0.177 0.012)

(0.225 0.010)

(in.)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

(0.177 0.012)

(0.225 0.010)

(W) Width

mm

(in.)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

6.35 0.25

(0.250 0.010)

(W) Width

mm

(in.)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

6.35 0.25

(0.250 0.010)

(T) Thickness mm

(in.)

1.02

(0.040)

1.30

(0.051)

1.52

(0.060)

1.70

(0.067)

2.54

(0.100)

2.54

(0.100)

(T) Thickness mm

(in.)

1.02

(0.040)

1.30

(0.051)

1.52

(0.060)

1.70

(0.067)

2.54

(0.100)

2.54

(0.100)

(t) Terminal

min

max

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

(t) Terminal

min

max

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

Rated Temp. (ºC)

Temp. Coefficeint

Voltage (V)

200

4

200

4

200

4

200

4

200

4

200

4

Rated Temp. (ºC)

Temp. Coefficeint

Voltage (V)

250

T

250

T

250

T

250

T

250

T

250

T

25

50

25

50

25

50

16

25

16

25

16

25

Cap 1000 102

(pF) 1200 122

1500 152

Cap 1000 102

(pF) 1200 122

1500 152

1800 182

2200 222

2700 272

3300 332

3900 392

4700 472

5600 562

6800 682

8200 822

Cap 0.010 103

(μF) 0.012 123

0.015 153

0.018 183

0.022 223

0.027 273

0.033 333

0.039 393

0.047 473

0.056 563

0.068 683

0.082 823

0.100 104

0.120 124

0.150 154

0.180 184

0.220 224

0.270 274

0.330 334

0.390 394

0.470 474

0.560 564

0.680 684

0.820 824

1.000 105

Voltage (V)

Cap 0.010 103

(μF) 0.012 123

0.015 153

0.018 183

0.022 223

0.027 273

0.033 333

0.039 393

0.047 473

0.056 563

0.068 683

0.082 823

0.100 104

0.120 124

0.150 154

0.180 184

0.220 224

0.270 274

0.330 334

0.390 394

0.470 474

0.560 564

0.680 684

0.820 824

1.000 105

Voltage (V)

25

50

25

50

25

50

16

25

16

25

16

25

Rated Temp. (ºC)

200

Rated Temp. (ºC)

250

Case Size AT03 = 0603 AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225

Voltage rating per table. Capacitance values specified at 25ºC, derate capacitance value based on TCC and VCC Plots on page 90.

NOTE: Contact factory for non-specified capacitance values.

080416

92

AT Series

High Temperature MLCC – 200ºC & 250°C Rated

CAPACITANCE RANGE

PREFERRED SIZES ARE SHADED

Temp. Coefficient: 3

Temp. Coefficient: 5

BME C0G

BME C0G (Ni/Au)

200ºC Rated

250ºC Rated

Case Size

Soldering

AT03 = 0603

AT05 = 0805

AT06 = 1206

Case Size

Soldering

AT03 = 0603

AT05 = 0805

AT06 = 1206

Reflow/Wave

(L) Length

mm

(in.)

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

mm

1.60 0.15

2.01 0.20

3.20 0.20

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

(in.)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

(W) Width

mm

(in.)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

(W) Width

mm

(in.)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

(T) Thickness mm

(in.)

1.02

(0.040)

1.30

(0.051)

1.52

(0.060)

(T) Thickness mm

(in.)

1.02

(0.040)

1.30

(0.051)

1.52

(0.060)

(t) Terminal

min

max

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

(t) Terminal

min

max

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

Rated Temp. (ºC)

Temp. Coefficeint

Voltage (V)

200

3

200

3

200

3

Rated Temp. (ºC)

Temp. Coefficeint

Voltage (V)

250

5

250

5

250

5

25

50

25

50

25

50

25

Cap

pF

39 390

47 470

Cap

pF

39 390

47 470

56 560

68 680

82 820

100 101

120 121

150 151

180 181

220 221

270 271

330 331

390 391

470 471

560 561

680 681

820 821

1000 102

1200 122

1500 152

1800 182

2200 222

2700 272

3300 332

3900 392

4700 472

5600 562

6800 682

8200 822

100 101

120 121

150 151

180 181

220 221

270 271

330 331

390 391

470 471

560 561

680 681

820 821

1000 102

1200 122

1500 152

1800 182

2200 222

2700 272

3300 332

3900 392

4700 472

5600 562

6800 682

8200 822

Cap 0.010 103

μF 0.012 123

0.015 153

0.018 183

0.022 223

0.027 273

0.033 333

0.039 393

0.047 473

0.056 563

0.068 683

0.082 823

0.100 104

Voltage (V)

Cap 0.010 103

μF 0.012 123

0.015 153

0.018 183

0.022 223

0.027 273

0.033 333

0.039 393

0.047 473

0.056 563

0.068 683

0.082 823

0.100 104

Voltage (V)

25

200

50

25

50

25

50

25

Rated Temp. (ºC)

200

Rated Temp. (ºC)

250

Case Size

AT03 = 0603

AT05 = 0805

AT06 = 1206

Case Size

AT03 = 0603

AT05 = 0805

AT06 = 1206

Voltage rating per table. Capacitance values specified at 25ºC, derate capacitance value based on TCC and VCC Plots on page 90.

NOTE: Contact factory for non-specified capacitance values.

080416

93

AT Series

High Temperature MLCC – 200ºC & 250°C Rated

CAPACITANCE RANGE

PREFERRED SIZES ARE SHADED

Temp. Coefficient: 2

Temp. Coefficient: A

PME C0G

200ºC Rated

250ºC Rated

Case Size AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225

Soldering

Reflow/Wave

Reflow Only

Soldering

Reflow/Wave

Reflow Only

(L) Length

mm

2.01 0.20

3.20 0.20

4.50 0.30

2.75 0.25

(L) Length

mm

2.01 0.20

3.20 0.20

4.50 0.30

2.75 0.25

(in.)

(0.079 0.008)

(0.126 0.008)

(0.177 0.012)

(0.225 0.010)

(in.)

(0.079 0.008)

(0.126 0.008)

(0.177 0.012)

(0.225 0.010)

(W) Width

mm

(in.)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

6.35 0.25

(0.250 0.010)

(W) Width

mm

(in.)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

6.35 0.25

(0.250 0.010)

(T) Thickness mm

(in.)

1.30

(0.051)

1.52

(0.060)

1.70

(0.067)

2.54

(0.100)

2.54

(0.100)

(T) Thickness mm

(in.)

1.30

(0.051)

1.52

(0.060)

1.70

(0.067)

2.54

(0.100)

2.54

(0.100)

(t) Terminal

min

max

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

(t) Terminal

min

max

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

Rated Temp. (ºC)

Temp. Coefficeint

Voltage (V)

200

2

50

200

2

50

200

2

50

200

2

50

200

2

50

Rated Temp. (ºC)

Temp. Coefficeint

Voltage (V)

250

A

25

250

A

25

250

A

25

250

A

25

250

A

25

Cap

(pF)

100 101

120 121

150 151

180 181

220 221

270 271

330 331

390 391

470 471

560 561

680 681

820 821

1000 102

1200 122

1500 152

1800 182

2200 222

2700 272

3300 332

3900 392

4700 472

5600 562

6800 682

8200 822

Cap

(pF)

100 101

120 121

150 151

180 181

220 221

270 271

330 331

390 391

470 471

560 561

680 681

820 821

1000 102

1200 122

1500 152

1800 182

2200 222

2700 272

3300 332

3900 392

4700 472

5600 562

6800 682

8200 822

Cap 0.010 103

(μF) 0.012 123

0.015 153

0.018 183

0.022 223

0.027 273

0.033 333

0.039 393

0.047 473

0.056 563

0.068 683

0.082 823

0.100 104

Voltage (V)

Cap 0.010 103

(μF) 0.012 123

0.015 153

0.018 183

0.022 223

0.027 273

0.033 333

0.039 393

0.047 473

0.056 563

0.068 683

0.082 823

0.100 104

Voltage (V)

50

25

Rated Temp. (ºC)

200

Rated Temp. (ºC)

250

Case Size AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225

Voltage rating per table. Capacitance values specified at 25ºC, derate capacitance value based on TCC and VCC Plots on page 90.

NOTE: Contact factory for non-specified capacitance values.

080416

94

High Voltage MLC Chips

For 600V to 5000V Applications

High value, low leakage and small size are difficult parameters to obtain

in capacitors for high voltage systems. AVX special high voltage MLC chip

capacitors meet these performance characteristics and are designed for

applications such as snubbers in high frequency power converters,

resonators in SMPS, and high voltage couplingꢀdc blocking. These high

voltage chip designs exhibit low ESRs at high frequencies.

Larger physical sizes than normally encountered chips are used to make

high voltage MLC chip products. Special precautions must be taken in

applying these chips in surface mount assemblies. The temperature

gradient during heating or cooling cycles should not exceed 4ºC per

second. The preheat temperature must be within 50ºC of the peak

temperature reached by the ceramic bodies through the soldering process.

Chip sizes 1210 and larger should be reflow soldered only. Capacitors may

require protective surface coating to prevent external arcing.

For 1825, 2225 and ±640 sizes, AVX offers leaded version in either

thru-hole or SMT configurations (for details see section on high voltage

leaded MLC chips).

NEW 630V RANGE

HOW TO ORDER

1808

A

271

K

A

1

2

A

AVX

Voltage

Temperature Capacitance Code Capacitance Test Level

Termination*

Packaging

Special

Code

Style 600Vꢀ6±0V = C

Coefficient (2 significant digits

Tolerance A = Standard 1 = PdꢀAg

1 or 2 = 7" Reel**

0805

1206

1210

1808

1812

1825

2220

2225

±640

***

1000V = A NPO (C0G) = A + no. of zeros)

C0G:J = ±5ꢁ

K = ±10ꢁ

T = Plated

± or 4 = 1±" Reel A = Standard

1500V = S

2000V = G

2500V = W

±000V = H

4000V = J

5000V = K

X7R = C

Examples:

10 pF = 100

Ni and Sn

(RoHS Compli-

ant)

M = ±20ꢁ

100 pF = 101 X7R:K = ±10ꢁ

1,000 pF = 102

22,000 pF = 22±

220,000 pF = 224

1 µF =105

M = ±20ꢁ

Z = +80ꢁ,

-20ꢁ

*Note: Terminations with 5ꢁ minimum lead (Pb) is available, see pages 100 and 101 for LD style.

Leaded terminations are available, see pages 102-106.

Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.

Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.

** The ±640 Style is not available on 7" Reels.

*** AVX offers nonstandard chip sizes. Contact factory for details.

DIMENSIONS

millimeters (inches)

SIZE

0805

2.10 ± 0.20

1206

±.±0 ± 0.±0

1210*

±.±0 ± 0.40

1808*

4.60 ± 0.50

1812*

4.60 ± 0.50

1825*

4.60 ± 0.50

2220*

5.70 ± 0.50

2225*

3640*

(L) Length

5.72 ± 0.25

9.14 ± 0.25

(0.08± ± 0.008) (0.1±0 ± 0.012) (0.1±0 ± 0.016) (0.181 ± 0.020) (0.181 ± 0.020) (0.181 ± 0.020) (0.224 ± 0.020) (0.225 ± 0.010) (0.±60 ± 0.010)

+0.±0

(W) Width

1.25 ± 0.20

(0.049 ±0.008) (0.06±

1.60

2.50 ± 0.±0

2.00 ± 0.20

±.20 ± 0.±0

6.±0 ± 0.40

5.00 ± 0.40

6.±5 ± 0.25

10.2 ± 0.25

-0.10

+0.012

-0.004

)

(0.098 ± 0.012) (0.079 ± 0.008) (0.126 ± 0.012) (0.248 ± 0.016) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)

(T) Thickness

Max.

1.±5

1.80

(0.071)

0.60 ± 0.20

2.80

2.20

2.80

±.40

2.54

(0.05±)

(0.110)

(0.087)

(0.110)

(0.1±4)

(0.100)

(t) terminal min.

0.50 ± 0.20

0.75 ± 0.±5

0.85 ± 0.±5

0.76 (0.0±0)

max. (0.020 ± 0.008) (0.024 ± 0.008) (0.0±0 ± 0.014) (0.0±0 ± 0.014) (0.0±0 ± 0.014) (0.0±0 ± 0.014) (0.0±± ± 0.014) (0.0±± ± 0.014) 1.52 (0.060)

*Reflow Soldering Only

101±17

95

High Voltage MLC Chips

For 600V to 5000V Applications

NP0 (C0G)ꢀDielectric

Performance Characteristics

Capacitance Range

10 pF to 0.100 µF (25/C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)

Capacitance Tolerances

Dissipation Factor

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

Insulation Resistance (+25/C, at 500 VDC)

Insulation Resistance (+125/C, at 500 VDC)

Dielectric Strength

±5ꢁ, ±10ꢁ, ±20ꢁ

0.1ꢁ max. (+25/C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)

-55/C to +125/C

0 ±±0 ppmꢀ/C (0 VDC)

600, 6±0, 1000, 1500, 2000, 2500, ±000, 4000 & 5000 VDC (+125/C)

100K MΩ min. or 1000 MΩ - µF min., whichever is less

10K MΩ min. or 100 MΩ - µF min., whichever is less

Minimum 120ꢁ rated voltage for 5 seconds at 50 mA max. current

NP0 (C0G) CAPACITANCE RANGE – PREFERRED SIZES ARE SHADED

Case Size

Soldering

0805

1206

1210

1808

1812

ReflowꢀWave

Reflow Only

(L) Length

mm

(in.)

2.10 ± 0.20

±.±0 ± 0.±0

±.±0 ± 0.40

4.60 ± 0.50

(0.085 ± 0.008)

(0.1±0 ± 0.012)

(0.1±0 ± 0.016)

(0.181 ± 0.020)

(0.177 ± 0.012)

(W) Width

mm

1.25 ± 0.20

1.60 +0.±0ꢀ-0.10

2.50 ± 0.±0

2.00 ± 0.20

±.20 ± 0.±0

(in.)

mm

(in.)

(0.049 ± 0.008)

(0.06± +0.012ꢀ-0.004)

(0.098 ± 0.012)

(0.079 ± 0.008)

(0.126 ± 0.008)

(T) Thickness

(t) Terminal

1.±5

1.80

2.80

2.20

2.80

(0.05±)

(0.071)

(0.110)

(0.087)

(0.100)

min

0.50 ± 0.20

0.60 ± 0.20

0.75 ± 0.±5

max

(0.020 ± 0.008)

(0.024 ± 0.008)

(0.0±0 ± 0.014)

Voltage (V)

600 6±0 1000 600 6±0 1000 1500 2000 600 6±0 1000 1500 2000 ±000 600 6±0 1000 1500 2000 2500 ±000 4000 600 6±0 1000 1500 2000 2500 ±000 4000

Cap (pF)

.5 0R5

1.0 1R0

1.2 1R2

1.5 1R5

1.8 1R8

2.2 2R2

2.7 2R7

±.± ±R±

±.9 ±R9

4.7 4R7

5.6 5R6

6.8 6R8

8.2 8R2

10 100

12 120

15 150

18 180

22 220

27 270

±± ±±0

±9 ±90

47 470

56 560

68 680

82 820

100 101

120 121

150 151

180 181

220 221

270 271

±±0 ±±1

±90 ±91

470 471

560 561

680 681

750 751

820 821

A

X

C

X

C

A

X

C

X

C

E

X

M

C

E

X

M

C

E

X

D

C

E

X

M

C

E

C

F

C

F

C

F

C

F

C

E

F

C

F

C

F

C

E

M

C

E

M

C

E

D

C

E

F

M

C

E

F

G

C

E

F

C

E

C

F

C

F

C

F

E

F

G

C

F

C

F

E

F

G

F

C

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

G

E

G

F

E

F

E

F

1000 102

1200 122

E

F

E

F

E

F

1500 152

F

G

F

1800 182

G

F

2200 222

F

E

F

G

2700 272

F

±±00 ±±2

F

±900 ±92

F

4700 472

G

5600 562

6800 682

8200 822

E

F

Cap (µF) 0.010 10±

0.012 12±

0.015 15±

0.018 18±

0.022 22±

0.027 27±

0.0±± ±±±

0.047 47±

0.056 56±

0.068 68±

0.100 104

0.12 124

0.15 154

0.18 184

0.22 224

0.27 274

0.±± ±±4

Voltage (V)

Case Size

F

G

F

G

F

G

F

G

600 6±0 1000 600 6±0 1000 1500 2000 600 6±0 1000 1500 2000 ±000 600 6±0 1000 1500 2000 2500 ±000 4000 600 6±0 1000 1500 2000 2500 ±000 4000

0805 1206 1210 1808 1812

NOTE: Contact factory for non-specified capacitance values

Letter

Max.

A

C

E

F

G

X

7

0.81±

1.448

1.80±4

(0.071)

2.2098

(0.087)

2.794

0.940

(0.0±7)

±.±0

Thickness (0.0±2)

(0.057)

(0.110)

(0.1±0)

101±17

96

High Voltage MLC Chips

For 600V to 5000V Applications

NP0 (C0G) CAPACITANCE RANGE – PREFERRED SIZES ARE SHADED

Case Size

Soldering

1825

2220

2225

3640

Reflow Only

(L) Length

mm

4.60 ± 0.50

5.70 ± 0.50

9.14 ± 0.25

(in.)

(0.181 ± 0.020)

(0.224 ± 0.020)

(0.225 ± 0.010)

(0.±60 ± 0.010)

(W) Width

mm

(in.)

6.±0 ± 0.40

5.00 ± 0.40

6.±0 ± 0.40

10.2 ± 0.25

(0.248 ± 0.016)

(0.197 ± 0.016)

(0.250 ± 0.010)

(0.400 ± 0.010)

(T) Thickness mm

(in.)

(t) Terminal

±.40

(0.1±4)

0.75 ± 0.±5

±.40

(0.1±4)

0.85 ± 0.±5

±.40

(0.100)

0.85 ± 0.±5

2.54

(0.100)

0.76 (0.0±0)

1.52 (0.060)

min

max

(0.0±0 ± 0.014)

(0.0±± ± 0.014)

Voltage (V)

600 6±0 1000 1500 2000 2500 ±000 4000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000

Cap (pF) 1.5 1R5

1.8 1R8

2.2 2R2

2.7 2R7

±.± ±R±

±.9 ±R9

4.7 4R7

5.6 5R6

6.8 6R8

8.2 8R2

10 100

12 120

15 150

18 180

22 220

27 270

±± ±±0

±9 ±90

47 470

56 560

68 680

82 820

E

F

G

F

E

F

G

E

G

E

F

G

E

F

G

F

E

F

G

7

E

F

G

7

E

F

G

7

E

F

E

F

E

F

E

F

E

F

E

F

E

F

G

E

F

G

E

F

G

E

F

E

F

E

F

E

F

G

E

F

G

F

G

F

100 101

120 121

150 151

180 181

220 221

270 271

±±0 ±±1

±90 ±91

470 471

560 561

680 681

750 751

820 821

1000 102

1200 122

1500 152

1800 182

2200 222

2700 272

±±00 ±±2

±900 ±92

4700 472

5600 562

6800 682

8200 822

Cap (µF)0.010 10±

G

F

G

F

G

F

G

F

G

F

G

0.012 12±

0.015 15±

0.018 18±

0.022 22±

0.027 227

0.0±± ±±±

0.0±9 ±9±

0.047 47±

0.056 56±

0.068 68±

0.100 104

Voltage (V)

E

F

G

F

G

600 6±0 1000 1500 2000 2500 ±000 4000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000

Case Size

1825

2220

2225

3640

NOTE: Contact factory for non-specified capacitance values

Letter

Max.

A

C

E

F

G

2.794

(0.110)

X

7

0.81±

1.448

1.80±4

(0.071)

2.2098

(0.087)

0.940

(0.0±7)

±.±0

Thickness (0.0±2)

(0.057)

(0.1±0)

101±17

97

High Voltage MLC Chips

For 600V to 5000V Applications

X7RꢀDielectric

Performance Characteristics

Capacitance Range

10 pF to 0.82 µF (25/C, 1.0 ±0.2 Vrms at 1kHz)

Capacitance Tolerances

Dissipation Factor

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

Insulation Resistance (+25/C, at 500 VDC)

Insulation Resistance (+125/C, at 500 VDC)

Dielectric Strength

±10ꢁ% ±20ꢁ% +80ꢁ, -20ꢁ

2.5ꢁ max. (+25/C, 1.0 ±0.2 Vrms, 1kHz)

-55/C to +125/C

±15ꢁ (0 VDC)

600, 6±0, 1000, 1500, 2000, 2500, ±000, 4000 & 5000 VDC (+125/C)

100K MΩ min. or 1000 MΩ - µF min., whichever is less

10K MΩ min. or 100 MΩ - µF min., whichever is less

Minimum 120ꢁ rated voltage for 5 seconds at 50 mA max. current

X7R CAPACITANCE RANGE – PREFERRED SIZES ARE SHADED

Case Size

Soldering

0805

1206

1210

1808

1812

ReflowꢀWave

Reflow Only

(L) Length

mm

2.10 ± 0.20

±.±0 ± 0.±0

±.±0 ± 0.40

4.60 ± 0.50

(in.)

(0.085 ± 0.008)

(0.1±0 ± 0.012)

(0.1±0 ± 0.016)

(0.181 ± 0.020)

(0.177 ± 0.012)

(W) Width

mm

(in.)

mm

(in.)

1.25 ± 0.20

1.60 +0.±0ꢀ-0.10

2.50 ± 0.±0

2.00 ± 0.20

±.20 ± 0.±0

(0.049 ± 0.008)

(0.06± +0.012ꢀ-0.004)

(0.098 ± 0.012)

(0.079 ± 0.008)

(0.126 ± 0.008)

(T) Thickness

(t) Terminal

1.±5

(0.05±)

1.80

(0.071)

2.80

(0.110)

2.20

(0.087)

2.80

(0.100)

min

max

0.50 ± 0.20

(0.020 ± 0.008)

0.60 ± 0.20

(0.024 ± 0.008)

0.75 ± 0.±5

(0.0±0 ± 0.014)

0.75 ± 0.±5

(0.0±0 ± 0.014)

0.75 ± 0.±5

(0.0±0 ± 0.014)

Voltage (V)

Cap (pF)

600

6±0 1000 600

6±0 1000 1500 2000 600

6±0 1000 1500 2000 2500 ±000 4000 600

6±0 1000 1500 2000 2500 ±000 4000

100 101

120 121

150 151

180 181

220 221

270 271

±±0 ±±1

±90 ±91

470 471

560 561

680 681

750 751

820 821

1000 102

1200 122

1500 152

1800 182

2200 222

2700 272

±±00 ±±2

±900 ±92

4700 472

5600 562

6800 682

8200 822

X

C

X

C

X

C

E

C

E

F

E

F

E

F

E

F

E

F

G

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

G

E

F

E

F

G

F

G

Cap (µF) 0.010 10±

0.015 15±

0.018 18±

0.022 22±

0.027 27±

0.0±± ±±±

0.0±9 ±9±

0.047 47±

0.056 56±

0.068 68±

0.082 82±

0.100 104

0.150 154

0.220 224

0.270 274

0.±±0 ±±4

0.±90 ±94

0.470 474

0.560 564

0.680 684

0.820 824

1.000 105

Voltage (V)

F

G

600

6±0 1000 600

6±0 1000 1500 2000 600

6±0 1000 1500 2000 2500 ±000 4000 600

6±0 1000 1500 2000 2500 ±000 4000

Case Size

0805

1206

1210

1808

1812

NOTE: Contact factory for non-specified capacitance values

Letter

Max.

A

C

E

F

G

2.794

(0.110)

X

7

0.81±

1.448

1.80±4

(0.071)

2.2098

(0.087)

0.940

(0.0±7)

±.±0

Thickness (0.0±2)

(0.057)

(0.1±0)

101±17

98

High Voltage MLC Chips

For 600V to 5000V Applications

X7R CAPACITANCE RANGE

PREFERRED SIZES ARE SHADED

Case Size

Soldering

1825

2220

2225

3640

Reflow Only

(L) Length

mm

4.60 ± 0.50

5.70 ± 0.50

9.14 ± 0.25

(in.)

(0.181 ± 0.020)

(0.224 ± 0.020)

(0.225 ± 0.010)

(0.±60 ± 0.010)

(W) Width

mm

(in.)

6.±0 ± 0.40

5.00 ± 0.40

6.±0 ± 0.40

10.2 ± 0.25

(0.248 ± 0.016)

(0.197 ± 0.016)

(0.250 ± 0.010)

(0.400 ± 0.010)

(T) Thickness mm

(in.)

(t) Terminal

±.40

(0.1±4)

0.75 ± 0.±5

±.40

(0.1±4)

0.85 ± 0.±5

±.40

(0.100)

2.54

(0.100)

0.76 (0.0±0)

1.52 (0.060)

min

0.85 ± 0.±5

(0.0±± ± 0.014)

max

(0.0±0 ± 0.014)

(0.0±± ± 0.014)

Voltage (V)

600 6±0 1000 1500 2000 2500 ±000 4000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000

Cap (pF) 100 101

120 121

150 151

180 181

220 221

270 271

±±0 ±±1

±90 ±91

470 471

560 561

680 681

750 751

820 821

1000 102

1200 122

1500 152

1800 182

2200 222

2700 272

±±00 ±±2

±900 ±92

4700 472

5600 562

6800 682

8200 822

Cap (µF)0.010 10±

0.015 15±

0.018 18±

0.022 22±

0.027 27±

0.0±± ±±±

0.0±9 ±9±

0.047 47±

0.056 56±

0.068 68±

0.082 82±

0.100 104

0.150 154

0.220 224

0.270 274

0.±±0 ±±4

0.±90 ±94

0.470 474

0.560 564

0.680 684

0.820 824

1.000 105

Voltage (V)

Case Size

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

P

G

F

G

F

G

F

G

600 6±0 1000 1500 2000 2500 ±000 4000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000

1825

2220

2225

3640

NOTE: Contact factory for non-specified capacitance values

Letter

Max.

A

C

E

F

G

2.794

(0.110)

X

7

0.81±

1.448

1.80±4

(0.071)

2.2098

(0.087)

0.940

(0.0±7)

±.±0

Thickness (0.0±2)

(0.057)

(0.1±0)

101±17

99

High Voltage MLC Chips

Tin/Lead Termination “B”

For 600V to 5000V Applications

AVX Corporation will support those customers for commercial and military Multi-

layer Ceramic Capacitors with a termination consisting of 5ꢀ minimum lead. This

termination is indicated by the use of a “B” in the 12th position of the AVX Cata-

log Part Number. This fulfills AVX’s commitment to providing a full range of prod-

ucts to our customers. AVX has provided in the following pages, a full range of

values that we are offering in this “B” termination.

Larger physical sizes than normally encountered chips are used to make high volt-

age MLC chip product. Special precautions must be taken in applying these chips

in surface mount assemblies. The temperature gradient during heating or cooling

cycles should not exceed 4ºC per second. The preheat temperature must be

within 50ºC of the peak temperature reached by the ceramic bodies through the

soldering process. Chip sizes 1210 and larger should be reflow soldered only. Ca-

pacitors may require protective surface coating to prevent external arcing.

For 1825, 2225 and 3640 sizes, AVX offers leaded version in either thru-hole or

SMT configurations (for details see section on high voltage leaded MLC chips).

NEW 630V RANGE

HOW TO ORDER

LD08

A

271

K

A

B

1

A

AVX

Voltage

600V/630V = C

1000V = A

1500V = S

2000V = G

2500V = W

3000V = H

4000V = J

Temperature Capacitance Code

Capacitance

Tolerance

Test

Termination

Packaging Special Code

Style

Coefficient

C0G = A

X7R = C

(2 significant digits

+ no. of zeros)

Examples:

Level

B = 5ꢀ Min Pb

2 = 7" Reel** A = Standard

LD05 - 0805

LD06 - 1206

LD10 - 1210

LD08 - 1808

LD12 - 1812

LD13 - 1825

LD20 - 2220

LD14 - 2225

LD40 - 3640

***

C0G: J = 5ꢀ

A = Standard X = FLEXITERM^®4 = 13" Reel

K = 10ꢀ

M = 20ꢀ

X7R: K = 10ꢀ

M = 20ꢀ

with 5ꢀ min.

Pb*

10 pF = 100

100 pF = 101

1,000 pF = 102

22,000 pF = 223

220,000 pF = 224

1 μF =105

Z = +80ꢀ, -20ꢀ

5000V = K

Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.

Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.

*

FLEXITERM is not available in the LD40 Style

Not RoHS Compliant

** The LD40 Style is not available on 7" Reels.

*** AVX offers nonstandard chip sizes. Contact factory for details.

DIMENSIONS

millimeters (inches)

SIZE

LD05 (0805)

LD06 (1206)

LD10* (1210) LD08* (1808) LD12* (1812) LD13* (1825) LD20* (2220) LD14* (2225) LD40* (3640)

(L) Length

2.10 0.20

3.30 0.30

3.30 0.40 4.60 0.50 4.60 0.50 4.60 0.50 5.70 0.50 5.70 0.50 9.14 0.25

(0.083 0.008) (0.130 0.012) (0.130 0.016) (0.181 0.020) (0.181 0.020) (0.181 0.020) (0.224 0.020) (0.224 0.020) (0.360 0.010)

+0.30

(W) Width

1.25 0.20

(0.049 0.008) (0.063

1.60

2.50 0.30

2.00 0.20

3.20 0.30

6.30 0.40

5.00 0.40

6.30 0.40

10.2 0.25

-0.10

+0.012

-0.004

)

(0.098 0.012) (0.079 0.008) (0.126 0.012) (0.248 0.016) (0.197 0.016) (0.248 0.016) (0.400 0.010)

(T) Thickness

Max.

1.35

(0.053)

1.80

(0.071)

0.60 0.20

2.80

(0.110)

2.20

(0.087)

2.80

(0.110)

3.40

(0.134)

3.40

(0.134)

3.40

(0.134)

2.54

(0.100)

(t) terminal min.

0.50 0.20

0.75 0.35

0.85 0.35

0.76 (0.030)

max. (0.020 0.008) (0.024 0.008) (0.030 0.014) (0.030 0.014) (0.030 0.014) (0.030 0.014) (0.033 0.014) (0.033 0.014) 1.52 (0.060)

* Reflow soldering only.

Performance of SMPS capacitors can be simulated by downloading SpiCalci software program - http://www.avx.com/SpiApps/default.asp#spicalci

Custom values, ratings and configurations are also available.

011916

100

High Voltage MLC Chips

Tin/Lead Termination “B”

For 600V to 5000V Applications

C0G Dielectric

Performance Characteristics

Capacitance Range

10 pF to 0.047 μF

(25ꢁC, 1.0 0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)

Capacitance Tolerances

5ꢀ, 10ꢀ, 20ꢀ

Dissipation Factor

0.1ꢀ max. (+25ꢁC, 1.0 0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)

-55ꢁC to +125ꢁC

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

Insulation Resistance (+25ꢁC, at 500 VDC)

Insulation Resistance (+125ꢁC, at 500 VDC)

Dielectric Strength

0

30 ppm/ꢁC (0 VDC)

600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125ꢁC)

100K MΩ min. or 1000 MΩ - μF min., whichever is less

10K MΩ min. or 100 MΩ - μF min., whichever is less

Minimum 120ꢀ rated voltage for 5 seconds at 50 mA max. current

HIGH VOLTAGE C0G CAPACITANCE VALUES

VOLTAGE LD05 (0805) LD06 (1206) LD10 (1210) LD08 (1808) LD12 (1812) LD13 (1825) LD20 (2220) LD14 (2225) LD40 (3640)

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

10pF

330pF

10pF

180pF

—

10 pF

1200 pF

10 pF

560 pF

10 pF

270 pF

10 pF

120 pF

—

100 pF

2700 pF

10 pF

1500 pF

10 pF

680 pF

10 pF

270 pF

—

100 pF

3300 pF

100 pF

2200 pF

10 pF

820 pF

10 pF

330 pF

10 pF

180 pF

10 pF

120 pF

10 pF

47 pF

—

100 pF

5600 pF

100 pF

3300 pF

10 pF

1000 pF

0.012 μF

100 pF

8200 pF

100 pF

4700 pF

100 pF

1800 pF

10 pF

1000 pF

0.012 μF

1000 pF

0.010 μF

100 pF

4700 pF

100 pF

2200 pF

100 pF

1500 pF

10 pF

1000 pF

0.018 μF

1000 pF

0.010 μF

100 pF

5600 pF

100 pF

2700 pF

100 pF

1800 pF

10 pF

1000 pF

0.047 μF

1000 pF

0.022 μF

100 pF

600/630

1000

1500

2000

2500

3000

4000

5000

—

1800 pF

10 pF

0.010 μF

100 pF

—

1000 pF

10 pF

6800 pF

100 pF

—

470 pF

10 pF

1200 pF

10 pF

3900 pF

100 pF

—

330 pF

10 pF

820 pF

10 pF

1000 pF

10 pF

1200 pF

10 pF

2700 pF

100 pF

—

150 pF

—

330 pF

—

470 pF

10 pF

220 pF

560 pF

10 pF

270 pF

1200 pF

10 pF

—

820 pF

X7R Dielectric

Performance Characteristics

Capacitance Range

Capacitance Tolerances

Dissipation Factor

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

Insulation Resistance (+25ꢁC, at 500 VDC)

Insulation Resistance (+125ꢁC, at 500 VDC)

Dielectric Strength

10 pF to 0.56 μF (25ꢁC, 1.0 0.2 Vrms at 1kHz)

10ꢀ; 20ꢀ; +80ꢀ, -20ꢀ

2.5ꢀ max. (+25ꢁC, 1.0 0.2 Vrms, 1kHz)

-55ꢁC to +125ꢁC

15ꢀ (0 VDC)

600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125ꢁC)

100K MΩ min. or 1000 MΩ - μF min., whichever is less

10K MΩ min. or 100 MΩ - μF min., whichever is less

Minimum 120ꢀ rated voltage for 5 seconds at 50 mA max. current

HIGH VOLTAGE X7R MAXIMUM CAPACITANCE VALUES

VOLTAGE

0805

1206

1210

1808

1812

1825

2220

2225

3640

min.

100pF

6800pF

100pF

1500pF

—

1000 pF

0.022 μF

100 pF

6800 pF

100 pF

2700 pF

10 pF

1500 pF

—

1000 pF

0.056 μF

1000 pF

0.015 μF

100 pF

5600 pF

100 pF

3300 pF

—

1000 pF

0.068 μF

1000 pF

0.018 μF

100 pF

6800 pF

100 pF

3300 pF

10 pF

1000 pF

0.120 μF

1000 pF

0.039 μF

100 pF

0.015 μF

100 pF

8200 pF

10 pF

0.010 μF

0.270 μF

1000 pF

0.100 μF

1000 pF

0.056 μF

100 pF

0.022 μF

100 pF

0.015 μF

100 pF

0.010 μF

—

0.010 μF

0.270 μF

1000 pF

0.120 μF

1000 pF

0.056 μF

1000 pF

0.027 μF

100 pF

0.018 μF

100 pF

0.012 μF

—

0.010 μF

0.330 μF

1000 pF

0.150 μF

1000 pF

0.068 μF

1000 pF

0.033 μF

100 pF

0.022 μF

100 pF

0.015 μF

—

0.010 μF

0.560 μF

0.010 μF

0.220 μF

1000 pF

0.100 μF

1000 pF

0.027 μF

1000 pF

0.022 μF

1000 pF

0.018 μF

100 pF

600/630

1000

1500

2000

2500

3000

4000

5000

max.

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

—

2200 pF

10 pF

5600 pF

10 pF

—

1800 pF

—

3900 pF

—

6800 pF

100 pF

3300 pF

—

011916

101

High Voltage MLC Chips FLEXITERM^®

For 600V to 5000V Applications

High value, low leakage and small size are difficult parameters to obtain in ca-

pacitors for high voltage systems. AVX special high voltage MLC chips capacitors

meet these performance characteristics and are designed for applications such

as snubbers in high frequency power converters, resonators in SMPS, and high

voltage coupling/DC blocking. These high voltage chip designs exhibit low ESRs

at high frequencies.

To make high voltage chips, larger physical sizes than are normally encountered

are necessary. These larger sizes require that special precautions be taken in

applying these chips in surface mount assemblies. In response to this, and to fol-

low from the success of the FLEXITERM^®range of low voltage parts, AVX is de-

lighted to offer a FLEXITERM^®high voltage range of capacitors, FLEXITERM^®.

The FLEXITERM^®layer is designed to enhance the mechanical flexure and tem-

perature cycling performance of a standard ceramic capacitor, giving customers

a solution where board flexure or temperature cycle damage are concerns.

HOW TO ORDER

1808

A

C

272

K

A

Z

1

A

AVX

Style

0805

1206

1210

1808

1812

1825

2220

2225

***

Voltage

Temperature Capacitance Code Capacitance

Test Level

Termination*

Z = FLEXITERM^®

100ꢀ Tin

Packaging

Special

Code

600V/630V = C Coefficient

(2 significant digits

+ no. of zeros)

Examples:

Tolerance

C0G: J = 5ꢀ

K = 10ꢀ

2 = 7" Reel

1000V = A

1500V = S

2000V = G

2500V = W

3000V = H

4000V = J

5000V = K

C0G = A

X7R = C

4 = 13" Reel A = Standard

(RoHS Compliant)

10 pF = 100

M = 20ꢀ

100 pF = 101 X7R: K = 10ꢀ

1,000 pF = 102

22,000 pF = 223

220,000 pF = 224

1 μF =105

M = 20ꢀ

Z = +80ꢀ,

-20ꢀ

Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.

Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.

*** AVX offers nonstandard chip sizes. Contact factory for details.

DIMENSIONS

millimeters (inches)

SIZE

0805

1206

1210*

1808*

1812*

1825*

2220*

2225*

(L) Length

2.10 0.20

(0.083 0.008)

3.30 0.30

(0.130 0.012)

3.30 0.40

(0.130 0.016)

4.60 0.50

(0.181 0.020)

4.60 0.50

(0.181 0.020)

4.60 0.50

(0.181 0.020)

5.70 0.50

(0.224 0.020)

5.70 0.50

(0.224 0.020)

+0.30

(W) Width

1.25 0.20

(0.049 0.008)

1.60

(0.063

2.50 0.30

(0.098 0.012)

2.00 0.20

(0.079 0.008)

3.20 0.30

(0.126 0.012)

6.30 0.40

(0.248 0.016)

5.00 0.40

(0.197 0.016)

6.30 0.40

(0.248 0.016)

-0.10

+0.012

-0.004

)

(T) Thickness

Max.

1.35

(0.053)

1.80

(0.071)

2.80

(0.110)

2.20

(0.087)

2.80

(0.110)

3.40

(0.134)

3.40

(0.134)

3.40

(0.134)

(t) terminal min.

0.50 0.20

0.60 0.20

(0.024 0.008)

0.75 0.35

(0.030 0.014)

0.75 0.35

(0.030 0.014)

0.75 0.35

(0.030 0.014)

0.75 0.35

(0.030 0.014)

0.85 0.35

(0.033 0.014)

0.85 0.35

(0.033 0.014)

max. (0.020 0.008)

*Reflow Soldering Only

Performance of SMPS capacitors can be simulated by downloading SpiCalci software program - http://www.avx.com/SpiApps/default.asp#spicalci

Custom values, ratings and configurations are also available.

011916

102

High Voltage MLC Chips FLEXITERM^®

For 600V to 5000V Applications

NP0 (C0G) Dielectric

Performance Characteristics

Capacitance Range

10 pF to 0.100 μF (+25ꢁC, 1.0 0.2 Vrms, 1kHz)

5ꢀ, 10ꢀ, 20ꢀ

0.1ꢀ max. (+25ꢁC, 1.0 0.2 Vrms, 1kHz)

-55ꢁC to +125ꢁC

Capacitance Tolerances

Dissipation Factor

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

Insulation Resistance (+25ꢁC, at 500 VDC)

Insulation Resistance (+125ꢁC, at 500 VDC)

Dielectric Strength

0

30 ppm/ꢁC (0 VDC)

600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125ꢁC)

100K MΩ min. or 1000 MΩ - μF min., whichever is less

10K MΩ min. or 100 MΩ - μF min., whichever is less

Minimum 120ꢀ rated voltage for 5 seconds at 50 mA max. current

NP0 (C0G) CAPACITANCE RANGE

PREFERRED SIZES ARE SHADED

Case Size

0805

1206

1210

1808

1812

Soldering

Reflow/Wave

Reflow Only

(L) Length

(W) Width

mm

2.10 0.20

3.30 0.30

3.30 0.40

4.60 0.50

(in.)

(0.083 0.008)

1.25 0.20

(0.049 0.008)

(0.130 0.012)

1.60 +0.30/-0.10

(0.063 +0.012/-0.004)

(0.130 0.016)

2.50 0.30

(0.098 0.012)

(0.181 0.020)

2.00 0.20

(0.079 0.008)

(0.181 0.020)

3.20 0.30

(0.126 0.012)

mm

(in.)

(T) Thickness

(t) Terminal

mm

(in.)

min

max

1.35

1.80

2.80

2.20

2.80

(0.053)

(0.071)

(0.110)

(0.087)

(0.110)

0.50 0.20

(0.020 0.008)

0.60 0.20

(0.024 0.008)

0.75 0.35

(0.030 0.014)

0.75 0.35

(0.030 0.014)

0.75 0.35

(0.030 0.014)

Voltage (V)

Cap (pF)

600

630 1000 600

630 1000 1500 2000 600

630 1000 1500 2000 2500 3000 4000 600

630 1000 1500 2000 2500 3000 4000

1.5 1R5

1.8 1R8

2.2 2R2

2.7 2R7

3.3 3R3

3.9 3R9

4.7 4R7

5.6 5R6

6.8 6R8

8.2 8R2

10 100

A

X

A

X

C

E

X

C

E

X

M

C

E

X

D

C

E

X

D

C

E

C

F

C

F

C

F

C

F

C

F

A

X

C

E

C

E

D

C

E

D

C

E

F

D

C

E

F

C

E

C

E

C

E

C

E

C

F

E

F

G

C

F

E

F

C

F

E

F

C

F

G

C

F

G

E

F

G

12 120

15 150

18 180

22 220

27 270

33 330

39 390

47 470

56 560

68 680

82 820

100 101

120 121

150 151

180 181

220 221

270 271

330 331

390 391

470 471

560 561

680 681

750 751

820 821

1000 102

1200 122

1500 152

1800 182

2200 222

2700 272

3300 332

3900 392

4700 472

5600 562

6800 682

8200 822

X

C

F

G

F

E

G

F

E

F

E

F

G

F

G

E

F

E

F

Cap (μF) 0.010 103

0.012 123

0.015 153

0.018 183

0.022 223

0.033 333

0.047 473

0.056 563

0.068 683

0.100 104

Voltage (V)

E

F

G

600

630 1000 600

630 1000 1500 2000 600

630 1000 1500 2000 2500 3000 4000 600

630 1000 1500 2000 2500 3000 4000

Case Size

0805

1206

1210

1808

1812

011916

103

High Voltage MLC Chips FLEXITERM^®

For 600V to 5000V Applications

NP0 (C0G) CAPACITANCE RANGE

PREFERRED SIZES ARE SHADED

Case Size

Soldering

1825

2220

2225

Reflow Only

(L) Length

mm

4.60 0.50

5.70 0.50

5.72 0.25

(in.)

(0.181 0.020)

(0.224 0.020)

(0.225 0.010)

(W) Width

mm

(in.)

6.30 0.40

(0.248 0.016)

5.00 0.40

(0.197 0.016)

6.35 0.25

(0.250 0.010)

(T) Thickness mm

(in.)

3.40

(0.134)

3.40

(0.134)

2.54

(0.100)

(t) Terminal

min

max

0.75 0.35

(0.030 0.014)

0.85 0.35

(0.033 0.014)

0.85 0.35

Voltage (V)

600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000

Cap (pF) 1.5 1R5

1.8 1R8

2.2 2R2

2.7 2R7

3.3 3R3

3.9 3R9

4.7 4R7

5.6 5R6

6.8 6R8

8.2 8R2

10 100

12 120

15 150

18 180

22 220

27 270

33 330

39 390

47 470

56 560

68 680

82 820

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

G

F

100 101

120 121

150 151

180 181

220 221

270 271

330 331

390 391

470 471

560 561

680 681

750 751

820 821

1000 102

1200 122

1500 152

1800 182

2200 222

2700 272

3300 332

3900 392

4700 472

5600 562

6800 682

8200 822

Cap (μF) 0.010 103

G

F

G

F

G

F

G

F

G

E

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

0.012 123

0.015 153

0.018 183

0.022 223

0.033 333

0.047 473

0.056 563

0.068 683

0.100 104

Voltage (V)

G

600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000

Case Size

1825

2220

2225

NOTE: Contact factory for non-specified capacitance values

Letter

Max.

Thickness (0.032)

A

0.813

C

1.448

(0.057)

E

F

G

X

1.8034

(0.071)

2.2098

(0.087)

2.794

(0.110)

0.940

(0.037)

011916

104

High Voltage MLC Chips FLEXITERM^®

For 600V to 5000V Applications

X7R Dielectric

Performance Characteristics

Capacitance Range

Capacitance Tolerances

Dissipation Factor

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

Insulation Resistance (+25ꢁC, at 500 VDC)

Insulation Resistance (+125ꢁC, at 500 VDC)

Dielectric Strength

10 pF to 0.82 μF (25ꢁC, 1.0 0.2 Vrms at 1kHz)

10ꢀ; 20ꢀ; +80ꢀ, -20ꢀ

2.5ꢀ max. (+25ꢁC, 1.0 0.2 Vrms, 1kHz)

-55ꢁC to +125ꢁC

15ꢀ (0 VDC)

600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125ꢁC)

100K MΩ min. or 1000 MΩ - μF min., whichever is less

10K MΩ min. or 100 MΩ - μF min., whichever is less

Minimum 120ꢀ rated voltage for 5 seconds at 50 mA max. current

X7R CAPACITANCE RANGE

PREFERRED SIZES ARE SHADED

Case Size

Soldering

0805

1206

1210

1808

1812

Reflow/Wave

Reflow Only

(L) Length

mm

2.10 0.20

3.30 0.30

3.30 0.40

4.60 0.50

(in.)

(0.083 0.008)

(0.130 0.012)

(0.130 0.016)

(0.181 0.020)

(W) Width

mm

(in.)

1.25 0.20

(0.049 0.008)

1.60 +0.30/-0.10

(0.063 +0.012/-0.004)

2.50 0.30

(0.098 0.012)

2.00 0.20

(0.079 0.008)

3.20 0.30

(0.126 0.012)

(T) Thickness

(t) Terminal

mm

(in.)

min

max

1.35

1.80

2.80

2.20

2.80

(0.053)

(0.071)

(0.110)

(0.087)

(0.110)

0.50 0.20

(0.020 0.008)

0.60 0.20

(0.024 0.008)

0.75 0.35

(0.030 0.014)

0.75 0.35

(0.030 0.014)

0.75 0.35

(0.030 0.014)

Voltage (V)

Cap (pF)

600

630 1000 600

630 1000 1500 2000 600

630 1000 1500 2000 2500 3000 4000 600

630 1000 1500 2000 2500 3000 4000

100 101

120 121

150 151

180 181

220 221

270 271

330 331

390 391

470 471

560 561

680 681

750 751

820 821

1000 102

1200 122

1500 152

1800 182

2200 222

2700 272

3300 332

3900 392

4700 472

5600 562

6800 682

8200 822

X

C

X

C

E

C

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

E

F

G

F

G

F

G

Cap (μF) 0.010 103

0.015 153

0.018 183

0.022 223

0.027 273

0.033 333

0.039 393

0.047 473

0.056 563

0.068 683

0.082 823

0.100 104

0.150 154

0.220 224

0.270 274

0.330 334

0.390 394

0.470 474

0.560 564

0.680 684

0.820 824

1.000 105

Voltage (V)

F

E

G

E

F

G

600

630 1000 600

630 1000 1500 2000 600

630 1000 1500 2000 2500 3000 4000 600

630 1000 1500 2000 2500 3000 4000

Case Size

0805

1206

1210

1808

1812

011916

105

High Voltage MLC Chips FLEXITERM^®

For 600V to 5000V Applications

X7R CAPACITANCE RANGE

PREFERRED SIZES ARE SHADED

Case Size

1825

2220

2225

Soldering

Reflow Only

(L) Length

(W) Width

mm

4.60 0.50

5.70 0.50

5.72 0.25

(in.)

mm

(in.)

(0.181 0.020)

6.30 0.40

(0.248 0.016)

(0.224 0.020)

5.00 0.40

(0.197 0.016)

(0.225 0.010)

6.35 0.25

(0.250 0.010)

(T) Thickness mm

(in.)

3.40

(0.134)

3.40

(0.134)

2.54

(0.100)

(t) Terminal

min

max

0.75 0.35

(0.030 0.014)

0.85 0.35

(0.033 0.014)

0.85 0.35

Voltage (V)

600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000

Cap (pF) 100 101

120 121

150 151

180 181

220 221

270 271

330 331

390 391

470 471

560 561

680 681

750 751

820 821

1000 102

1200 122

1500 152

1800 182

2200 222

2700 272

3300 332

3900 392

4700 472

5600 562

6800 682

8200 822

Cap (μF) 0.010 103

0.015 153

0.018 183

0.022 223

0.027 273

0.033 333

0.039 393

0.047 473

0.056 563

0.068 683

0.082 823

0.100 104

0.150 154

0.220 224

0.270 274

0.330 334

0.390 394

0.470 474

0.560 564

0.680 684

0.820 824

1.000 105

Voltage (V)

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

F

G

P

G

F

G

F

G

F

G

600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000

Case Size

1825

2220

2225

NOTE: Contact factory for non-specified capacitance values

Letter

Max.

Thickness (0.032)

A

0.813

C

1.448

(0.057)

E

F

G

P

X

1.8034

(0.071)

2.2098

(0.087)

2.794

(0.110)

3.048

(0.120)

0.940

(0.037)

011916

106

High Voltage MLC Chip Capacitors

For 600V to 3000V Automotive Applications – AEC-Q200

Modern automotive electronics could require components capable to work with high

voltage (e.g. xenon lamp circuits or power converters in hybrid cars). AVX offer high

voltage ceramic capacitors qualified according to AEC-Q200 standard.

High value, low leakage and small size are difficult parameters to obtain in capacitors

for high voltage systems. AVX special high voltage MLC chip capacitors meet these

performance characteristics and are designed for applications such as snubbers in

high frequency power converters, resonators in SMPS, and high voltage coupling / dc

blocking. These high voltage chip designs exhibit low ESRs at high frequencies.

Due to high voltage nature, larger physical dimensions are necessary. These larger

sizes require special precautions to be taken in applying of MLC chips. The

temperature gradient during heating or cooling cycles should not exceed 4ºC per

second. The preheat temperature must be within 50ºC of the peak temperature

reached by the ceramic bodies through the soldering process. Chip sizes 1210 and

larger should be reflow soldered only. Capacitors may require protective surface

coating to prevent external arcing.

To improve mechanical and thermal resistance, AVX recommend to use flexible

terminations system - FLEXITERM^®.

HOW TO ORDER

1210

C

223

K

4

T

1

A

AVX

Voltage

Dielectric Capacitance Code Capacitance Failure Rate

Termination

Packaging

Special

Code

Style C = 630V

C = X7R

(2 significant digits

+ no. of zeros)

e.g. 103 = 10nF

(223 = 22nF)

Tolerance

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

4 = Automotive T = Plated Ni/Sn 1 or 2 = 7" Reel

1206

1210

1808 G = 2000V

1812 W = 2500V

2220

A = 1000V

S = 1500V

Z = FLEXITERM^®

A = Standard

3 or 4 = 13" Reel

H = 3000V

*AVX offers nonstandard case sizes. Contact factory for details.

Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal.

Please contact AVX for recommendations.

CHIP DIMENSIONS DESCRIPTION (See capacitance range chart on page 109)

L

L = Length

W

W = Width

T = Thickness

t = Terminal

T

t

X7R DIELECTRIC PERFORMANCE CHARACTERISTICS

Parameter/Test

Specification Limits

Measuring Conditions

Operating Temperature Range

-55ꢁC to +125ꢁC

Temperature Cycle Chamber

Capacitance

Dissipation Factor

Capacitance Tolerance

within specified tolerance

2.5ꢀ max.

5ꢀ (J), 10ꢀ (K), 20ꢀ (M)

Freq.: 1kHz 10ꢀ

Voltage: 1.0Vrm s 0.2Vrms

T = +25ꢁC, V = 0Vdc

Temperature Characteristics

X7R = 15ꢀ

Vdc = 0V, T = (-55ꢁC to +125ꢁC)

T = +25ꢁC, V = 500Vdc

T = +125ꢁC, V = 500Vdc

(t ≥ 120 sec, I ≤ 50mA)

100GΩ min. or 1000MΩ • ꢂF min. (whichever is less)

10GΩ min. or 100MΩ • ꢂF min. (whichever is less)

Insulation Resistance

120ꢀ of rated voltage

t ≤ 5 sec, I ≤ 50mA

Dielectric Strength

No breakdown or visual defect

062216

107

High Voltage MLC Chip Capacitors

For 600V to 3000V Automotive Applications – AEC-Q200

X7R CAPACITANCE RANGE

PREFERRED SIZES ARE SHADED

Case Size

Soldering

1206

1210

1808

1812

2220

Reflow/Wave

Reflow Only

(L) Length

mm

3.20 0.20

4.57 0.25

4.50 0.30

5.70 0.40

(in.)

(0.126 0.008)

(0.180 0.010)

(0.177 0.012)

(0.224 0.016)

(W) Width

mm

(in.)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

2.03 0.25

(0.080 0.010)

3.20 0.20

(0.126 0.008)

5.00 0.40

(0.197 0.016)

(T) Thickness

(t) Terminal

mm

(in.)

min

max

1.52

1.70

2.03

2.54

3.30

(0.060)

(0.067)

(0.080)

(0.100)

(0.130)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

Voltage (V)

630 1000 1500 2000 2500 630 1000 1500 2000 630 1000 1500 2000 2500 3000 630 1000 1500 2000 2500 3000 630 1000 1500 2000

Cap (pF)

100 101

120 121

150 151

180 181

220 221

270 271

330 331

390 391

470 471

560 561

680 681

820 821

1000 102

1200 122

1500 152

1800 182

2200 222

2700 272

3300 332

3900 392

4700 472

5600 562

6800 682

8200 822

0.01 103

0.012 123

0.015 153

0.018 183

0.022 223

0.027 273

0.033 333

0.039 393

0.047 473

0.056 563

0.068 683

0.082 823

0.100 104

0.120 124

0.150 154

Cap (μF)

Voltage (V)

630 1000 1500 2000 2500 630 1000 1500 2000 630 1000 1500 2000 2500 3000 630 1000 1500 2000 2500 3000 630 1000 1500 2000

Case Size

1206

1210

1808

1812

2220

NOTE: Contact factory for non-specified capacitance values

062216

108

MIL-PRF-55681/Chips

Part Number Example

CDR01 thru CDR06

MILITARY DESIGNATION PER MIL-PRF-55681

Part Number Example

CDR01 BP 101

B

K

S

M

L

W

D

t

MIL Style

Voltage-temperature

Limits

Capacitance

T

Rated Voltage

Capacitance Tolerance

Termination Finish

Failure Rate

NOTE: Contact factory for availability of Termination and Tolerance Options for

Specific Part Numbers.

MIL Style: CDR01, CDR02, CDR03, CDR04, CDR05,

Termination Finish:

CDR06

M = Palladium silver

N = Silver-nickel-gold

S = Solder coated final with a minimum of 4 percent lead

T = Silver

U = Base metallization-barrier metal-solder coated

(tin/lead alloy, with a minimum of 4 percent lead)

W = Base metallization-barrier metal-tinned

(tin or tin/lead alloy)

Y = Base metallization-barrier metal-tin (100 percent)

Z = Base metallization-barrier metal-tinned

(tin/lead alloy, with a minimum of 4 percent lead)

Voltage Temperature Limits:

BP = 0 30 ppm/ꢁC without voltage; 0 30 ppm/ꢁC with

rated voltage from -55ꢁC to +125ꢁC

BX = 15ꢀ without voltage; +15 –25ꢀ with rated voltage

from -55ꢁC to +125ꢁC

Capacitance: Two digit figures followed by multiplier

(number of zeros to be added) e.g., 101 = 100 pF

Rated Voltage: A = 50V, B = 100V

*See MIL-PRF-55681 Specification for more details

Capacitance Tolerance: J 5ꢀ, K 10ꢀ, M 20ꢀ

Failure Rate Level: M = 1.0ꢀ, P = .1ꢀ, R = .01ꢀ,

S = .001ꢀ

Packaging: Bulk is standard packaging. Tape and reel

per RS481 is available upon request.

Not RoHS Compliant

CROSS REFERENCE: AVX/MIL-PRF-55681/CDR01 THRU CDR06*

Thickness (T)

D

Termination Band (t)

Per

AVX

Length (L)

Width (W)

MIL-PRF-55681 Style

Min.

Max.

.055

.080

Min.

.030

—

Max.

—

Min.

.010

Max.

—

CDR01

CDR02

CDR03

CDR04

0805 .080 .015 .050 .015 .022

1805 .180 .015 .050 .015 .022

1808 .180 .015 .080 .018 .022

1812 .180 .015 .125 .015 .022

—

.030

—

+.020

-.015

+.020

-.015

CDR05

1825 .180

.250

.020

.080

—

.010

.030

CDR06

2225 .225 .020 .250 .020 .020

*For CDR11, 12, 13, and 14 see AVX Microwave Chip Capacitor Catalog

109

MIL-PRF-55681/Chips

Military Part Number Identification

CDR01 thru CDR06

CDR01 thru CDR06 to MIL-PRF-55681

Military

Type

Designation

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF

tolerance

in pF

tolerance

AVX Style 0805/CDR01

AVX Style 1808/CDR03

CDR01BP100B---

CDR01BP120B---

CDR01BP150B---

CDR01BP180B---

CDR01BP220B---

10

12

15

18

22

J,K

J

J,K

J

BP

100

CDR03BP331B---

CDR03BP391B---

CDR03BP471B---

CDR03BP561B---

CDR03BP681B---

330

390

470

560

680

J,K

J

J,K

J

BP

100

J,K

CDR01BP270B---

CDR01BP330B---

CDR01BP390B---

CDR01BP470B---

CDR01BP560B---

27

33

39

47

56

J

J,K

J

J,K

J

BP

100

CDR03BP821B--

CDR03BP102B---

CDR03BX123B--

CDR03BX153B---

CDR03BX183B---

820

1000

12,000

15,000

18,000

J

J,K

K

K,M

K

BP

BX

100

CDR01BP680B---

CDR01BP820B---

CDR01BP101B---

CDR01B--121B---

CDR01B--151B---

68

82

100

120

150

J,K

J

J,K

BP

BP,BX

100

CDR03BX223B---

CDR03BX273B---

CDR03BX333B---

CDR03BX393A---

CDR03BX473A---

22,000

27,000

33,000

39,000

47,000

K,M

K

K,M

K

BX

100

50

K,M

50

CDR01B--181B---

CDR01BX221B---

CDR01BX271B---

CDR01BX331B---

CDR01BX391B---

180

220

270

330

390

J,K

K,M

K

K,M

K

BP,BX

BX

100

CDR03BX563A---

CDR03BX683A---

56,000

68,000

K

K,M

BX

50

AVX Style 1812/CDR04

CDR04BP122B---

CDR04BP152B---

CDR04BP182B---

CDR04BP222B---

CDR04BP272B---

1200

1500

1800

2200

2700

J

J,K

J

J,K

J

BP

100

CDR01BX471B---

CDR01BX561B---

CDR01BX681B---

CDR01BX821B---

CDR01BX102B---

470

560

680

820

1000

K,M

K

K,M

K

BX

100

K,M

CDR04BP332B---

CDR04BX393B---

CDR04BX473B---

CDR04BX563B---

CDR04BX823A---

3300

J,K

K

K,M

K

BP

BX

100

50

CDR01BX122B---

CDR01BX152B---

CDR01BX182B---

CDR01BX222B---

CDR01BX272B---

1200

1500

1800

2200

2700

K

K,M

K

K,M

K

BX

100

39,000

47,000

56,000

82,000

K

CDR04BX104A---

CDR04BX124A---

CDR04BX154A---

CDR04BX184A---

100,000

120,000

150,000

180,000

K,M

K

K,M

K

BX

50

CDR01BX332B---

CDR01BX392A---

CDR01BX472A---

3300

3900

4700

K,M

K

K,M

BX

100

50

AVX Style 1805/CDR02

AVX Style 1825/CDR05

CDR02BP221B---

CDR02BP271B---

CDR02BX392B---

CDR02BX472B---

CDR02BX562B---

220

270

3900

4700

5600

J,K

J

K

K,M

K

BP

BX

100

CDR05BP392B---

CDR05BP472B---

CDR05BP562B---

CDR05BX683B---

CDR05BX823B---

3900

4700

5600

68,000

82,000

J,K

K,M

K

BP

BX

100

CDR02BX682B---

CDR02BX822B---

CDR02BX103B---

CDR02BX123A---

CDR02BX153A---

6800

8200

10,000

12,000

15,000

K,M

K

K,M

K

BX

100

50

CDR05BX104B---

CDR05BX124B---

CDR05BX154B---

CDR05BX224A---

CDR05BX274A---

100,000

120,000

150,000

220,000

270,000

K,M

K

K,M

K

BX

100

50

K,M

50

CDR02BX183A---

CDR02BX223A---

18,000

22,000

K

K,M

BX

50

CDR05BX334A---

330,000

K,M

BX

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

AVX Style 2225/CDR06

CDR06BP682B---

CDR06BP822B---

CDR06BP103B---

CDR06BX394A---

CDR06BX474A---

6800

8200

10,000

390,000

470,000

J,K

K

BP

BX

100

50

K,M

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

110

MIL-PRF-55681/Chips

Part Number Example

CDR31 thru CDR35

MILITARY DESIGNATION PER MIL-PRF-55681

Part Number Example

(example) CDR31 BP 101

B

K

S

M

L

W

D

t

MIL Style

Voltage-temperature

Limits

Capacitance

T

Rated Voltage

Capacitance Tolerance

Termination Finish

Failure Rate

NOTE: Contact factory for availability of Termination and Tolerance Options for

Specific Part Numbers.

MIL Style: CDR31, CDR32, CDR33, CDR34, CDR35

Termination Finish:

Voltage Temperature Limits:

BP = 0 30 ppm/ꢁC without voltage; 0 30 ppm/ꢁC with

rated voltage from -55ꢁC to +125ꢁC

M = Palladium silver

N = Silver-nickel-gold

S = Solder coated final with a minimum of 4 percent lead

T = Silver

U = Base metallization-barrier metal-solder coated

(tin/lead alloy, with a minimum of 4 percent lead)

W = Base metallization-barrier metal-tinned

(tin or tin/lead alloy)

BX = 15ꢀ without voltage; +15 –25ꢀ with rated voltage

from -55ꢁC to +125ꢁC

Capacitance: Two digit figures followed by multiplier

(number of zeros to be added) e.g., 101 = 100 pF

Y = Base metallization-barrier metal-tin (100 percent)

Z = Base metallization-barrier metal-tinned

(tin/lead alloy, with a minimum of 4 percent lead)

Rated Voltage: A = 50V, B = 100V

Capacitance Tolerance: B .10 pF, C .25 pF, D .5

pF, F 1ꢀ, J 5ꢀ, K 10ꢀ,

*See MIL-PRF-55681 Specification for more details

M

20ꢀ

Failure Rate Level: M = 1.0ꢀ, P = .1ꢀ, R = .01ꢀ,

S = .001ꢀ

Packaging: Bulk is standard packaging. Tape and reel

per RS481 is available upon request.

Not RoHS Compliant

CROSS REFERENCE: AVX/MIL-PRF-55681/CDR31 THRU CDR35

Thickness (T)

D

Termination Band (t)

Per MIL-PRF-55681 AVX

Length (L) Width (W)

(Metric Sizes)

Style

(mm)

Max. (mm)

Min. (mm) Max. (mm) Min. (mm)

CDR31

CDR32

CDR33

CDR34

CDR35

0805

1206

1210

1812

1825

2.00

3.20

4.50

1.25

1.60

2.50

3.20

6.40

1.3

1.5

.50

—

.70

.30

111

MIL-PRF-55681/Chips

Military Part Number Identification CDR31

CDR31 to MIL-PRF-55681/7

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF tolerance

Capacitance Capacitance

in pF tolerance

AVX Style 0805/CDR31 (BP)

AVX Style 0805/CDR31 (BP) cont’d

CDR31BP1R0B---

CDR31BP1R1B---

CDR31BP1R2B---

CDR31BP1R3B---

CDR31BP1R5B---

1.0

1.1

1.2

1.3

1.5

B,C

BP

100

CDR31BP101B---

CDR31BP111B---

CDR31BP121B---

CDR31BP131B---

CDR31BP151B---

100

110

120

130

150

F,J,K

BP

100

CDR31BP1R6B---

CDR31BP1R8B---

CDR31BP2R0B---

CDR31BP2R2B---

CDR31BP2R4B---

1.6

1.8

2.0

2.2

2.4

B,C

BP

100

CDR31BP161B---

CDR31BP181B---

CDR31BP201B---

CDR31BP221B---

CDR31BP241B---

160

180

200

220

240

F,J,K

BP

100

CDR31BP2R7B---

CDR31BP3R0B---

CDR31BP3R3B---

CDR31BP3R6B---

CDR31BP3R9B---

2.7

3.0

3.3

3.6

3.9

B,C,D

BP

100

CDR31BP271B---

CDR31BP301B---

CDR31BP331B---

CDR31BP361B---

CDR31BP391B---

270

300

330

360

390

F,J,K

BP

100

CDR31BP4R3B---

CDR31BP4R7B---

CDR31BP5R1B---

CDR31BP5R6B---

CDR31BP6R2B---

4.3

4.7

5.1

5.6

6.2

B,C,D

BP

100

CDR31BP431B---

CDR31BP471B---

CDR31BP511A---

CDR31BP561A---

CDR31BP621A---

430

470

510

560

620

F,J,K

BP

100

50

CDR31BP6R8B---

CDR31BP7R5B---

CDR31BP8R2B---

CDR31BP9R1B---

CDR31BP100B---

6.8

7.5

8.2

9.1

10

B,C,D

F,J,K

BP

100

CDR31BP681A---

680

F,J,K

BP

50

AVX Style 0805/CDR31 (BX)

CDR31BX471B---

CDR31BX561B---

CDR31BX681B---

CDR31BX821B---

CDR31BX102B---

470

560

680

820

1,000

K,M

BX

100

CDR31BP110B---

CDR31BP120B---

CDR31BP130B---

CDR31BP150B---

CDR31BP160B---

11

12

13

15

16

F,J,K

BP

100

CDR31BX122B---

CDR31BX152B---

CDR31BX182B---

CDR31BX222B---

CDR31BX272B---

1,200

1,500

1,800

2,200

2,700

K,M

BX

100

CDR31BP180B---

CDR31BP200B---

CDR31BP220B---

CDR31BP240B---

CDR31BP270B---

18

20

22

24

27

F,J,K

BP

100

CDR31BX332B---

CDR31BX392B---

CDR31BX472B---

CDR31BX562A---

CDR31BX682A---

3,300

3,900

4,700

5,600

6,800

K,M

BX

100

50

CDR31BP300B---

CDR31BP330B---

CDR31BP360B---

CDR31BP390B---

CDR31BP430B---

30

33

36

39

43

F,J,K

BP

100

50

CDR31BX822A---

CDR31BX103A---

CDR31BX123A---

CDR31BX153A---

CDR31BX183A---

8,200

10,000

12,000

15,000

18,000

K,M

BX

50

CDR31BP470B---

CDR31BP510B---

CDR31BP560B---

CDR31BP620B---

CDR31BP680B---

47

51

56

62

68

F,J,K

BP

100

CDR31BP750B---

CDR31BP820B---

CDR31BP910B---

75

82

91

F,J,K

BP

100

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

1/ The complete part number will include additional symbols to indicate capacitance

tolerance, termination and failure rate level.

112

MIL-PRF-55681/Chips

Military Part Number Identification CDR32

CDR32 to MIL-PRF-55681/8

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF tolerance

Capacitance Capacitance

in pF tolerance

AVX Style 1206/CDR32 (BP)

AVX Style 1206/CDR32 (BP) cont’d

CDR32BP1R0B---

CDR32BP1R1B---

CDR32BP1R2B---

CDR32BP1R3B---

CDR32BP1R5B---

1.0

1.1

1.2

1.3

1.5

B,C

BP

100

CDR32BP101B---

CDR32BP111B---

CDR32BP121B---

CDR32BP131B---

CDR32BP151B---

100

110

120

130

150

F,J,K

BP

100

CDR32BP1R6B---

CDR32BP1R8B---

CDR32BP2R0B---

CDR32BP2R2B---

CDR32BP2R4B---

1.6

1.8

2.0

2.2

2.4

B,C

BP

100

CDR32BP161B---

CDR32BP181B---

CDR32BP201B---

CDR32BP221B---

CDR32BP241B---

160

180

200

220

240

F,J,K

BP

100

CDR32BP2R7B---

CDR32BP3R0B---

CDR32BP3R3B---

CDR32BP3R6B---

CDR32BP3R9B---

2.7

3.0

3.3

3.6

3.9

B,C,D

BP

100

CDR32BP271B---

CDR32BP301B---

CDR32BP331B---

CDR32BP361B---

CDR32BP391B---

270

300

330

360

390

F,J,K

BP

100

CDR32BP4R3B---

CDR32BP4R7B---

CDR32BP5R1B---

CDR32BP5R6B---

CDR32BP6R2B---

4.3

4.7

5.1

5.6

6.2

B,C,D

BP

100

CDR32BP431B---

CDR32BP471B---

CDR32BP511B---

CDR32BP561B---

CDR32BP621B---

430

470

510

560

620

F,J,K

BP

100

CDR32BP6R8B---

CDR32BP7R5B---

CDR32BP8R2B---

CDR32BP9R1B---

CDR32BP100B---

6.8

7.5

8.2

9.1

10

B,C,D

F,J,K

BP

100

CDR32BP681B---

CDR32BP751B---

CDR32BP821B---

CDR32BP911B---

CDR32BP102B---

680

750

820

910

1,000

F,J,K

BP

100

CDR32BP110B---

CDR32BP120B---

CDR32BP130B---

CDR32BP150B---

CDR32BP160B---

11

12

13

15

16

F,J,K

BP

100

CDR32BP112A---

CDR32BP122A---

CDR32BP132A---

CDR32BP152A---

CDR32BP162A---

1,100

1,200

1,300

1,500

1,600

F,J,K

BP

50

CDR32BP180B---

CDR32BP200B---

CDR32BP220B---

CDR32BP240B---

CDR32BP270B---

18

20

22

24

27

F,J,K

BP

100

CDR32BP182A---

CDR32BP202A---

CDR32BP222A---

1,800

2,000

2,200

F,J,K

BP

50

AVX Style 1206/CDR32 (BX)

CDR32BP300B---

CDR32BP330B---

CDR32BP360B---

CDR32BP390B---

CDR32BP430B---

30

33

36

39

43

F,J,K

BP

100

CDR32BX472B---

CDR32BX562B---

CDR32BX682B---

CDR32BX822B---

CDR32BX103B---

4,700

5,600

6,800

8,200

10,000

K,M

BX

100

CDR32BP470B---

CDR32BP510B---

CDR32BP560B---

CDR32BP620B---

CDR32BP680B---

47

51

56

62

68

F,J,K

BP

100

CDR32BX123B---

CDR32BX153B---

CDR32BX183A---

CDR32BX223A---

CDR32BX273A---

12,000

15,000

18,000

22,000

27,000

K,M

BX

100

50

CDR32BP750B---

CDR32BP820B---

CDR32BP910B---

75

82

91

F,J,K

BP

100

CDR32BX333A---

CDR32BX393A---

33,000

39,000

K,M

BX

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

1/ The complete part number will include additional symbols to indicate capacitance

tolerance, termination and failure rate level.

113

MIL-PRF-55681/Chips

Military Part Number Identification CDR33/34/35

CDR33/34/35 to MIL-PRF-55681/9/10/11

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF tolerance

Capacitance Capacitance

in pF tolerance

AVX Style 1210/CDR33 (BP)

AVX Style 1812/CDR34 (BX)

CDR33BP102B---

CDR33BP112B---

CDR33BP122B---

CDR33BP132B---

CDR33BP152B---

1,000

1,100

1,200

1,300

1,500

F,J,K

BP

100

CDR34BX273B---

CDR34BX333B---

CDR34BX393B---

CDR34BX473B---

CDR34BX563B---

27,000

33,000

39,000

47,000

56,000

K,M

BX

100

CDR33BP162B---

CDR33BP182B---

CDR33BP202B---

CDR33BP222B---

CDR33BP242A---

1,600

1,800

2,000

2,200

2,400

F,J,K

BP

100

50

CDR34BX104A---

CDR34BX124A---

CDR34BX154A---

CDR34BX184A---

100,000

120,000

150,000

180,000

K,M

BX

50

CDR33BP272A---

CDR33BP302A---

CDR33BP332A---

2,700

3,000

3,300

F,J,K

BP

50

AVX Style 1825/CDR35 (BP)

CDR35BP472B---

CDR35BP512B---

CDR35BP562B---

CDR35BP622B---

CDR35BP682B---

4,700

5,100

5,600

6,200

6,800

F,J,K

BP

100

AVX Style 1210/CDR33 (BX)

CDR33BX153B---

CDR33BX183B---

CDR33BX223B---

CDR33BX273B---

CDR33BX393A---

15,000

18,000

22,000

27,000

39,000

K,M

BX

100

50

CDR35BP752B---

CDR35BP822B---

CDR35BP912B---

CDR35BP103B---

CDR35BP113A---

7,500

8,200

9,100

10,000

11,000

F,J,K

BP

100

50

CDR33BX473A---

CDR33BX563A---

CDR33BX683A---

CDR33BX823A---

CDR33BX104A---

47,000

56,000

68,000

82,000

100,000

K,M

BX

50

CDR35BP123A---

CDR35BP133A---

CDR35BP153A---

CDR35BP163A---

CDR35BP183A---

12,000

13,000

15,000

16,000

18,000

F,J,K

BP

50

AVX Style 1812/CDR34 (BP)

CDR35BP203A---

CDR35BP223A---

20,000

22,000

F,J,K

BP

50

CDR34BP222B---

CDR34BP242B---

CDR34BP272B---

CDR34BP302B---

CDR34BP332B---

2,200

2,400

2,700

3,000

3,300

F,J,K

BP

100

AVX Style 1825/CDR35 (BX)

CDR35BX563B---

CDR35BX683B---

CDR35BX823B---

CDR35BX104B---

CDR35BX124B---

56,000

68,000

82,000

100,000

120,000

K,M

BX

100

CDR34BP362B---

CDR34BP392B---

CDR34BP432B---

CDR34BP472B---

CDR34BP512A---

3,600

3,900

4,300

4,700

5,100

F,J,K

BP

100

50

CDR35BX154B---

CDR35BX184A---

CDR35BX224A---

CDR35BX274A---

CDR35BX334A---

150,000

180,000

220,000

270,000

330,000

K,M

BX

100

50

CDR34BP562A---

CDR34BP622A---

CDR34BP682A---

CDR34BP752A---

CDR34BP822A---

5,600

6,200

6,800

7,500

8,200

F,J,K

BP

50

CDR35BX394A---

CDR35BX474A---

390,000

470,000

K,M

BX

50

CDR34BP912A---

CDR34BP103A---

9,100

10,000

F,J,K

BP

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

1/ The complete part number will include additional symbols to indicate capacitance

tolerance, termination and failure rate level.

114

MQ Series – Medical Grade MLCC

General Specifications

GENERAL DESCRIPTION

AVX offers a wide variety of medically qualified passive components.

Medical devices require the utmost reliability with respect to the

components incorporated into the designs. Advanced design

qualification requirements, in-process controls and requirements and

lot acceptance testing are implemented to ensure these components

will meet the superior reliability levels of a life supporting application.

AVX medical MLCC reliability documents provide an advanced level

of designing, manufacturing, testing and qualification that places AVX

as the top supplier and industry leader of medically qualified MLCCs.

AVX MQ series of medically qualified ceramic capacitors are available

in EIA case sizes ranging from 0402 to 2225, at typical voltage

ratings between 4 – 200 Vdc with various termination options

including Sn, SnPb solder, and Au.

APPLICATIONS

FEATURES

• Implantable cardioverter-defibrillator (ICD)

• Pacemakers

• Neuromodulation

• 0402 to 2225 case sizes

• Voltage range from 4v to 100v

• Capacitance up to 100ꢂF

• Class I & II dielectric materials

• Tight tolerances on Class I dielectric materials

• Various terminations

• Customer specific requirements, screening, & testing

HOW TO ORDER

MQ02

A

100

J

G

T

3

A

Z

Size

Dielectric

Code

Capacitance

Code (In pF)

(2 significant

digits + number

of zeros)

for values <10pF:

letter R denotes

decimal point.

Example:

Capacitance

Tolerance

Medical

Grade

Termination

Finish

Packaging

1 = 7" Reel

2 = 7" Reel

(0402 only)

3 = 13" Reel

4 = 13" Reel

(0402 only)

6 = Waffle

Special

Code

Rated

Voltage

4 = 4V

6 = 6.3V

Z = 10V

Y = 16v

3 = 25V

5 = 50V

1 = 100V

MQ02 = 0402

MQ03 = 0603

MQ05 = 0805

MQ06 = 1206

MQ10 = 1210

MQ12 = 1812

MQ13 = 1825

MQ14 = 2225

A = NP0 (C0G)

C = X7R

B = 0.1pF

C = 0.25pF

D = 0.5pF

F = 1ꢀ (≥10pF)

G = 2ꢀ (≥10pF)

J = 5ꢀ

A = Standard

T = Plated Ni & Sn

J = 60/40 Sn/Pb

B = 5ꢀ min Pb

Plated Solder

7 = Gold Plated

Contact AVX

for others

Z = X7S

D = X5R

K = 10ꢀ

M = 20ꢀ

68pF = 680

N = 30ꢀ

8.2pF = 8R2

050516

115

MQ Series – Medical Grade MLCC

NP0 (C0G) – Capacitance & Voltage Range

PREFERRED SIZES ARE SHADED

SIZE

0402

0603

0805

1206

1210

1812

1825

2225

Soldering

Packaging

Reflow Only

All Paper

Reflow/Wave

All Embossed

Reflow/Wave

All Embossed

Reflow/Wave

All Embossed

Reflow Only

All Embossed

Reflow Only

All Embossed

mm

(in.)

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

4.50 0.30

5.72 0.25

(L) Length

((0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

(0.177 0.012)

(0.225 0.010)

mm

(in.)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

6.40 0.40

(0.252 0.016)

6.35 0.25

(0.250 0.010)

(W) Width

mm

(in.)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.037)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

0.61 0.36

(0.024 0.014)

0.61 0.36

(0.024 0.014)

0.64 0.39

(0.025 0.015)

(t) Terminal

Maximum

Thickness

mm

(in.)

0.56

(0.022)

0.94

(0.014 0.006)

1.52

(0.060)

1.78

(0.070)

1.78

(0.070)

2.79

(0.110)

2.79

(0.110)

2.79

(0.110)

WVDC

0.5

1.0

16

25

50

6.3

16

25

50

100

16

25

50

100

16

25

50

100

25

50

100

25

50

100

50

100

25

50

100

Cap

(pF)

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

12

15

18

22

27

33

39

47

56

68

82

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

10000

WVDC

16

25

50

6.3

16

25

50

100

16

25

50

100

16

25

50

100

25

50

100

25

50

100

50

100

25

50

100

SIZE

0402

0603

0805

1206

1210

1812

1825

2225

050516

116

MQ Series – Medical Grade MLCC

NP0 (C0G) – General Specifications

TYPICAL ELECTRICAL CHARACTERISTICS

Temperature Coefﬁcient

⌬ Capacitance vs. Frequency

Variation of Impedance with Cap Value

Impedance vs. Frequency

0805 - C0G (NP0)

Insulation Resistance vs. Temperature

10 pF vs. 100 pF vs. 1000 pF

Insulation Resistance vs Temperature

10,000

1,000

100

0

40

60

80

100

20

0

Temperature °C

Variation of Impedance with Ceramic Formulation

Impedance vs. Frequency

1000 pF - C0G (NP0) vs. X7R

0805

Variation of Impedance with Chip Size

Impedance vs. Frequency

1000 pF - C0G (NP0)

050516

117

MQ Series – Medical Grade MLCC

NP0 (C0G) – Specifications & Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

NP0 Specification Limits

-55ºC to +125ºC

Within specified tolerance

<30 pF: Q≥ 400+20 x Cap Value

≥30 pF: Q≥ 1000

Measuring Conditions

Temperature Cycle Chamber

Freq.: 1.0 MHz 10ꢀ for cap ≤ 1000 pF

1.0 kHz 10ꢀ for cap > 1000 pF

Voltage: 1.0Vrms .2V

Q

100,000MΩ or 1000MΩ - μF,

whichever is less

Charge device with rated voltage for

120 5 secs @ room temp/humidity

Charge device with 250ꢀ of rated voltage for

1-5 seconds, with charge and discharge

current limited to 50 mA (max)

Deflection: 2mm

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Appearance

Capacitance

Variation

No defects

Test Time: 30 seconds

5ꢀ or .5 pF, whichever is greater

Resistance to

Flexure

Q

Meets Initial Values (As Above)

≥ Initial Value x 0.3

Stresses

Insulation

Resistance

≥ 85ꢀ of each terminal should be covered

with fresh solder

No defects, <25ꢀ leaching of either end terminal

Dip device in eutectic solder at 245 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

≤

2.5ꢀ or .25 pF, whichever is greater

MIL-STD-202 / Method 210 / Condition J

(Reflow Mounting plus 1 Reflow Cycle

@ 235ꢁC 5ꢁC)

Resistance to

Solder Heat

Q

Meets Initial Values (As Above)

Insulation

Resistance

Appearance

Capacitance

Variation

Meets Initial Values (As Above)

No visual defects

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

≤

3.0ꢀ or .0.3 pF, whichever is greater

Thermal

Shock

Q

Meets Initial Values (As Above)

Step 3: +125ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Insulation

Resistance

Dielectric

Repeat for 5 cycles and measure after

24 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Strength

Appearance

Capacitance

Variation

≤

3.0ꢀ or 0.3 pF, whichever is greater

Load in test chamber set at 125ꢁC 2ꢁC

for 1000 hours (+48, -0)

≥ 30 pF:

≥10 pF, <30 pF:

<10 pF:

Q≥ 350

Q≥ 275 +5C/2

Q≥ 200 +10C

with twice rated voltage applied.

Q

Load Life

Remove from test chamber and stabilize at room

temperature before measuring.

Insulation

Resistance

Dielectric

Strength

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

No visual defects

Load in a test chamber set at 85ꢁC 2ꢁC/85ꢀ 5ꢀ

relative humidity for 1000 hours (+48, -0) with rated

voltage applied.

Appearance

Load

Humidity

Insulation

Resistance

≥ Initial Value x 0.3 (See Above)

Remove from chamber and stabilize at room

temperature before measuring.

050516

118

MQ Series – Medical Grade MLCC

X7R/X7S – General Specifications

PREFERRED SIZES ARE SHADED

SIZE

0402

0603

0805

1206

1210

1812 1825

2225

Soldering

Reflow Only

All Paper

Reflow/Wave

All Embossed

Reflow/Wave

All Embossed

Reflow/Wave

All Embossed

Reflow Only

Reflow Only Reflow Only

All Embossed All Embossed

4.50 0.30

(0.177 0.012) (0.177 0.012)

3.20 0.20 6.40 0.40

(0.126 0.008) (0.252 0.016)

0.61 0.36 0.61 0.36

(0.024 0.014) (0.024 0.014)

Reflow Only

Packaging

mm

(L) Length

(in.)

mm

(W) Width

(in.)

mm

(t) Terminal

(in.)

All Embossed

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

4.50 0.30

5.72 0.25

((0.040 0.004)

0.50 0.10

(0.020 0.004)

0.25 0.15

(0.010 0.006)

(0.063 0.006)

0.81 0.15

(0.032 0.006)

0.35 0.15

(0.037)

(0.079 0.008)

1.25 0.20

(0.049 0.008)

0.50 0.25

(0.020 0.010)

(0.126 0.008)

1.60 0.20

(0.063 0.008)

0.50 0.25

(0.020 0.010)

(0.126 0.008)

(0.225 0.010)

2.50 0.20

(0.098 0.008)

0.50 0.25

(0.020 0.010)

6.35 0.25

(0.250 0.010)

0.64 0.39

(0.025 0.015)

Maximum

Thickness

mm

(in.)

0.56

(0.022)

0.94

(0.014 0.006)

1.52

(0.060)

1.78

(0.070)

1.78

(0.070)

2.79

(0.110)

2.79

(0.110)

2.79

(0.110)

WVDC

100

150

10

16

25

50

6.3

10

16

25

50

100

6.3

10

16

25

50

100

6.3

10

16

25

50

100

10

16

25

50

100

50

100

50

100

16

25

50

100

Cap

(pF)

220

330

470

680

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

Cap

(ꢂF)

1.5

2.2

3.3

4.7

10

WVDC

10

16

25

50

6.3

10

16

25

50

100

6.3

10

16

25

50

100

6.3

10

16

25

50

100

10

16

25

50

100

50

100

50

100

16

25

50

100

SIZE

0402

0603

0805

1206

1210

1812 1825

2225

These values are produced with X7S temperature coefficient code

050516

119

MQ Series – Medical Grade MLCC

X7R/X7S – General Specifications

TYPICAL ELECTRICAL CHARACTERISTICS

X7R Dielectric

Typical Temperature Coefﬁcient

⌬ Capacitance vs. Frequency

Variation of Impedance with Cap Value

Impedance vs. Frequency

1,000 pF vs. 10,000 pF - X7R

0805

Insulation Resistance vs. Temperature

Variation of Impedance with Chip Size

Impedance vs. Frequency

100,000 pF - X7R

Variation of Impedance with Chip Size

Impedance vs. Frequency

10,000 pF -X7R

120

050516

MQ Series – Medical Grade MLCC

X7R/X7S – Specifications & Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

NP0 Specification Limits

-55ºC to +125ºC

Measuring Conditions

Temperature Cycle Chamber

Within specified tolerance

≤ 2.5ꢀ for ≥ 50V DC rating

≤ 3.0ꢀ for 25V & 35V DC rating

≤ 12.5ꢀ for 16V DC rating and lower

Contact factory for DF by PN

100,000MΩ or 1000MΩ - μF,

whichever is less

Frequency: 1.0kHz 10ꢀ

Voltage: 1.0Vrms 0.2V

Dissipation Factor

Charge device with rated voltage for

120 5 secs @ room temp/humidity

Charge device with 250ꢀ of rated voltage for

1-5 seconds, with charge and discharge

current limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

No defects

Deflection: 2mm

Test Time: 30 seconds

≤

12ꢀ

Resistance to

Flexure

Meets Initial Values (As Above)

≥ Initial Value x 0.3

Stresses

≥ 85ꢀ of each terminal should be covered

with fresh solder

No defects, <25ꢀ leaching of either end terminal

Dip device in eutectic solder at 245 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

≤

7.5ꢀ

MIL-STD-202 / Method 210 / Condition J

(Reflow Mounting plus 1 Reflow Cycle

@ 235ꢁC 5ꢁC)

Resistance to

Solder Heat

Dissipation

Factor

Meets Initial Values (As Above)

Insulation

Resistance

Appearance

Capacitance

Variation

Meets Initial Values (As Above)

No visual defects

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

≤

7.5ꢀ

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +125ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 hours at room temperature

Meets Initial Values (As Above)

No visual defects

≤

12.5ꢀ

Load in test chamber set at 125ꢁC 2ꢁC

for 1000 hours (+48, -0)

with twice rated voltage applied.

Load Life

≤ initial value x 2.0 (see above)

Insulation

Resistance

Dielectric

Strength

Remove from test chamber and stabilize at room

temperature before measuring.

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

No visual defects

Load in a test chamber set at 85ꢁC 2ꢁC/85ꢀ 5ꢀ

relative humidity for 1000 hours (+48, -0) with rated

voltage applied.

Appearance

Load

Humidity

Insulation

Resistance

≥ Initial Value x 0.3 (See Above)

Remove from chamber and stabilize at room

temperature before measuring.

121

050516

MQ Series – Medical Grade MLCC

X5R – Capacitance & Voltage Range

PREFERRED SIZES ARE SHADED

SIZE

0402

0603

0805

1206

1210

1812

Soldering

Reflow Only

All Paper

Reflow/Wave

All Embossed

Reflow/Wave

All Embossed

Reflow/Wave

All Embossed

Reflow Only

Packaging

mm

(L) Length

(in.)

All Embossed

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

4.50 0.30

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

(0.177 0.012)

mm

(W) Width

(in.)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

mm

(t) Terminal

(in.)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.037)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

0.61 0.36

(0.024 0.014)

Maximum

Thickness

mm

(in.)

0.56

(0.022)

0.94

(0.014 0.006)

1.52

(0.060)

1.78

(0.070)

1.78

(0.070)

2.79

(0.110)

WVDC

0.01

0.015

0.022

0.033

0.047

0.068

0.1

4

6.3

10

16

25

50

4

6.3

10

16

25

50

6.3

10

16

25

50

6.3

10

16

25

50

4

6.3

10

16

25

50

6.3

10

25

50

Cap

(ꢂF)

0.15

0.22

0.33

0.47

0.68

1.0

1.5

2.2

3.3

4.7

10

22

47

100

WVDC

4

6.3

10

16

25

50

4

6.3

10

16

25

50

6.3

10

16

25

50

6.3

10

16

25

50

4

6.3

10

16

25

50

6.3

10

25

50

SIZE

0402

0603

0805

1206

1210

1812

TYPICAL ELECTRICAL CHARACTERISTICS

Temperature Coefﬁcient

Insulation Resistance vs. Temperature

Insulation Resistance vs Temperature

10,000

1,000

100

20

15

10

5

0

-5

-10

-15

-20

0

-60 -40

-20

0

+20 +40 +60 +80

0

20

40

60

80

100

120

Temperature °C

122

050516

MQ Series – Medical Grade MLCC

X5R – Specifications & Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X5R Specification Limits

-55ºC to +85ºC

Measuring Conditions

Temperature Cycle Chamber

Within specified tolerance

≤ 2.5ꢀ for ≥ 50V DC rating

≤ 3.0ꢀ for 25V, 35V DC rating

≤ 12.5ꢀ Max. for 16V DC rating and lower

Contact Factory for DF by PN

10,000MΩ or 500MΩ - μF,

whichever is less

Freq.: 1.0 kHz 10ꢀ

Voltage: 1.0Vrms .2V

For Cap > 10 μF, 0.5Vrms @ 120Hz

Dissipation Factor

Charge device with rated voltage for

120 5 secs @ room temp/humidity

Charge device with 150ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

No defects

Deflection: 2mm

Test Time: 30 seconds

≤

12ꢀ

Resistance to

Flexure

Meets Initial Values (As Above)

≥ Initial Value x 0.3

Stresses

≥ 85ꢀ of each terminal should be covered

with fresh solder

No defects, <25ꢀ leaching of either end terminal

Dip device in eutectic solder at 245 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

≤

7.5ꢀ

MIL-STD-202 / Method 210 / Condition J

(Reflow Mounting plus 1 Reflow Cycle

@ 235ꢁC 5ꢁC)

Dissipation

Factor

Insulation

Resistance

Appearance

Capacitance

Variation

Resistance to

Solder Heat

Meets Initial Values (As Above)

No visual defects

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

≤

7.5ꢀ

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +85ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

≤

12.5ꢀ

Load in test chamber set at 85ꢁC 2ꢁC

for 1000 hours (+48, -0)

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

with twice rated voltage applied.

Load Life

Insulation

Resistance

Dielectric

Strength

Remove from test chamber and stabilize at room

temperature before measuring.

Meets Initial Values (As Above)

No visual defects

Appearance

Load in a test chamber set at 85ꢁC 2ꢁC/85ꢀ 5ꢀ

relative humidity for 1000 hours (+48, -0) with rated

voltage applied.

Load

Humidity

Insulation

Resistance

≥ Initial Value x 0.3 (See Above)

Remove from chamber and stabilize at room

temperature before measuring.

123

050516

MM Series – MLCC for Medical Applications

General Specifications

The AVX MM series is a multi-layer ceramic capacitor designed for

use in medical applications other than implantable/life support.

These components have the design & change control expected for

medical devices and also offer enhanced LAT including reliability

testing and 100ꢀ inspection.

APPLICATIONS

Implantable, Non-Life Supporting Medical Devices

• e.g. implanted temporary cardiac monitor, insulin pumps

External, Life Supporting Medical Devices

• e.g. heart pump external controller

External Devices

• e.g. patient monitoring, diagnostic equipment

HOW TO ORDER

MM02

A

100

J

C

T

2

A

Z

Size

Dielectric

Code

A = NP0 (C0G)

C = X7R

Capacitance

Code (In pF)

(2 significant

digits + number

of zeros)

for values <10pF:

letter R denotes

decimal point.

Example:

Capacitance

Tolerance

Failure Rate

C = Standard

Range

Termination

Finish

T = Plated Ni & Sn

(NP0 only)

Z = Flexiterm

(X7R only)

Packaging

2 = 7" Reel

Special

Code

Rated

MM02 = 0402

Voltage

MM03 = 0603

MM05 = 0805

MM06 = 1206

MM10 = 1210

MM08 = 1808

MM12 = 1812

MM20 = 2220

B = 0.1pF

4 = 13" Reel

A = Standard

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

2 = 200V

V = 250V

7 = 500V

C = 0.25pF

D = 0.5pF

F = 1ꢀ (≥10pF)

G = 2ꢀ (≥10pF)

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

*Contact AVX

for others

*Contact AVX

for others

W

L

᭢

68pF = 680

8.2pF = 8R2

T

᭢

t

COMMERCIAL VS MM SERIES PROCESS COMPARISON

Commercial

MM Series

Standard part numbers; no restriction on

who purchases these parts

Minimum ceramic thickness of 0.020"

on all X7R product

Speciﬁc series part number, used to control

supply of product

Administrative

Design

Minimum ceramic thickness of 0.029" (0.74mm)

Side & end margins = 0.004" min

Cover layers = 0.003" min

Dicing

Side & end margins = 0.003" min

Lot Qualiﬁcation

Destructive Physical

Analysis (DPA)

As per EIA RS469

Increased sample plan – stricter criteria

Visual/Cosmetic Quality

Standard process and inspection

100% inspection

Increased sampling for accelerated

wave solder on X7R and NP0 followed

by lot by lot reliability testing

Standard sampling for accelerated wave

solder on X7R dielectrics

Application Robustness

AVX will qualify and notify customers before

making any change to the following materials

or processes:

• Dielectric formulation, type, or supplier

• Metal formulation, type, or supplier

• Termination material formulation, type, or supplier

• Manufacturing equipment type

• Quality testing regime including sample size and

accept/ reject criteria

Required to inform customer of changes in:

• form

• ﬁt

Design/Change Control

• function

124

113016

MM Series – MLCC for Medical Applications

NP0 (C0G) – Specifications & Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

NP0 Specification Limits

-55ºC to +125ºC

Within specified tolerance

<30 pF: Q≥ 400+20 x Cap Value

≥30 pF: Q≥ 1000

Measuring Conditions

Temperature Cycle Chamber

Freq.: 1.0 MHz 10ꢀ for cap ≤ 1000 pF

1.0 kHz 10ꢀ for cap > 1000 pF

Voltage: 1.0Vrms .2V

Q

100,000MΩ or 1000MΩ - μF,

whichever is less

Charge device with rated voltage for

60 5 secs @ room temp/humidity

Charge device with 300ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Note: Charge device with 150ꢀ of rated

voltage for 500V devices.

Appearance

Capacitance

Variation

No defects

Deflection: 2mm

Test Time: 30 seconds

5ꢀ or .5 pF, whichever is greater

Resistance to

Flexure

Q

Meets Initial Values (As Above)

≥ Initial Value x 0.3

Stresses

Insulation

Resistance

≥ 95ꢀ of each terminal should be covered

with fresh solder

No defects, <25ꢀ leaching of either end terminal

Dip device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

≤

2.5ꢀ or .25 pF, whichever is greater

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24

hours before measuring electrical properties.

2

Resistance to

Solder Heat

Q

Meets Initial Values (As Above)

Insulation

Resistance

Dielectric

Meets Initial Values (As Above)

No visual defects

Strength

Appearance

Capacitance

Variation

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

2.5ꢀ or .25 pF, whichever is greater

Thermal

Shock

Q

Meets Initial Values (As Above)

Step 3: +125ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Insulation

Resistance

Dielectric

Repeat for 5 cycles and measure after

24 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Strength

Appearance

Capacitance

Variation

3.0ꢀ or .3 pF, whichever is greater

Charge device with twice rated voltage in

test chamber set at 125ºC 2ºC

for 1000 hours (+48, -0).

≥ 30 pF:

≥10 pF, <30 pF:

<10 pF:

Q≥ 350

Q≥ 275 +5C/2

Q≥ 200 +10C

Q

Load Life

(C=Nominal Cap)

Insulation

Resistance

Dielectric

Remove from test chamber and stabilize at

room temperature for 24 hours

before measuring.

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

No visual defects

Strength

Appearance

Capacitance

Variation

≤

5.0ꢀ or .5 pF, whichever is greater

Store in a test chamber set at 85ºC 2ºC/

85ꢀ 5ꢀ relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≥ 30 pF:

≥10 pF, <30 pF:

<10 pF:

Q≥ 350

Q≥ 275 +5C/2

Q≥ 200 +10C

Load

Q

Humidity

Insulation

Resistance

Dielectric

Strength

Remove from chamber and stabilize at

room temperature for 24 2 hours

before measuring.

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

125

113016

MM Series – MLCC for Medical Applications

NP0/C0G Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0603

0805

1206

WVDC

16

25

50

100

16

25

50

100

16

25

50

100

Cap 0.5

(pF) 1.0

1.2

0R5

1R0

1R2

1R5

1R8

2R2

2R7

3R3

3R9

4R7

5R6

6R8

8R2

100

120

150

180

220

270

330

390

470

560

680

820

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

12

15

18

22

27

33

39

47

56

68

82

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

WVDC

16

25

50

100

16

25

50

100

16

25

50

100

SIZE

0603

0805

1206

126

113016

MM Series – MLCC for Medical Applications

X7R Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X7R Specification Limits

-55ºC to +125ºC

Measuring Conditions

Temperature Cycle Chamber

Within specified tolerance

≤ 10ꢀ for ≥ 50V DC rating

≤ 12.5ꢀ for 25V DC rating

≤ 12.5ꢀ for 25V and 16V DC rating

≤ 12.5ꢀ for ≤ 10V DC rating

100,000MΩ or 1000MΩ - μF,

whichever is less

Freq.: 1.0 kHz 10ꢀ

Voltage: 1.0Vrms .2V

Dissipation Factor

Charge device with rated voltage for

120 5 secs @ room temp/humidity

Charge device with 300ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Note: Charge device with 150ꢀ of rated

voltage for 500V devices.

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

No defects

Deflection: 2mm

Test Time: 30 seconds

≤

12ꢀ

Resistance to

Flexure

Meets Initial Values (As Above)

≥ Initial Value x 0.3

Stresses

≥ 95ꢀ of each terminal should be covered

with fresh solder

No defects, <25ꢀ leaching of either end terminal

Dip device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

≤

7.5ꢀ

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24

hours before measuring electrical properties.

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

2

Resistance to

Solder Heat

Meets Initial Values (As Above)

No visual defects

Appearance

Capacitance

Variation

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

≤

7.5ꢀ

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +125ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Charge device with 1.5 rated voltage (≤ 10V) in

test chamber set at 125ºC 2ºC

for 1000 hours (+48, -0)

≤

12.5ꢀ

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC 2ºC/

85ꢀ 5ꢀ relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤

12.5ꢀ

Load

Humidity

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 2 hours before measuring.

127

113016

MM Series – MLCC for Medical Applications

X7R Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0402

0603

0805

1206

1210

1808

1812

2220

WVDC 16 25 50 10 16 25 50 100 200 10 16 25 50 100 200 250 10 16 25 50 100 200 250 500 10 16 25 50 100 200 250 500 50 100 200 50 100 200 250 25 50 100

Cap 220

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

224

334

474

564

684

824

105

125

155

pf

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

cap 0.010

uf

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.056

0.068

0.082

0.10

0.12

0.15

0.22

0.33

0.47

0.56

0.68

0.82

1.0

1.2

1.5

WVDC 16 25 50 10 16 25 50 100 200 10 16 25 50 100 200 250 10 16 25 50 100 200 250 500 10 16 25 50 100 200 250 500 50 100 200 50 100 200 250 25 50 100

SIZE

0402

0603

0805

1206

1210

1808

1812

2220

128

110116

Packaging of Chip Components

Automatic Insertion Packaging

TAPE & REEL QUANTITIES

All tape and reel specifications are in compliance with RS481.

4mm

0101

4,000

8mm

12mm

1808

Paper or Embossed Carrier

Embossed Only

0612, 0508, 0805, 1206,

1210

1812, 1825

2220, 2225

Paper Only

0101, 0201, 0306, 0402, 0603

Qty. per Reel/7" Reel

1,000, 2,000, 3,000 or 4,000, 10,000, 15,000, 20,000

Contact factory for exact quantity

3,000

500, 1,000

Contact factory for exact quantity

Qty. per Reel/13" Reel

5,000, 10,000, 50,000

Contact factory for exact quantity

10,000

4,000

REEL DIMENSIONS

Tape

A

Max.

B*

Min.

D*

Min.

N

Min.

W₂

Max.

C

W₁

W₃

(1)

Size

1.80

1.5

13.0 0.5

20.2

60.0

4.35 0.3

7.95

4mm

8mm

(7.087)

(0.059)

(0.522 0.020)

(0.795)

(2.362)

(0.171 0.011)

(0.312)

7.90 Min.

14.4

(0.567)

8.40 -⁺0¹.^.0⁵

(0.311)

10.9 Max.

(0.429)

(0.331 -⁺0⁰.^.0⁰⁵⁹

)

13.0 ⁺^-0⁰^.^.²⁵⁰⁰

330

(12.992)

1.5

(0.059)

20.2

(0.795)

50.0

(1.969)

(0.512⁺-0⁰.^.0⁰0²8⁰

)

11.9 Min.

(0.469)

15.4 Max.

(0.607)

12.4 -⁺0².^.0⁰

18.4

(0.724)

12mm

(0.488 -⁺0⁰.^.0⁰⁷⁹

Metric dimensions will govern.

English measurements rounded and for reference only.

(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.

129

REV 01

Embossed Carrier Configuration

4, 8 & 12mm Tape Only

Chip Orientation

4, 8 & 12mm Embossed Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size

D0

E1

P0

2.0 0.04

P2

S1 Min.

1.075

(0.042)

0.60

T Max.

0.26

(0.010)

0.60

T1 Max.

0.80 0.04

0.90 0.05

1.00 0.02

0.06

(0.002)

0.10

4mm

(0.031 0.001) (0.035 0.001) (0.078 0.001) (0.039 0.0007)

1.50 -⁺0⁰.^.0¹⁰

8mm

& 12mm

1.75 0.10

4.0 0.10

2.0 0.05

(0.059 -⁺0⁰.^.0⁰⁰⁴

)

(0.069 0.004) (0.157 0.004) (0.079 0.002)

(0.024)

(0.004)

VARIABLE DIMENSIONS

Tape Size

B₁

Max.

D₁

Min.

E₂

Min.

F

P₁

R

T₂

W

Max.

A₀B₀K₀

Min.

See Note 5 See Note 2

4.35

1.00

6.25

3.50 0.05

4.00 0.10

25.0

2.50 Max.

(0.098)

8.30

8mm

See Note 1

(0.171)

(0.039)

(0.246) (0.138 0.002) (0.157 0.004)

(0.984)

(0.327)

8.20

(0.323)

1.50

(0.059)

10.25

5.50 0.05

4.00 0.10

30.0

(1.181)

6.50 Max.

(0.256)

12.3

(0.484)

12mm

(0.404) (0.217 0.002) (0.157 0.004)

8mm

1/2 Pitch

4.35

(0.171)

1.00

(0.039)

6.25

3.50 0.05

2.00 0.10

25.0

(0.984)

2.50 Max.

(0.098)

8.30

(0.327)

(0.246) (0.138 0.002) (0.079 0.004)

12mm

Double

Pitch

8.20

(0.323)

1.50

(0.059)

10.25

5.50 0.05

8.00 0.10

30.0

(1.181)

6.50 Max.

(0.256)

12.3

(0.484)

(0.404) (0.217 0.002) (0.315 0.004)

NOTES:

2. Tape with or without components shall pass around radius “R” without damage.

1. The cavity defined by A₀, B₀, and K₀shall be configured to provide the following:

Surround the component with sufficient clearance such that:

3. Bar code labeling (if required) shall be on the side of the reel opposite the round sprocket holes.

Refer to EIA-556.

a) the component does not protrude beyond the sealing plane of the cover tape.

b) the component can be removed from the cavity in a vertical direction without mechanical

restriction, after the cover tape has been removed.

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. If P₁= 2.0mm, the tape may not properly index in all tape feeders.

c) rotation of the component is limited to 20º maximum (see Sketches D & E).

d) lateral movement of the component is restricted to 0.5mm maximum (see Sketch F).

REV 01

130

Paper Carrier Configuration

8 & 12mm Tape Only

8 & 12mm Paper Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size

D₀

E

P₀

P₂

T₁

G. Min.

R Min.

1.50 -⁺0⁰.^.0¹⁰

8mm

and

12mm

1.75 0.10

4.00 0.10

2.00 0.05

0.10

(0.004)

Max.

0.75

(0.030)

Min.

25.0 (0.984)

See Note 2

Min.

(0.059 -⁺0⁰.^.0⁰⁰⁴

)

(0.069 0.004) (0.157 0.004) (0.079 0.002)

VARIABLE DIMENSIONS

P¹

Tape Size

E₂Min.

F

W

A₀B₀

See Note 1

T

See Note 4

8.00 -⁺0⁰.^.1³0⁰

8mm

4.00 0.10

(0.157 0.004)

6.25

(0.246)

3.50 0.05

(0.138 0.002)

(0.315 ⁺-0⁰.^.0⁰0¹4²

)

1.10mm

(0.043) Max.

for Paper Base

Tape and

4.00 0.10

(0.157 0.004)

10.25

(0.404)

5.50 0.05

(0.217 0.002) (0.472 0.012)

12.0 0.30

12mm

1.60mm

(0.063) Max.

for Non-Paper

Base Compositions

8.00 -⁺0⁰.^.1³0⁰

8mm

1/2 Pitch

2.00 0.05

(0.079 0.002)

6.25

(0.246)

3.50 0.05

(0.138 0.002)

(0.315 ⁺-0⁰.^.0⁰0¹4²

)

12mm

Double

Pitch

8.00 0.10

(0.315 0.004)

10.25

(0.404)

5.50 0.05

12.0 0.30

(0.217 0.002) (0.472 0.012)

NOTES:

2. Tape with or without components shall pass around radius “R” without damage.

1. The cavity defined by A₀, B₀, and T shall be configured to provide sufficient clearance

surrounding the component so that:

3. Bar code labeling (if required) shall be on the side of the reel opposite the sprocket

holes. Refer to EIA-556.

a) the component does not protrude beyond either surface of the carrier tape;

b) the component can be removed from the cavity in a vertical direction without

mechanical restriction after the top cover tape has been removed;

c) rotation of the component is limited to 20º maximum (see Sketches A & B);

d) lateral movement of the component is restricted to 0.5mm maximum

(see Sketch C).

4. If P₁= 2.0mm, the tape may not properly index in all tape feeders.

Bar Code Labeling Standard

AVX bar code labeling is available and follows latest version of EIA-556

REV 01

131

Basic Capacitor Formulas

I. Capacitance (farads)

XI. Equivalent Series Resistance (ohms)

.224 K A

E.S.R. = (D.F.) (Xc) = (D.F.) / (2 π fC)

English: C =

T_D

XII. Power Loss (watts)

.0884 K A

Power Loss = (2 π fCV²) (D.F.)

Metric: C =

T_D

XIII. KVA (Kilowatts)

II. Energy stored in capacitors (Joules, watt - sec)

KVA = 2 π fCV²x 10^-3

1

E = ⁄

2

CV²

XIV. Temperature Characteristic (ppm/°C)

III. Linear charge of a capacitor (Amperes)

Ct – C₂₅

C₂₅(T_t– 25)

T.C. =

x 10⁶

dV

dt

I = C

XV. Cap Drift (%)

C₁– C₂

IV. Total Impedance of a capacitor (ohms)

Z = R²_S+ (X - X )²

C.D. =

x 100

C

L

C₁

V. Capacitive Reactance (ohms)

XVI. Reliability of Ceramic Capacitors

1

x =

c

L₀

V_t

X

T_t

Y

2 π fC

=

( ) (_T)

L_t

V_o

VI. Inductive Reactance (ohms)

o

x_L= 2 π fL

XVII. Capacitors in Series (current the same)

VII. Phase Angles:

Any Number:

1

---

Ideal Capacitors: Current leads voltage 90°

Ideal Inductors: Current lags voltage 90°

Ideal Resistors: Current in phase with voltage

=

+

C

C₁

C₂

C

T

N

C₁C₂

VIII. Dissipation Factor (%)

Two: C =

T

C₁+ C₂

E.S.R.

D.F.= tan (loss angle) =

= (2 πfC) (E.S.R.)

XVIII. Capacitors in Parallel (voltage the same)

X

c

C = C₁+ C₂--- + C

T

N

IX. Power Factor (%)

XIX. Aging Rate

P.F. = Sine (loss angle) = Cos (phase angle)

P.F. = (when less than 10%) = DF

f

^{A.R. = %}D ^{C/decade of time}

XX. Decibels

db = 20 log

X. Quality Factor (dimensionless)

V₁

V₂

1

Q = Cotan (loss angle) =

D.F.

METRIC PREFIXES SYMBOLS

Pico

Nano

Micro

Milli

Deci

Deca

Kilo

Mega

Giga

Tera

X 10^-12

X 10^-9

X 10^-6

X 10^-3

X 10^-1

X 10⁺¹

X 10⁺³

X 10⁺⁶

X 10⁺⁹

X 10⁺¹²

K

A

= Dielectric Constant

= Area

f

= frequency

= Inductance

= Loss angle

= Phase angle

L_t

= Test life

L

␦

V_t

V_o

T_t

= Test voltage

T_D= Dielectric thickness

= Operating voltage

= Test temperature

= Operating temperature

V

t

= Voltage

f

= time

X & Y = exponent effect of voltage and temp.

T_o

R

= Series Resistance

L_o

= Operating life

s

132

General Description

Basic Construction – A multilayer ceramic (MLC)

capacitor is a monolithic block of ceramic containing two

sets of offset, interleaved planar electrodes that extend to

two opposite surfaces of the ceramic dielectric. This simple

structure requires a considerable amount of sophistication,

both in material and manufacture, to produce it in the quality

and quantities needed in today’s electronic equipment.

Electrode

Ceramic Layer

End Terminations

Terminated

Edge

Terminated

Edge

Margin

Electrodes

Multilayer Ceramic Capacitor

Figure 1

Formulations – Multilayer ceramic capacitors are available

in both Class 1 and Class 2 formulations. Temperature

compensating formulation are Class 1 and temperature

stable and general application formulations are classified

as Class 2.

Class 2 – EIA Class 2 capacitors typically are based on the

chemistry of barium titanate and provide a wide range of

capacitance values and temperature stability. The most

commonly used Class 2 dielectrics are X7R and Y5V. The

X7R provides intermediate capacitance values which vary

only 15ꢀ over the temperature range of -55°C to 125°C. It

finds applications where stability over a wide temperature

range is required.

Class 1 – Class 1 capacitors or temperature compensating

capacitors are usually made from mixtures of titanates

where barium titanate is normally not a major part of the

mix. They have predictable temperature coefficients and

in general, do not have an aging characteristic. Thus they

are the most stable capacitor available. The most popular

Class 1 multilayer ceramic capacitors are C0G (NP0)

temperature compensating capacitors (negative-positive

0 ppm/°C).

The Y5V provides the highest capacitance values and is

used in applications where limited temperature changes are

expected. The capacitance value for Y5V can vary from

22ꢀ to -82ꢀ over the -30°C to 85°C temperature range.

All Class 2 capacitors vary in capacitance value under the

influence of temperature, operating voltage (both AC and

DC), and frequency. For additional information on

performance changes with operating conditions, consult

AVX’s software, SpiCap.

133

General Description

Effects of Voltage – Variations in voltage have little effect

on Class 1 dielectric but does affect the capacitance and

dissipation factor of Class 2 dielectrics. The application of DC

voltage reduces both the capacitance and dissipation factor

while the application of an AC voltage within a reasonable

range tends to increase both capacitance and dissipation

|factor readings. If a high enough AC voltage is applied,

eventually it will reduce capacitance just as a DC voltage will.

Figure 2 shows the effects of AC voltage.

Table 1: EIA and MIL Temperature Stable and General

Application Codes

EIA CODE

Percent Capacity Change Over Temperature Range

RS198

Temperature Range

X7

X6

X5

Y5

Z5

-55°C to +125°C

-55°C to +105°C

-55°C to +85°C

-30°C to +85°C

+10°C to +85°C

Cap. Change vs. A.C. Volts

X7R

Code

Percent Capacity Change

D

E

F

P

R

S

T

3ꢀ3ꢁ

4ꢀ7ꢁ

7ꢀ5ꢁ

10ꢁ

15ꢁ

22ꢁ

+22ꢁ, -33ꢁ

+22ꢁ, - 56ꢁ

+22ꢁ, -82ꢁ

U

V

EXAMPLE – A capacitor is desired with the capacitance value at 25°C to

increase no more than 7ꢀ5ꢁ or decrease no more than 7ꢀ5ꢁ from

-30°C to +85°Cꢀ EIA Code will be Y5Fꢀ

Figure 2

Capacitor specifications specify the AC voltage at which to

measure (normally 0.5 or 1 VAC) and application of the wrong

voltage can cause spurious readings. Figure 3 gives the volt-

age coefficient of dissipation factor for various AC voltages at

1 kilohertz. Applications of different frequencies will affect the

percentage changes versus voltages.

MIL CODE

Symbol

Temperature Range

A

B

C

-55°C to +85°C

-55°C to +125°C

-55°C to +150°C

D.F. vs. A.C. Measurement Volts

X7R

Cap. Change

Zero Volts

Cap. Change

Rated Volts

Symbol

R

S

W

X

Y

Z

+15ꢁ, -15ꢁ

+22ꢁ, -22ꢁ

+22ꢁ, -56ꢁ

+15ꢁ, -15ꢁ

+30ꢁ, -70ꢁ

+20ꢁ, -20ꢁ

+15ꢁ, -40ꢁ

+22ꢁ, -56ꢁ

+22ꢁ, -66ꢁ

+15ꢁ, -25ꢁ

+30ꢁ, -80ꢁ

+20ꢁ, -30ꢁ

Temperature characteristic is specified by combining range and change

symbols, for example BR or AWꢀ Specification slash sheets indicate the

characteristic applicable to a given style of capacitorꢀ

In specifying capacitance change with temperature for Class

2 materials, EIA expresses the capacitance change over an

operating temperature range by a 3 symbol code. The first

symbol represents the cold temperature end of the tempera-

ture range, the second represents the upper limit of the

operating temperature range and the third symbol represents

the capacitance change allowed over the operating temper-

ature range. Table 1 provides a detailed explanation of the EIA

system.

Figure 3

Typical effect of the application of DC voltage is shown in

Figure 4. The voltage coefficient is more pronounced for

higher K dielectrics. These figures are shown for room tem-

perature conditions. The combination characteristic known as

voltage temperature limits which shows the effects of rated

voltage over the operating temperature range is shown in

Figure 5 for the military BX characteristic.

134

General Description

capacitors and is why re-reading of capacitance after 12 or

24 hours is allowed in military specifications after dielectric

strength tests have been performed.

Typical Cap. Change vs. D.C. Volts

X7R

5

0

Typical Curve of Aging Rate

X7R

+1.5

0

-5

-10

-15

-20

-1.5

25%

50%

75%

100%

-3.0

-4.5

Percent Rated Volts

Figure 4

Typical Cap. Change vs. Temperature

X7R

-6.0

-7.5

1

10

100 1000 10,000 100,000

Hours

Characteristic Max. Aging Rate %/Decade

None

2

7

C0G (NP0)

X7R, X5R

Y5V

Figure 6

Effects of Frequency – Frequency affects capacitance

and impedance characteristics of capacitors. This effect is

much more pronounced in high dielectric constant ceramic

formulation than in low K formulations. AVX’s SpiCap

software generates impedance, ESR, series inductance,

series resonant frequency and capacitance all as functions

of frequency, temperature and DC bias for standard chip

sizes and styles. It is available free from AVX and can be

downloaded for free from AVX website: www.avx.com.

Figure 5

Effects of Time – Class 2 ceramic capacitors change

capacitance and dissipation factor with time as well as

temperature, voltage and frequency. This change with time is

known as aging. Aging is caused by a gradual re-alignment

of the crystalline structure of the ceramic and produces an

exponential loss in capacitance and decrease in dissipation

factor versus time. A typical curve of aging rate for

semistable ceramics is shown in Figure 6.

If a Class 2 ceramic capacitor that has been sitting on the

shelf for a period of time, is heated above its curie point,

1

(125°C for 4 hours or 150°C for ⁄

2

hour will suffice) the part will

de-age and return to its initial capacitance and dissi-pation

factor readings. Because the capacitance changes

rapidly, immediately after de-aging, the basic capacitance

measurements are normally referred to a time period

sometime after the de-aging process. Various manufacturers

use different time bases but the most popular one is one day

or twenty-four hours after “last heat.” Change in the aging

curve can be caused by the application of voltage and

other stresses. The possible changes in capacitance due to

de-aging by heating the unit explain why capacitance changes

are allowed after test, such as temperature cycling, moisture

resistance, etc., in MIL specs. The application of high voltages

such as dielectric withstanding voltages also tends to de-age

135

General Description

Effects of Mechanical Stress – High “K” dielectric ceramic

capacitors exhibit some low level piezoelectric reactions

under mechanical stress. As a general statement, the piezo-

electric output is higher, the higher the dielectric constant of

the ceramic. It is desirable to investigate this effect before

using high “K” dielectrics as coupling capacitors in extremely

low level applications.

Energy Stored – The energy which can be stored in a

capacitor is given by the formula:

E = ¹⁄ CV²

2

E = energy in joules (watts-sec)

V = applied voltage

C = capacitance in farads

Reliability – Historically ceramic capacitors have been one

of the most reliable types of capacitors in use today.

The approximate formula for the reliability of a ceramic

capacitor is:

Potential Change – A capacitor is a reactive component

which reacts against a change in potential across it. This is

shown by the equation for the linear charge of a capacitor:

L_o

L_t

V_t

X

T_t

T_o

Y

=

͑ ͑

V_o

dV

dt

I_ideal

=

C

where

L_o= operating life

L_t= test life

V_t= test voltage

T_t= test temperature and

T_o= operating temperature

in °C

where

I = Current

C = Capacitance

V_o= operating voltage

X,Y = see text

dV/dt = Slope of voltage transition across capacitor

Thus an infinite current would be required to instantly change

the potential across a capacitor. The amount of current a

capacitor can “sink” is determined by the above equation.

Historically for ceramic capacitors exponent X has been

considered as 3. The exponent Y for temperature effects

typically tends to run about 8.

Equivalent Circuit – A capacitor, as a practical device,

exhibits not only capacitance but also resistance and

inductance. A simplified schematic for the equivalent circuit

is:

A capacitor is a component which is capable of storing

electrical energy. It consists of two conductive plates (elec-

trodes) separated by insulating material which is called the

dielectric. A typical formula for determining capacitance is:

C = Capacitance

R_s= Series Resistance

L = Inductance

R_p= Parallel Resistance

.224 KA

C =

t

C = capacitance (picofarads)

K = dielectric constant (Vacuum = 1)

A = area in square inches

t = separation between the plates in inches

(thickness of dielectric)

.224 = conversion constant

Reactance – Since the insulation resistance (R_p) is nor-

mally very high, the total impedance of a capacitor is:

(.0884 for metric system in cm)

Capacitance – The standard unit of capacitance is the

farad. A capacitor has a capacitance of 1 farad when 1

coulomb charges it to 1 volt. One farad is a very large unit

and most capacitors have values in the micro (10^-6), nano

(10^-9) or pico (10^-12) farad level.

Z = R²+ (X_C- X_L)²

S

ͱ

where

Z = Total Impedance

R = Series Resistance

X_C^s= Capacitive Reactance =

1

Dielectric Constant – In the formula for capacitance given

above the dielectric constant of a vacuum is arbitrarily chosen

as the number 1. Dielectric constants of other materials are

then compared to the dielectric constant of a vacuum.

2 π fC

X_L= Inductive Reactance = 2 π fL

The variation of a capacitor’s impedance with frequency

determines its effectiveness in many applications.

Dielectric Thickness – Capacitance is indirectly proportional

to the separation between electrodes. Lower voltage require-

ments mean thinner dielectrics and greater capacitance per

volume.

Phase Angle – Power Factor and Dissipation Factor are

often confused since they are both measures of the loss in

a capacitor under AC application and are often almost

identical in value. In a “perfect” capacitor the current in the

capacitor will lead the voltage by 90°.

Area – Capacitance is directly proportional to the area of the

electrodes. Since the other variables in the equation are

usually set by the performance desired, area is the easiest

parameter to modify to obtain a specific capacitance within

a material group.

136

General Description

di

dt

The

seen in current microprocessors can be as high as

0.3 A/ns, and up to 10A/ns. At 0.3 A/ns, 100pH of parasitic

inductance can cause a voltage spike of 30mV. While this

does not sound very drastic, with the Vcc for

microprocessors decreasing at the current rate, this can be

a fairly large percentage.

Another important, often overlooked, reason for knowing

the parasitic inductance is the calculation of the resonant

frequency. This can be important for high frequency, by-

pass capacitors, as the resonant point will give the most

signal attenuation. The resonant frequency is calculated

from the simple equation:

In practice the current leads the voltage by some other phase

angle due to the series resistance R_S. The complement of this

angle is called the loss angle and:

f^res=

1

ͱ

2␲ LC

Insulation Resistance – Insulation Resistance is the

resistance measured across the terminals of a capacitor

and consists principally of the parallel resistance R^Pshown

in the equivalent circuit. As capacitance values and hence

the area of dielectric increases, the I.R. decreases and

hence the product (C x IR or RC) is often specified in ohm

farads or more commonly megohm-microfarads. Leakage

current is determined by dividing the rated voltage by IR

(Ohm’s Law).

Power Factor (P.F.) = Cos or Sine ␦

f

Dissipation Factor (D.F.) = tan ␦

for small values of ␦ the tan and sine are essentially equal

which has led to the common interchangeability of the two

terms in the industry.

Equivalent Series Resistance – The term E.S.R. or

Equivalent Series Resistance combines all losses both

series and parallel in a capacitor at a given frequency so

that the equivalent circuit is reduced to a simple R-C series

connection.

Dielectric Strength – Dielectric Strength is an expression

of the ability of a material to withstand an electrical stress.

Although dielectric strength is ordinarily expressed in volts, it

is actually dependent on the thickness of the dielectric and

thus is also more generically a function of volts/mil.

Dielectric Absorption – A capacitor does not discharge

instantaneously upon application of a short circuit, but

drains gradually after the capacitance proper has been

discharged. It is common practice to measure the dielectric

absorption by determining the “reappearing voltage” which

appears across a capacitor at some point in time after it has

been fully discharged under short circuit conditions.

Dissipation Factor – The DF/PF of a capacitor tells what

percent of the apparent power input will turn to heat in the

capacitor.

Corona – Corona is the ionization of air or other vapors

which causes them to conduct current. It is especially

prevalent in high voltage units but can occur with low voltages

as well where high voltage gradients occur. The energy

discharged degrades the performance of the capacitor and

can in time cause catastrophic failures.

E.S.R.

X_C

Dissipation Factor =

= (2 π fC) (E.S.R.)

The watts loss are:

Watts loss = (2 π fCV²) (D.F.)

Very low values of dissipation factor are expressed as their

reciprocal for convenience. These are called the “Q” or

Quality factor of capacitors.

Parasitic Inductance – The parasitic inductance of

capacitors is becoming more and more important in the

decoupling of today’s high speed digital systems. The

relationship between the inductance and the ripple voltage

induced on the DC voltage line can be seen from the simple

inductance equation:

di

dt

V = L

137

Surface Mounting Guide

MLC Chip Capacitors

REFLOW SOLDERING

Case Size

0201

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

D1

D2

D3

D4

D5

0.85 (0.033)

1.70 (0.067)

2.30 (0.091)

3.00 (0.118)

4.00 (0.157)

5.60 (0.220)

6.60 (0.260)

0.30 (0.012)

0.60 (0.024)

0.80 (0.031)

1.00 (0.039)

0.25 (0.010)

0.50 (0.020)

0.70 (0.028)

1.00 (0.039)

2.00 (0.079)

3.60 (0.142)

4.60 (0.181)

0.30 (0.012)

0.60 (0.024)

0.80 (0.031)

1.00 (0.039)

0.35 (0.014)

0.50 (0.020)

0.75 (0.030)

1.25 (0.049)

1.60 (0.063)

2.50 (0.098)

2.00 (0.079)

3.00 (0.118)

6.35 (0.250)

5.00 (0.197)

6.35 (0.250)

Dimensions in millimeters (inches)

Component Pad Design

Component pads should be designed to achieve good

solder filets and minimize component movement during

reflow soldering. Pad designs are given below for the most

common sizes of multilayer ceramic capacitors for both

wave and reflow soldering. The basis of these designs is:

• Pad width equal to component width. It is permissible to

decrease this to as low as 85ꢀ of component width but it

is not advisable to go below this.

• Pad overlap 0.5mm beneath component.

• Pad extension 0.5mm beyond components for reflow and

1.0mm for wave soldering.

WAVE SOLDERING

Case Size

0603

D1

D2

D3

D4

D5

3.10 (0.12)

4.00 (0.15)

5.00 (0.19)

1.20 (0.05)

1.50 (0.06)

0.70 (0.03)

1.00 (0.04)

2.00 (0.09)

1.20 (0.05)

1.50 (0.06)

0.75 (0.03)

1.25 (0.05)

1.60 (0.06)

0805

1206

Dimensions in millimeters (inches)

Component Spacing

Preheat & Soldering

For wave soldering components, must be spaced sufficiently

far apart to avoid bridging or shadowing (inability of solder

to penetrate properly into small spaces). This is less

important for reflow soldering but sufficient space must be

allowed to enable rework should it be required.

The rate of preheat should not exceed 4°C/second to

prevent thermal shock. A better maximum figure is about

2°C/second.

For capacitors size 1206 and below, with a maximum

thickness of 1.25mm, it is generally permissible to allow a

temperature differential from preheat to soldering of 150°C.

In all other cases this differential should not exceed 100°C.

For further specific application or process advice, please

consult AVX.

Cleaning

Care should be taken to ensure that the capacitors are

thoroughly cleaned of flux residues especially the space

beneath the capacitor. Such residues may otherwise

become conductive and effectively offer a low resistance

bypass to the capacitor.

Ultrasonic cleaning is permissible, the recommended

conditions being 8 Watts/litre at 20-45 kHz, with a process

cycle of 2 minutes vapor rinse, 2 minutes immersion in the

ultrasonic solvent bath and finally 2 minutes vapor rinse.

138

Surface Mounting Guide

Recommended Soldering Profiles

Recommended Reflow Profiles

Pb Free Recommended

REFLOW SOLDER PROFILES

AVX RoHS compliant products utilize termination

finishes (e.g.Sn or SnAg) that are compatible

275

250

Pb Free Max with care

Sn Pb Recommended

225

with all Pb-Free soldering systems and are fully

200

reverse compatible with SnPb soldering systems.

A recommended SnPb profile is shown for

comparison; for Pb-Free soldering, IPC/JEDECJ-

STD-020C may be referenced. The upper line in

175

150

125

100

the chart shows the maximum envelope to which

products are qualified (typically 3x reflow cycles

75

at 260ºC max). The center line gives the

50

recommended profile for optimum wettability and

soldering in Pb-Free Systems.

25

0

20

40

60

80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420

Time / secs

Preheat:

The pre-heat stabilizes the part and reduces the

temperature differential prior to reflow. The initial ramp to

125ºC may be rapid, but from that point (2-3)ºC/sec is

recommended to allow ceramic parts to heat uniformly and

plastic encapsulated parts to stabilize through the glass

transition temperature of the body (~ 180ºC).

Wetting Force at 2nd Sec. (higher is better)

0.40

0.30

0.20

SnPb - Sn60Pb40

Sn - Sn60Pb40

0.10

0.00

Sn-Sn3.5Ag0.7Cu

Sn-Sn2.5Ag1Bi0.5Cu

Sn-Sn0.7Cu

-0.10

-0.20

-0.30

-0.40

Reflow:

In the reflow phase, the maximum recommended time

> 230ºC is 40secs. Time at peak reflow is 10secs max.;

optimum reflow is achieved at 250ºC, (see wetting balance

chart opposite) but products are qualified to 260ºC max.

Please reference individual product datasheets for

maximum limits

200

210

220

230

240

250

260

270

Temperature of Solder [C]

IMPORTANT NOTE: Typical Pb-Free reflow solders have a

more dull and grainy appearance compared to traditional

SnPb. Elevating the reflow temperature will not change this,

but extending the cool down can help improve the visual

appearance of the joint.

Cool Down:

Cool down should not be forced and 6ºC/sec is

recommended. A slow cool down will result in a finer grain

structure of the reflow solder in the solder fillet.

WAVE SOLDER PROFILES

For wave solder, there is no change in the recommended

wave profile; all standard Pb-Free (SnCu/SnCuAg) systems

operate at the same 260ºC max recommended for SnPb

systems.

Recommended Soldering Profiles

275

225

175

Preheat:

This is more important for wave solder; a higher

temperature preheat will reduce the thermal shock to SMD

parts that are immersed (please consult individual product

data sheets for SMD parts that are suited to wave solder).

SMD parts should ideally be heated from the bottom-Side

prior to wave. PTH (Pin through hole) parts on the topside

should not be separately heated.

125

Wave

75

Preheat

Cool Down

Wave:

25

250ºC – 260ºC recommended for optimum solderability.

0

50

100

150

200

250

300

350

400

Cool Down:

Time / seconds

As with reflow solder, cool down should not be forced and

6ºC/sec is recommended. Any air knives at the end of the

2nd wave should be heated.

139

Surface Mounting Guide

MLC Chip Capacitors

handling should ensure that abrasion and mechanical shock

are minimized. Taped and reeled components provides the

ideal medium for direct presentation to the placement

machine. Any mechanical shock should be minimized during

handling chip multilayer ceramic capacitors.

APPLICATION NOTES

Storage

The components should be stored in their “as received

packaging” where possible. If the components are removed

from their original packaging then they should be stored in

an airtight container (e.g. a heat sealed plastic bag) with

desiccant (e.g. silica gel). Storage area temperature should

be kept between +5 degrees C and +30 degrees C with

humidity < 70ꢀ RH. Storage atmosphere must be free of

gas containing sulfur and chlorine. Avoid exposing the

product to saline moisture or to temperature changes that

might result in the formation of condensation. To assure

good solderability performance we recommend that the

product be used within 6 months from our shipping date,

but can be used for up to 12 months. Chip capacitors may

crack if exposed to hydrogen (H2) gas while sealed or if

coated with silicon, which generates hydrogen gas.

Preheat

It is important to avoid the possibility of thermal shock during

soldering and carefully controlled preheat is therefore

required. The rate of preheat should not exceed 4°C/second

and a target figure 2°C/second is recommended. Although

an 80°C to 120°C temperature differential is preferred,

recent developments allow a temperature differential

between the component surface and the soldering temper-

ature of 150°C (Maximum) for capacitors of 1210 size and

below with a maximum thickness of 1.25mm. The user is

cautioned that the risk of thermal shock increases as chip

size or temperature differential increases.

Soldering

Solderability

Mildly activated rosin fluxes are preferred. The minimum

amount of solder to give a good joint should be used.

Excessive solder can lead to damage from the stresses

caused by the difference in coefficients of expansion

between solder, chip and substrate. AVX terminations are

suitable for all wave and reflow soldering systems. If hand

soldering cannot be avoided, the preferred technique is the

utilization of hot air soldering tools.

Terminations to be well soldered after immersion in a 60/40

tin/lead solder bath at 235 5°C for 2 1 seconds.

Leaching

Terminations will resist leaching for at least the immersion

times and conditions shown below.

Solder

Tin/Lead/Silver Temp. °C

60/40/0 260

Solder

Immersion Time

Seconds

Termination Type

Cooling

Nickel Barrier

5

30

1

Natural cooling in air is preferred, as this minimizes stresses

within the soldered joint. When forced air cooling is used,

cooling rate should not exceed 4°C/second. Quenching

is not recommended but if used, maximum temperature

differentials should be observed according to the preheat

conditions above.

Lead-Free Wave Soldering

The recommended peak temperature for lead-free wave

soldering is 250°C-260°C for 3-5 seconds. The other

parameters of the profile remains the same as above.

The following should be noted by customers changing from

lead based systems to the new lead free pastes.

Cleaning

a) The visual standards used for evaluation of solder joints

will need to be modified as lead free joints are not as

bright as with tin-lead pastes and the fillet may not be as

large.

Flux residues may be hygroscopic or acidic and must be

removed. AVX MLC capacitors are acceptable for use with

all of the solvents described in the specifications MIL-STD-

202 and EIA-RS-198. Alcohol based solvents are acceptable

and properly controlled water cleaning systems are also

acceptable. Many other solvents have been proven successful,

and most solvents that are acceptable to other components

on circuit assemblies are equally acceptable for use with

ceramic capacitors.

b) Lead-free solder pastes do not allow the same self

alignment as lead containing systems. Standard

mounting pads are acceptable, but machine set up may

need to be modified.

General

Prevention of Metallic Migration

Surface mounting chip multilayer ceramic capacitors

are designed for soldering to printed circuit boards or other

substrates. The construction of the components is such that

they will withstand the time/temperature profiles used in both

wave and reflow soldering methods.

Note that when components with Sn plating on the end

terminations are to be used in applications that are likely to

experience conditions of high humidity under bias voltage,

we strongly recommend that the circuit boards be

conformally coated to protect the Sn from moisture that

might lead to migration and eventual current leakage.

Handling

Chip multilayer ceramic capacitors should be handled with

care to avoid damage or contamination from perspiration

and skin oils. The use of tweezers or vacuum pick ups

is strongly recommended for individual components. Bulk

When using Capacitor Arrays we recommend that there is

no differential in applied voltage between adjacent elements.

140

Surface Mounting Guide

MLC Chip Capacitors

POST SOLDER HANDLING

Once SMP components are soldered to the board, any

bending or flexure of the PCB applies stresses to the

soldered joints of the components. For leaded devices, the

stresses are absorbed by the compliancy of the metal leads

and generally don’t result in problems unless the stress is

large enough to fracture the soldered connection.

Ceramic capacitors are more susceptible to such stress

because they don’t have compliant leads and are brittle in

nature. The most frequent failure mode is low DC resistance

or short circuit. The second failure mode is significant loss

of capacitance due to severing of contact between sets of

the internal electrodes.

Type A:

Angled crack between bottom of device to top of solder jointꢀ

Cracks caused by mechanical flexure are very easily

identified and generally take one of the following two

general forms:

Mechanical cracks are often hidden underneath the

termination and are difficult to see externally. However, if

one end termination falls off during the removal process

from PCB, this is one indication that the cause of failure was

excessive mechanical stress due to board warping.

Type B:

Fracture from top of device to bottom of deviceꢀ

141

Surface Mounting Guide

MLC Chip Capacitors

COMMON CAUSES OF

REWORKING OF MLCS

MECHANICAL CRACKING

Thermal shock is common in MLCs that are manually

attached or reworked with a soldering iron. AVX strongly

recommends that any reworking of MLCs be done with hot

air reflow rather than soldering irons. It is practically

impossible to cause any thermal shock in ceramic

capacitors when using hot air reflow.

The most common source for mechanical stress is board

depanelization equipment, such as manual breakapart, v-

cutters and shear presses. Improperly aligned or dull cutters

may cause torqueing of the PCB resulting in flex stresses

being transmitted to components near the board edge.

Another common source of flexural stress is contact during

parametric testing when test points are probed. If the PCB

is allowed to flex during the test cycle, nearby ceramic

capacitors may be broken.

However direct contact by the soldering iron tip often

causes thermal cracks that may fail at a later date. If rework

by soldering iron is absolutely necessary, it is recommended

that the wattage of the iron be less than 30 watts and the

tip temperature be <300ºC. Rework should be performed

by applying the solder iron tip to the pad and not directly

contacting any part of the ceramic capacitor.

A third common source is board to board connections at

vertical connectors where cables or other PCBs are

connected to the PCB. If the board is not supported during

the plug/unplug cycle, it may flex and cause damage to

nearby components.

Special care should also be taken when handling large (>6"

on a side) PCBs since they more easily flex or warp than

smaller boards.

Preferred Method - No Direct Part Contact

Poor Method - Direct Contact with Part

PCB BOARD DESIGN

To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of board.

However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the MLC is

located.

No Stress Relief for MLCs

Routed Cut Line Relieves Stress on MLC

142

AMERICAS

EUROPE

ASIA-PACIFIC

ASIA-KED

(KYOCERA Electronic Devices)

AVX Greenville, SC

Tel: 864-967-2150

AVX/Japan

Tel: +81-740-32-1250

KED Hong Kong Ltd.

Tel: +852-2305-1080/1223

AVX Limited, England

Tel: +44-1276-697000

AVX/Kyocera (S) Pte Ltd.,

Singapore

KED Hong Kong Ltd.

Shenzen

AVX S.A.S., France

Tel: +33-1-69-18-46-00

Tel: +65-6286-7555

Tel: +86-755-3398-9600

AVX GmbH, Germany

Tel: +49-0811-95949-0

AVX/Kyocera, Asia, Ltd.,

Hong Kong

KED Company Ltd.

Shanghai

Tel: +852-2363-3303

Tel: +86-21-3255-1833

AVX SRL, Italy

Tel: +39-02-614-571

AVX/Kyocera Yuhan Hoesa,

South Korea

KED Hong Kong Ltd.

Beijing

Tel: +86-10-5869-4655

AVX Czech Republic

Tel: +420-57-57-57-521

Tel: +82-2785-6504

AVX/Kyocera HK Ltd.,

Taiwan

Tel: +886-2-2656-0258

KED Taiwan Ltd.

Tel: +886-2-2950-0268

AVX/ELCO UK

Tel: +44-1638-675000

KED Korea Yuhan

ELCO Europe GmbH

Tel: +49-2741-299-0

AVX/Kyocera (M) Sdn Bhd,

Malaysia

Hoesa, South Korea

Tel: +82-2-783-3604/6126

Tel: +60-4228-1190

AVX S.A., Spain

Tel: +34-91-63-97-197

KED (S) Pte Ltd.

Singapore

Tel: +65-6509-0328

AVX/Kyocera International

Trading Co. Ltd.,

Shanghai

AVX Benelux

Tel: +31-187-489-337

Tel: +86-21-3255 1933

Kyocera Corporation

Japan

Tel: +81-75-604-3449

AVX/Kyocera Asia Ltd.,

Shenzen

Tel: +86-755-3336-0615

AVX/Kyocera International

Trading Co. Ltd.,

Beijing

Tel: +86-10-6588-3528

AVX/Kyocera India

Liaison Office

Tel: +91-80-6450-0715

Contact:

A KYOCERA GROUP COMPANY

http://www.avx.com

S-MLCC1117-C


型号：	LD173C102MAB4V
厂家：	KYOCERA AVX
描述：	Low Inductance Cap
文件：	总144页 (文件大小：2512K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LD173C102MAB4V [KYOCERA AVX]

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